Semiconductor Foundries & Advanced Packaging — Supply-Chain Map

“For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited”

— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗

“In Q2 FY26, we expect inventory to decrease as we continue to fulfill demand and manage our wafer purchase commitments per our long-term capacity agreement with GlobalFoundries.”

— CRUS 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“The primary raw material for Faraday ’s products is silicon wafers. Our principal supplier is UMC, a professional wafer foundry.”

— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K, filed 2026-05-08 EDGAR · View source filing ↗

“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”

— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗

“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”

— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗

“If we are unable to obtain 300mm SOI wafers from Soitec S.A. (“Soitec”), our primary supplier, for any reason, we expect that it would take us an extended period to find a replacement supplier on commercially acceptable terms.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”

— LSCC 10-K, filed 2026-02-13 EDGAR · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 EDGAR · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 EDGAR · View source filing ↗

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K, filed 2025-11-05 EDGAR · View source filing ↗

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K, filed 2025-08-08 EDGAR · View source filing ↗

Not re-confirmed in the filer’s latest annual report (Form 10-K filed 2026-08-06): not mentioned in it.

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗

“Secured TSMC buffer inventory for customers through 2029+ to ensure smooth foundry transition and prepare for AI ramp”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“IP revenue grew more than 40% year-over-year, driven by strong demand for Cadence’s Star IP portfolio, highlighted by a significant agreement with Intel and additional wins with leading semiconductor companies”

— CDNS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“Vector Core Compute (VC2) unveiled a disaggregated agentic cloud combining Intel® Xeon® processors, SambaNova RDUs and NVIDIA Blackwell GPUs”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel expanded its purpose-built silicon business beyond networking and IPUs through a strategic collaboration with Fortinet to develop Fortinet Security Processor 6 using Intel's advanced design, packaging and manufacturing capabilities.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“Sony Semiconductor Solutions Corporation (“Sony”) and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) (TWSE: 2330, NYSE: TSM) today announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (“JV”) in Koshi City, Kumamoto Prefecture, Japan.”

— TSM 6-K, filed 2026-08-11 EDGAR · View source filing ↗

“Intel and Google announced a multiyear collaboration for continued deployment of Intel ® Xeon ® processors across Google’s workload-optimized instances, including the latest Intel ® Xeon ® 6 processors powering C4 and N4 instances. … The collaboration also includes co-development of custom ASIC infrastructure processing units (IPUs) designed to improve utilization, reduce complexity, and scale AI workloads more efficiently.”

— INTC 8-K, filed 2026-04-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗

“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”

— NVTS 10-K, filed 2026-02-27 EDGAR · View source filing ↗

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K, filed 2026-02-19 EDGAR · View source filing ↗

“Announced a collaboration with Intel to jointly develop multiple generations of custom data center and PC products with NVIDIA NVLink.”

— NVDA 8-K, filed 2025-11-19 EDGAR · View source filing ↗

“GIGABYTE has formed strategic partnerships with major suppliers such as Intel, AMD, and NVIDIA”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“The Company continues to deepen cooperation with AMD, Intel, and NVIDIA”

— Chenbro Micom Annual report, filed 2026-05-29 TWSE (English translation of the Chinese original) · View source filing ↗

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗

“These engagements build upon the previously announced partnership with Samsung Electronics.”

— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗

“A new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.”

— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Competitors in the market for optical manufacturing services include Benchmark Electronics, Inc., Celestica Inc., InnoLight Technology (Suzhou) Ltd., Jabil Inc., Sanmina Corporation, Venture Corporation Limited and Eoptolink Technology Inc., Ltd.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Our customized optics and glass operations face competition from companies such as CASTECH Inc., Excelitas Technologies Corp. and Photop Technologies, Inc. (a subsidiary of Coherent Corp.).”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“Our major competitors in the DRAM market include Samsung Electronics Co., Ltd. (“Samsung Electronics”), Micron Technology, Inc. (“Micron Technology”) and ChangXin Memory Technologies (“CXMT”).”

— SKHY F-1/A, filed 2026-07-06 EDGAR · View source filing ↗

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K, filed 2026-02-25 EDGAR · View source filing ↗

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K, filed 2026-02-25 EDGAR · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 EDGAR · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 EDGAR · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 EDGAR · View source filing ↗

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K, filed 2026-02-09 EDGAR · View source filing ↗