ASE — Supply Chain & Business Relationships
Every relationship below is sourced to a verbatim quote from a public company filing that names the counterparty, with a one-click link to the original document.
Click a company to open its map · drag to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · purple = ownership · grey dashed = suspended · how to read this data.
9 suppliers7 customers2 partners2 competitors12 source filings
Featured in supply-chain maps: Semiconductor Foundries & Advanced Packaging
Where it sits in the AI-server chain
The stages where a filing quote places this company on the AI-server chain.
Customers (companies it supplies)
Filed 2026-02-13 · 189 days ago
“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”— LSCC 10-K, filed 2026-02-13 EDGAR · View source filing ↗
Supplies to →
Credo
Filed 2026-06-15 · 67 days ago
“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗
Supplies to →
Cirrus Logic
Filed 2026-05-21 · 92 days ago
“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”— CRUS 10-K, filed 2026-05-21 EDGAR · View source filing ↗
Supplies to →
UMC
Filed 2026-04-30 · 113 days ago
“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Astera Labs
Filed 2026-02-20 · 182 days ago
“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”— ALAB 10-K, filed 2026-02-20 EDGAR · View source filing ↗
Supplies to →
Broadcom
Filed 2025-12-18 · 246 days ago
“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”— AVGO 10-K, filed 2025-12-18 EDGAR · View source filing ↗
Supplies to →
Qualcomm
Filed 2025-11-05 · 289 days ago
“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”— QCOM 10-K, filed 2025-11-05 EDGAR · View source filing ↗
Suppliers (companies that supply it)
Filed 2026-04-01 · 142 days ago
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Filed 2026-04-01 · 142 days ago
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
All Ring Tech
Filed 2026-04-01 · 142 days ago
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Marketech Lnternational
Filed 2026-04-01 · 142 days ago
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Grand Process Technology
Filed 2026-04-01 · 142 days ago
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Lam Research
Filed 2026-04-01 · 142 days ago
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Teradyne
Filed 2026-04-01 · 142 days ago
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Advantest
Filed 2026-04-01 · 142 days ago
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Supplied by ←
Besi
Last confirmed 2024-12-31 · 598 days ago · corroborated by 2 filings
“Our customers are primarily leading multinational chip manufacturers, foundries, assembly subcontractors and electronics and industrial companies and include Amkor, ASE, Foxconn, Infineon, InnoLight, Intel, LG Innotek, Micron, Nvidia, NXP, STMicroelectronics, Texas Instruments and TSMC.”— BE Semiconductor Industries N.V. Annual report (ESEF), filed 2024-12-31 ESEF · View source filing ↗
Partners & collaborations
Partners with ↔
TSMC
Filed 2026-04-01 · 142 days ago
“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Partners with ↔
Alphawave
Filed 2024-12-31 · 598 days ago
“Additionally, highly strategic partnerships include major advanced node foundries – TSMC and Samsung and major OSATs – ASE, Amkor, Kyocera, JCET and SPIL.”— Alphawave IP Group plc Annual report (ESEF), filed 2024-12-31 UKSEF · View source filing ↗
Competitors
Competes with ↔
TSMC
Filed 2026-04-01 · 142 days ago
“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
Competes with ↔
Amkor
Filed 2026-02-20 · 182 days ago
“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”— AMKR 10-K, filed 2026-02-20 EDGAR · View source filing ↗
Filed activity
Filings by ASE itself, from our archive: US SEC earnings filings (Form 8-K Item 2.02 and Form 6-K results reports) since 2025-07-22, plus Taiwan Stock Exchange material announcements where covered. Not a complete filing history; subjects appear verbatim in their original language.
— Form 6-K · US SEC EDGAR · View source filing ↗
2026-07-30Earnings releaseASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Second Quarter of 2026
Taipei, July 30, 2026 – ASE Technology Holding Co., Ltd. (T W SE: 3711, NYSE: ASX) (“We”, “ASEH”, or the “Company”) , the leading provider of semiconductor assembly and testing services (“ATM”) and the provider of electronic manufacturing services (“EMS”), today reported its unaudited 1 net revenues of NT$191,064 million for 2Q26, up by 26.7% year-over-year and up by 10.0% sequentially.Show more from the filing
Net income attributable to shareholders of the parent for the quarter totaled NT$21,068 million, up from NT$7,521 million in 2Q25 and up from NT$14,132 million in 1Q26. Basic earnings per share for the quarter were NT$4.80 (or US$0.304 per ADS), compared to NT$1.74 for 2Q25 and NT$3.23 for 1Q26. Diluted earnings per share for the quarter were NT$4.61 (or US$0.292 per ADS), compared to NT$1.70 for 2Q25 and NT$3.08 for 1Q26. RESULTS OF OPERATIONS 2Q26 Results Highlights – Consolidated l Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 52%, 13%, 34%, and 1% of the total net revenues for the quarter, respectively. l Cost of revenues was NT$150,914 million for the quarter, up from NT$138,844 million in 1Q26.
— Form 6-K · US SEC EDGAR · View source filing ↗
2026-04-29Earnings releaseASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the First Quarter of 2026
Taipei, April 29, 2026 – ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX) (“We”, “ASEH”, or the “Company”), the leading provider of semiconductor assembly and testing services (“ATM”) and the provider of electronic manufacturing services (“EMS”), today reported its unaudited 1 net revenues of NT$173,662 million for 1Q26, up by 17.2% year-over-year and down by 2.4% sequentially.Show more from the filing
Net income attributable to shareholders of the parent for the quarter totaled NT$14,148 million, up from NT$7,554 million in 1Q25 and down from NT$14,713 million in 4Q25. Basic earnings per share for the quarter were NT$3.24 (or US$0.205 per ADS), compared to NT$1.75 for 1Q25 and NT$3.37 for 4Q25. Diluted earnings per share for the quarter were NT$3.08 (or US$0.195 per ADS), compared to NT$1.64 for 1Q25 and NT$3.24 for 4Q25. RESULTS OF OPERATIONS 1Q26 Results Highlights – Consolidated l Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 51%, 12%, 36%, and 1% of the total net revenues for the quarter, respectively. l Cost of revenues was NT$138,812 million for the quarter, down from NT$143,179 million in 4Q25.
— Form 6-K · US SEC EDGAR · View source filing ↗
2026-02-05Earnings releaseASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Fourth Quarter
and the Full Year of 2025 Taipei, February 5, 2026 – ASE Technology Holding Co., Ltd.Show more from the filing
(T W SE: 3711, NYSE: ASX) (“We”, “ASEH”, or the “Company”) , the leading provider of semiconductor assembly and testing services (“ATM”) and the provider of electronic manufacturing services (“EMS”), today reported its unaudited 1 net revenues of NT$ 177,915 million for 4Q25, up by 9.6% year-over-year and up by 5.5% sequentially. Net income attributable to shareholders of the parent for the quarter totaled NT$14,713 million, up from NT$9,312 million in 4Q24 and up from NT$10,870 million in 3Q25. Basic earnings per share for the quarter were NT$3.37 (or US$0.219 per ADS), compared to NT$2.15 for 4Q24 and NT$2.50 for 3Q25. Diluted earnings per share for the quarter were NT$3.24 (or US$0.210 per ADS), compared to NT$2.07 for 4Q24 and NT$2.41 for 3Q25. For the full year of 2025, the Company reported unaudited net revenues of NT$645,388 million and net income attributable to shareholders of the parent of NT$40,658 million. Basic earnings per share for the full year of 2025 were NT$9.37 (or US$0.601 per ADS). Diluted earnings per share for the full year of 2025 were NT$8.89 (or US$0.571 per ADS).
— Form 6-K · US SEC EDGAR · View source filing ↗
2025-10-30Earnings releaseASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Third Quarter of 2025
Taipei, October 30, 2025 – ASE Technology Holding Co., Ltd. (T W SE: 3711, NYSE: ASX) (“We”, “ASEH”, or the “Company”) , the leading provider of semiconductor assembly and testing services (“ATM”) and the provider of electronic manufacturing services (“EMS”), today reported its unaudited 1 net revenues of NT$ 168,569 million for 3Q25, up by 5.3% year-over-year and up by 11.8% sequentially.Show more from the filing
Net income attributable to shareholders of the parent for the quarter totaled NT$10,870 million, up from NT$9,733 million in 3Q24 and up from NT$7,521 million in 2Q25. Basic earnings per share for the quarter were NT$2.50 (or US$0.168 per ADS), compared to NT$2.25 for 3Q24 and NT$1.74 for 2Q25. Diluted earnings per share for the quarter were NT$2.41 (or US$0.162 per ADS), compared to NT$2.18 for 3Q24 and NT$1.70 for 2Q25. RESULTS OF OPERATIONS 3Q25 Results Highlights – Consolidated l Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 47%, 11%, 41%, and 1% of the total net revenues for the quarter, respectively. l Cost of revenues was NT$139,692 million for the quarter, up from NT$125,063 million in 2Q25.
— Form 6-K · US SEC EDGAR · View source filing ↗
2025-10-21Cooperation announcement代子公司ASE ELECTRONICS (M) SDN. BHD.公告與LINEAR TECHNOLOGY PTE LTD.簽署「交易備忘錄」
1.事實發生日:114/10/21 2.契約或承諾相對人:Linear Technology Pte Ltd. 3.與公司關係:非關係人 4.契約或承諾起迄日期（或解除日期）:114/10/21 5.主要內容（解除者不適用）: 本公司於馬來西亞設立之子公司ASE Electronics (M) Sdn. Bhd.（下稱「ASE Electronics」）與Analog Devices, Inc. 子公司 Linear Technology Pte Ltd.（下稱「Linear」）簽署 「交易備忘錄」，約定由ASE Electronics 與Linear善意協商 股份買賣契約條款，由ASE Electronics向Linear購買其馬來西亞 子公司Analog Devices Sdn. Bhd.百分之百股權。 6.限制條款（解除者不適用）:依合約規定。Show more from the filing
7.承諾事項（解除者不適用）:依合約規定。 8.其他重要約定事項（解除者不適用）:依合約規定。 9.對公司財務、業務之影響: 本交易有助於強化日月光集團全球供應鏈韌性、擴展生產基地， 以及深化日月光集團與Analog Devices, Inc.的長期供應暨合作 關係，故對於日月光集團之長期財務狀況及業務發展應具正面影響。 10.具體目的: 強化日月光集團全球供應鏈韌性並擴展生產基地，深化日月光集團 與Analog Devices, Inc.的長期供應暨合作關係。 11.其他應敘明事項(若事件發生或決議之主體係屬公開發行以上公司，本則重大訊息同時 符合證券交易法施行細則第7條第8款所定對股東權益或證券價格有重大影響之事項): 本交易尚待ASE Electronics與Linear簽署正式「股份買賣契約」後始進 行，最終交易條件將於股份買賣契約中約定，本公司將依法辦理後續公告。
— TWSE MOPS material announcement (第10款) · MOPS query page ↗
2025-07-31Earnings releaseASE Technology Holding Co., Ltd. Reports Its Unaudited Consolidated Financial Results for the Second Quarter of 2025
Taipei, July 31, 2025 – ASE Technology Holding Co., Ltd. (T W SE: 3711, NYSE: ASX) (“We”, “ASEH”, or the “Company”) , the leading provider of semiconductor assembly and testing services (“ATM”) and the provider of electronic manufacturing services (“EMS”), today reported its unaudited 1 net revenues of NT$ 150,750 million for 2Q25, up by 7.5% year-over-year and up by 1.8% sequentially.Show more from the filing
Net income attributable to shareholders of the parent for the quarter totaled NT$7,521 million, down from NT$7,778 million in 2Q24 and down from NT$7,554 million in 1Q25. Basic earnings per share for the quarter were NT$1.74 (or US$0.111 per ADS), compared to NT$1.80 for 2Q24 and NT$1.75 for 1Q25. Diluted earnings per share for the quarter were NT$1.70 (or US$0.109 per ADS), compared to NT$1.75 for 2Q24 and NT$1.64 for 1Q25. RESULTS OF OPERATIONS 2Q25 Results Highlights – Consolidated l Net revenues from packaging operations, testing operations, EMS operations, and others represented approximately 49%, 11%, 39%, and 1% of the total net revenues for the quarter, respectively. l Cost of revenues was NT$125,063 million for the quarter, up from NT$123,260 million in 1Q25.
— Form 6-K · US SEC EDGAR · View source filing ↗