TSMC — Supply Chain & Business Relationships

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 EDGAR · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“Secured TSMC buffer inventory for customers through 2029+ to ensure smooth foundry transition and prepare for AI ramp”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“ASPEED Technology’s 8th-generation server management chips (AST2700 / AST2720 / AST2750), developed using TSMC’s advanced process technology, are about to enter mass production.”

— ASPEED Technology Annual report, filed 2026-05-28 TWSE (English translation of the Chinese original) · View source filing ↗

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K, filed 2026-05-21 EDGAR · View source filing ↗

“Our primary fab partners currently include UMC, PSL, Tower and TSMC.”

— ALGM 10-K, filed 2026-05-21 EDGAR · View source filing ↗

“In 2025 , we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K, filed 2026-02-25 EDGAR · View source filing ↗

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

— ALAB 10-K, filed 2026-02-20 EDGAR · View source filing ↗

“We partner with Taiwan Semiconductor Manufacturing Company ("TSMC") to develop and manufacture on 16nm technology, which is used in our Avant and Nexus 2 platforms of FPGA products, and to manufacture our 350nm, 130nm, 55nm and 40nm products.”

— LSCC 10-K, filed 2026-02-13 EDGAR · View source filing ↗

“We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (“TSMC”) and Semiconductor Manufacturing International Corporation (“SMIC”) to manufacture the majority of our semiconductor wafers.”

— SLAB 10-K, filed 2026-02-10 EDGAR · View source filing ↗

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”

— AVGO 10-K, filed 2025-12-18 EDGAR · View source filing ↗

“We currently source more than half of our wafer requirements annually from third-party wafer fabrication foundries, such as Taiwan Semiconductor Manufacturing Company (TSMC) and others”

— ADI 10-K, filed 2025-11-25 EDGAR · View source filing ↗

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K, filed 2025-11-05 EDGAR · View source filing ↗

“We outsource the production of our semiconductors to the leading companies in the industry, such as TSMC.”

— Alphawave IP Group plc Annual report (ESEF), filed 2024-12-31 UKSEF · View source filing ↗

“For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited”

— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗

“In 2025 , we had total purchases of NT$ 878 million (US$ 28 million) from VIS, representing 0.1% of our total cost of revenue”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗

“In 2025 , we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue.”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗

“In 2025 , we incurred total manufacturing expenses of NT$ 5,448 million (US$ 174 million) from Xintec, representing 0.4% of our total cost of revenue.”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗

“なお、主な相手先別の販売実績及び当該販売実績の総販売実績に対する割合は以下のとおりであります。 … Taiwan Semiconductor Manufacturing Company Ltd. 315,813 12.9”

— Tokyo Electron Limited Annual securities report, filed 2026-03-31 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

“3. Major customer information (Millions of yen) Name of customer Net sales Samsung Electronics Co., Ltd. 368,079 Taiwan Semiconductor Manufacturing Company Ltd. 315,813 (Note) The amount includes sales to the customer and its subsidiaries.”

— Tokyo Electron Consolidated Financial Statements FY2026 (official English translation) · View source filing ↗

(Official English translation published by the company; the Japanese original prevails)

“当連結会計年度において、外部顧客への売上高のうち連結損益計算書の売上高の10%以上を占める顧客 グループはNVIDIAグループ及びTaiwan Semiconductor Manufacturing Co., Ltd.であり、関連するセグメ ントは、いずれも主にテストシステム事業であります。”

— Advantest Corporation Annual securities report, filed 2026-03-31 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

“The customer groups that accounted for 10% or more of the net sales were the NVIDIA Group and Taiwan Semiconductor Manufacturing Co., Ltd. for the fiscal year ended March 31, 2026.”

— Advantest Annual Securities Report and Business Report, 84th fiscal year (official English translation) · View source filing ↗

(Official English translation published by the company; the Japanese original prevails)

“３．主要な顧客ごとの情報 （単位：百万円） 顧客の名称又は氏名 売上高 Taiwan Semiconductor Manufacturing Company Ltd. (注) 48,240 売上高には、当該顧客と同一の企業集団に属する顧客に対する売上高を含めております。”

— DISCO Corporation Annual securities report, filed 2026-03-31 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

“３．主要な顧客ごとの情報 （単位：百万円） 顧客の名称又は氏名 売上高 Taiwan Semiconductor Manufacturing Company, Ltd. 関連するセグメント名 88,507 ＳＰＥ”

— SCREEN Holdings Co., Ltd. Annual securities report, filed 2026-03-31 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

“we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award”

— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Taiwan Semiconductor Manufacturing Company Ltd. * * 10.4 % * * * * *”

— FORM 10-K, filed 2026-02-20 EDGAR · View source filing ↗

“Received 2025 TSMC Excellent Performance Awards for Excellent Technology Development and Production Support and Excellent Contribution in Green Manufacturing.”

— AMAT 8-K, filed 2026-02-12 EDGAR · View source filing ↗

“Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16%”

— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗

“2025 waren unsere drei größten Kunden, in alphabetischer Reihenfolge, Intel Corporation, Samsung Electronics und Taiwan Semiconductor Manufacturing Company (TSMC).”

— Siltronic AG Annual report (Geschäftsbericht), filed 2025-12-31 (German statutory annual report; quote in the original German) · View source filing ↗

“In 2025, our three largest customers were (in alphabetical order) Intel Corporation, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC).”

— Siltronic Annual Report 2025 (company's own English edition) · View source filing ↗

(Official English translation published by the company; the German original prevails)

“Announced that the NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPU is coming to the world’s most popular enterprise servers; Disney, Foxconn, Hitachi Ltd., Hyundai Motor Group, Lilly, SAP and TSMC are among the first to adopt the servers.”

— NVDA 8-K, filed 2025-08-27 EDGAR · View source filing ↗

“当連結会計年度及び前連結会計年度における主な相手先別の販売実績及び当該販売実績の総販売実績に対する 割合は次のとおりであります。 … Taiwan Semiconductor Manufacturing Company Limited”

— Lasertec Corporation Annual securities report, filed 2025-06-30 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

“Our customers are primarily leading multinational chip manufacturers, foundries, assembly subcontractors and electronics and industrial companies and include Amkor, ASE, Foxconn, Infineon, InnoLight, Intel, LG Innotek, Micron, Nvidia, NXP, STMicroelectronics, Texas Instruments and TSMC.”

— BE Semiconductor Industries N.V. Annual report (ESEF), filed 2024-12-31 ESEF · View source filing ↗

“Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan.”

— TSM 6-K, filed 2026-08-11 EDGAR · View source filing ↗

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K, filed 2026-02-19 EDGAR · View source filing ↗

“A new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.”

— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“Additionally, highly strategic partnerships include major advanced node foundries – TSMC and Samsung and major OSATs – ASE, Amkor, Kyocera, JCET and SPIL. … We are a founding partner of the TSMC 3DFabric™ Alliance”

— Alphawave IP Group plc Annual report (ESEF), filed 2024-12-31 UKSEF · View source filing ↗

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“In October 2024, we acquired additional shares in VIS’ capital increase transaction.”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗

“In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services.”

— TSM 20-F, filed 2026-04-16 EDGAR · View source filing ↗