Semiconductor Foundries & Advanced Packaging — Supply-Chain Map

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“If we are unable to obtain 300mm SOI wafers from Soitec S.A. (“Soitec”), our primary supplier, for any reason, we expect that it would take us an extended period to find a replacement supplier on commercially acceptable terms.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”

— LSCC 10-K, filed 2026-02-13 · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 · View source filing ↗

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K, filed 2026-02-11 · View source filing ↗

“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K, filed 2025-11-05 · View source filing ↗

“Accounts receivable from individual customers representing 10% or more of accounts receivable as of June 27, 2025 and June 28, 2024, respectively, were as follows: … Nokia Corporation (1) 12.0 % 19.3 %”

— FN 10-K, filed 2025-08-19 · View source filing ↗

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K, filed 2025-08-08 · View source filing ↗

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K, filed 2025-08-08 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K, filed 2026-05-21 · View source filing ↗

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K, filed 2026-05-21 · View source filing ↗

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K, filed 2026-05-21 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”

— NVTS 10-K, filed 2026-02-27 · View source filing ↗

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K, filed 2026-02-19 · View source filing ↗

“In May 2026, SSS and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) entered into a non-binding memorandum of understanding to pursue a strategic partnership for the development and manufacturing of next-generation image sensors.”

— SONY 20-F, filed 2026-06-18 · View source filing ↗

“we currently have patent cross-licensing agreements with several companies, including International Business Machines Corporation, or IBM.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In December 2025, we signed a MOU with Polar Semiconductor, LLC to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace and defense.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We and Cadence Design Systems collaborate on certification of analog/mixed-signal flow for 28HPC+ process.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F, filed 2026-04-01 · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“the joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F, filed 2026-02-26 · View source filing ↗

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F, filed 2026-04-01 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 · View source filing ↗

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K, filed 2026-02-20 · View source filing ↗

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K, filed 2026-02-09 · View source filing ↗

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“including at one of our key foundry competitors, TSMC”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“We also compete with Broadcom in the custom ASICs development market”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“one of three companies (the others being TSMC and Samsung) investing in 2nm lithography”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K, filed 2026-01-23 · View source filing ↗