UMC — Supply Chain & Business Relationships
Every relationship below is sourced to a verbatim quote from a public company filing that names the counterparty, with a one-click link to the original document.
Click a company to open its map · drag to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · purple = ownership · grey dashed = suspended · how to read this data.
10 suppliers12 customers7 partners2 competitors3 ownership ties7 source filings
Featured in supply-chain maps: Semiconductor Foundries & Advanced Packaging
Where it sits in the AI-server chain
The stages where a filing quote places this company on the AI-server chain.
Customers (companies it supplies)
Last confirmed 2026-05-25 · 88 days ago · corroborated by 2 filings
“The primary raw material for Faraday ’s products is silicon wafers. Our principal supplier is UMC, a professional wafer foundry.”— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗
Filed 2026-02-11 · 191 days ago
“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”— SITM 10-K, filed 2026-02-11 EDGAR · View source filing ↗
Supplies to →
Allegro MicroSystems
Filed 2026-05-21 · 92 days ago
“Our primary fab partners currently include UMC, PSL, Tower and TSMC.”— ALGM 10-K, filed 2026-05-21 EDGAR · View source filing ↗
Supplies to →
Texas Instruments
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Intel
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
MediaTek
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Realtek
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Novatek
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Silicon Integrated Systems
Filed 2026-04-30 · 113 days ago
“We provide foundry services to these fabless design companies … Silicon Integrated Systems Corp.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Hejian Technology Suzhou
Filed 2026-04-30 · 113 days ago
“UMC licensed its 0.13um process technology to Hejian Technology (Suzhou) Co., Ltd.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
United Semiconductor Xiamen
Filed 2026-04-30 · 113 days ago
“UMC licensed its 28nm process technology to United Semiconductor (Xiamen) Co., Ltd. … UMC licensed its 80/90nm process technology to United Semiconductor (Xiamen) Co., Ltd.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplies to →
Lattice
Filed 2026-02-13 · 189 days ago
“Lattice partners with United Microelectronics Corporation ("UMC") and its subsidiary United Semiconductor Japan Corporation ("USJC") to manufacture our products on its 130nm, 90nm, 65nm, and 40nm CMOS process technologies, as well as embedded flash memory in these process nodes.”— LSCC 10-K, filed 2026-02-13 EDGAR · View source filing ↗
Suppliers (companies that supply it)
Supplied by ←
Shin-Etsu
Filed 2026-04-30 · 113 days ago
“The principal makers for our wafers are Shin-Etsu, GlobalWafers, Sumco Group and Soitec.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
GlobalWafers
Filed 2026-04-30 · 113 days ago
“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
Sumco
Filed 2026-04-30 · 113 days ago
“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
Formosa Sumco Technology
Filed 2026-04-30 · 113 days ago
“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
Soitec
Filed 2026-04-30 · 113 days ago
“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
Imec
Filed 2026-04-30 · 113 days ago
“On December 8, 2025, we announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate our silicon photonics roadmap.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
Fengmiao I Offshore Wind Farm
Filed 2026-04-30 · 113 days ago
“we entered into a corporate power purchase agreement (“CPPA”) with Fengmiao I Offshore Wind Farm”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
SPIL
Filed 2026-04-30 · 113 days ago
“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
ASE
Filed 2026-04-30 · 113 days ago
“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ←
IBM
Filed 2026-04-30 · 113 days ago
“IBM licensed its 20nm CMOS and FinFET technology to UMC”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Partners & collaborations
Last confirmed 2026-04-30 · 113 days ago · corroborated by 2 filings
“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Filed 2026-04-30 · 113 days ago
“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Partners with ↔
Faraday Technology
Filed 2026-05-25 · 88 days ago
“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”— Faraday Technology Annual report, filed 2026-05-25 TWSE (English translation of the Chinese original) · View source filing ↗
Partners with ↔
IBM
Filed 2026-04-30 · 113 days ago
“We also joined the IBM chip alliance, for advanced process development. … We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Partners with ↔
Polar Semiconductor
Filed 2026-04-30 · 113 days ago
“In December 2025, we signed a MOU with Polar Semiconductor, LLC to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace and defense.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Partners with ↔
Cadence
Filed 2026-04-30 · 113 days ago
“We and Cadence Design Systems collaborate on certification of analog/mixed-signal flow for 28HPC+ process.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Partners with ↔
Broadcom
Filed 2026-04-30 · 113 days ago
“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Competitors
Competes with ↔
GlobalFoundries
Filed 2026-02-27 · 175 days ago
“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗
Competes with ↔
Intel
Filed 2026-01-23 · 210 days ago
“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗
Ownership & investments
Filed 2026-04-30 · 113 days ago
“Bargain purchase gain, which is derived from the acquisition of significant influence over SILICON INTEGRATED SYSTEMS CORP. (SIS).”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Invests in →
Faraday Technology
Filed 2026-04-30 · 113 days ago
“On March 22, 2024, our board approved capital injection of up to NT$800 million in Faraday Technology Corp. to participate in its capital increase.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Invests in →
Unimicron
Filed 2026-04-30 · 113 days ago
“On December 17, 2025, our board approved capital injection of up to NT$700 million in Unimicron Technology Corp. to participate in its capital increase.”— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Filed activity
Filings by UMC itself, from our archive: US SEC earnings filings (Form 8-K Item 2.02 and Form 6-K results reports) since 2025-07-22, plus Taiwan Stock Exchange material announcements where covered. Not a complete filing history; subjects appear verbatim in their original language.
2026 CAPEX raised to US$2bn to support phased expansion plan Q2 2026 operating income increases 32.6% QoQ while Q3 utilization to exceed 90% Second Quarter 2026 Overview: ‧Revenue: NT$68.73 billion (US$2.18 billion) ‧Gross margin: 32.5%;Show more from the filing
Operating margin: 21.8% ‧Revenue from 22/28nm: 37% ‧Capacity utilization rate: 85% ‧Net income attributable to shareholders of the parent: NT$42.26 billion (US$1.34 billion) ‧Earnings per share: NT$3.39; earnings per ADS: US$0.537 Taipei, Taiwan, ROC – July 29, 2026 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the second quarter of 2026. Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. Compared to a year ago, 2Q26 revenue increased 17.0%. Consolidated gross margin for 2Q26 was 32.5%. Net income attributable to the shareholders of the parent was NT$42.26 billion, with earnings per ordinary share of NT$3.39.
— Form 6-K · US SEC EDGAR · View source filing ↗
Business traction on 22nm continues to gain momentum, accounting for 14% of Q1 revenue Expect Q2 wafer shipments to grow by high single digit First Quarter 2026 Overview: ‧Revenue: NT$61.04 billion (US$1.93 billion) ‧Gross margin: 29.2%;Show more from the filing
Operating margin: 18.5% ‧Revenue from 22/28nm: 34% ‧Capacity utilization rate: 79% ‧Net income attributable to shareholders of the parent: NT$16.17 billion (US$511 million) ‧Earnings per share: NT$1.29; earnings per ADS: US$0.204 Taipei, Taiwan, ROC – April 29, 2026 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the first quarter of 2026. First quarter consolidated revenue was NT$61.04 billion, decreasing 1.2% from NT$61.81 billion in 4Q25. Compared to a year ago, 1Q26 revenue increased 5.5%. Consolidated gross margin for 1Q26 was 29.2%. Net income attributable to the shareholders of the parent was NT$16.17 billion, with earnings per ordinary share of NT$1.29.
— Form 6-K · US SEC EDGAR · View source filing ↗
Full-year 22nm revenue increases 93% YoY, reaching record high in Q4 2025 2025 earnings per share of NT$3.34 Fourth Quarter 2025 Overview: ‧Revenue: NT$61.81 billion (US$1.97 billion) ‧Gross margin: 30.7%;Show more from the filing
Operating margin: 19.8% ‧Revenue from 22/28nm: 36% ‧Capacity utilization rate: 78% ‧Net income attributable to shareholders of the parent: NT$10.06 billion (US$320 million) ‧Earnings per share: NT$0.81; earnings per ADS: US$0.129 Taipei, Taiwan, ROC – January 28, 2026 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the fourth quarter of 2025. Fourth quarter consolidated revenue was NT$61.81 billion, increasing 4.5% from NT$59.13 billion in 3Q25. Compared to a year ago, 4Q25 revenue increased 2.4%. Consolidated gross margin for 4Q25 was 30.7%. Net income attributable to the shareholders of the parent was NT$10.06 billion, with earnings per ordinary share of NT$0.81. Jason Wang, co-president of UMC, said, “In the fourth quarter, our results were in line with guidance, with flattish wafer shipments amid mild demand across most markets.
— Form 6-K · US SEC EDGAR · View source filing ↗
1.事實發生日:114/12/04 2.契約或承諾相對人: Polar Semiconductor, LLC (下稱 ”Polar”) 3.與公司關係:無 4.契約或承諾起迄日期（或解除日期）:雙方於114/12/04簽署合作備忘錄(MOU) 5.主要內容（解除者不適用）:本公司與美國晶圓代工廠 Polar簽署合作備忘錄(MOU)， 雙方將展開洽談，共同探索在美國本土八吋晶圓製造的合作機會。 6.限制條款（解除者不適用）:無 7.承諾事項（解除者不適用）:無 8.其他重要約定事項（解除者不適用）:無 9.對公司財務、業務之影響: 本合作備忘錄係確認雙方合作共識，目前對公司財務及業務尚未產生重大影響。 雙方若簽署正式合約，其合作細節及內容，悉以本公司發布之重大訊息為準。 10.具體目的:提升公司對全球政經環境變化的韌性，以回應客戶對美國本土半導體製造 方案的需求。Show more from the filing
11.其他應敘明事項(若事件發生或決議之主體係屬公開發行以上公司，本則重大訊息同時 符合證券交易法施行細則第7條第8款所定對股東權益或證券價格有重大影響之事項): 聯華電子與Polar攜手合作強化美國半導體在地製造能力 聯華電子今(12/4)日宣布與專攻高壓、功率及感測半導體的美國晶圓代工廠 Polar Semiconductor, LLC (Polar)簽署合作備忘錄(MOU)，雙方將展開洽談，共同探索在 美國本土八吋晶圓製造的合作機會，以因應車用、資料中心、消費電子，以及航太與 國防等關鍵產業持續成長的需求。 根據MOU，Polar與聯電將評估可在Polar近期擴建的明尼蘇達州八吋廠所生產的產品， 並選定具體的生產項目。結合Polar穩健的製造能力，與聯電完整的八吋技術組合及 全球客戶基礎，這項合作可望推動雙方業務成長，並協助客戶實現多元製造布局。 此外，此合作也將進一步強化美國本土的八吋晶圓製造量能，確保汽車、電網、機器人 製造、資料中心等產業所需的關鍵功率半導體能夠在美國穩定供應，降低地緣政治之潛 在風險，提升對全球政經環境變化的韌性。 Polar行銷副總經理 Ken Obuszewski 表示：「此次合作呼應Polar致力滿足本土半導體 製造日益增長的需求，包含來自美國及全球客戶尋求在地化供應的趨勢。憑藉我們與客 戶深厚的合作關係及強大的專業技術組合，與聯電的合作再次證明Polar有能力成為專注 於功率及感測領域、具價值的專業晶圓代工夥伴。」 聯電全球業務資深副總經理張士昌指出：「聯電致力透過多元的製程技術及全球布局， 為客戶提供彈性的供應鏈選擇，以協助客戶在現今的地緣政治環境中提升競爭力，我們 非常期待與Polar合作，開拓更多應用與市場。這次合作不僅直接回應客戶對美國本土半 導體製造方案的需求，也展現聯電以創新解決方案和雙贏的合作模式，延續我們為客戶 創造價值的一貫承諾
— TWSE MOPS material announcement (第10款) · MOPS query page ↗
22nm business traction remains robust and well positioned for future growth Third Quarter 2025 Overview: ‧Revenue: NT$59.13 billion (US$1.94 billion) ‧Gross margin: 29.8%; Operating margin: 18.8% ‧Revenue from 22/28nm: 35% ‧Capacity utilization rate: 78% ‧Net income attributable to shareholders of the parent: NT$14.98 billion (US$492 million) ‧Earnings per share: NT$1.20;Show more from the filing
earnings per ADS: US$0.197 Taipei, Taiwan, ROC – October 29, 2025 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the third quarter of 2025. Third quarter consolidated revenue was NT$59.13 billion, increasing 0.6% from NT$58.76 billion in 2Q25. Compared to a year ago, 3Q25 revenue decreased 2.2%. Consolidated gross margin for 3Q25 was 29.8%. Net income attributable to the shareholders of the parent was NT$14.98 billion, with earnings per ordinary share of NT$1.20. Jason Wang, co-president of UMC, said, “In the third quarter, we observed demand growth across most market segments, which drove a 3.4% increase in wafer shipments and improved utilization rate to 78%.
— Form 6-K · US SEC EDGAR · View source filing ↗
22/28nm business reaches record high, accounting for 40% of Q2 revenue Second Quarter 2025 Overview: ‧Revenue: NT$58.76 billion (US$2.01 billion) ‧Gross margin: 28.7%; Operating margin: 18.4% ‧Revenue from 22/28nm: 40% ‧Capacity utilization rate: 76% ‧Net income attributable to shareholders of the parent: NT$8.90 billion (US$304 million) ‧Earnings per share: NT$0.71;Show more from the filing
earnings per ADS: US$0.121 Taipei, Taiwan, ROC – July 30, 2025 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC” or “The Company”), a leading global semiconductor foundry, today announced its consolidated operating results for the second quarter of 2025. Second quarter consolidated revenue was NT$58.76 billion, increasing 1.6% from NT$57.86 billion in 1Q25. Compared to a year ago, 2Q25 revenue increased 3.4%. Consolidated gross margin for 2Q25 was 28.7%. Net income attributable to the shareholders of the parent was NT$8.90 billion, with earnings per ordinary share of NT$0.71.
— Form 6-K · US SEC EDGAR · View source filing ↗