EveryTie.

MediaTek — Supply Chain & Business Relationships

Every relationship below is sourced to a verbatim quote from a public company filing that names the counterparty, with a one-click link to the original document.

Click a company to open its map · drag to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · purple = ownership · grey dashed = suspended · how to read this data.

2 suppliers5 competitors7 source filings

Where it sits in the AI-server chain

The stages where a filing quote places this company on the AI-server chain.

Suppliers (companies that supply it)

Supplied by ← UMC
Filed 2026-04-30 · 113 days ago
“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”
— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗
Supplied by ← Rambus
Filed 2026-02-18 · 184 days ago
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competitors

Competes with ↔ Marvell
Filed 2026-03-11 · 163 days ago
“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”
— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗
Competes with ↔ Silicon Labs
Filed 2026-02-10 · 192 days ago
“We compete with Espressif, Infineon, MediaTek, Microchip, Nordic Semiconductor, NXP, Qualcomm, Renesas, STMicroelectronics, Synaptics, Telink, Texas Instruments and others.”
— SLAB 10-K, filed 2026-02-10 EDGAR · View source filing ↗
Competes with ↔ Power Integrations
Filed 2026-02-06 · 196 days ago
“Such controller chips are produced by a large number of vendors, including those listed above as well as others including NXP Semiconductors, Texas Instruments, Diodes Inc., On-Bright Electronics, MediaTek Inc., Renesas Electronics”
— POWI 10-K, filed 2026-02-06 EDGAR · View source filing ↗
Competes with ↔ Intel
Filed 2026-01-23 · 210 days ago
“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”
— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗
Competes with ↔ Qualcomm
Filed 2025-11-05 · 289 days ago
“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”
— QCOM 10-K, filed 2025-11-05 EDGAR · View source filing ↗

Filed activity

Filings by MediaTek itself, from our archive: US SEC earnings filings (Form 8-K Item 2.02 and Form 6-K results reports) since 2025-07-22, plus Taiwan Stock Exchange material announcements where covered. Not a complete filing history; subjects appear verbatim in their original language.

Showing the 8 most recent of 11 filed events; the full set stays in the underlying data archive.

2026-06-26Transaction announcementTo announce on behalf of the subsidiary, Digimoc Holdings Limited, the acquisition of securities
1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.): Reed Semiconductor Corp; preferred shares
5.Amount, unit price, and total monetary amount of the transaction: 3,222,875 shares; approximately US$8.99 per share; approximately US$29 million
Reed Semiconductor Corp; non-related party
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1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.): Reed Semiconductor Corp; preferred shares 2.Date of occurrence of the event: 2026/06/26 3.Date of the board of directors resolution: 2026/06/26 4.Other approval date: Not applicable 5.Amount, unit price, and total monetary amount of the transaction: 3,222,875 shares; approximately US$8.99 per share; approximately US$29 million 6.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed): Reed Semiconductor Corp; non-related party
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-05-29Transaction announcementAnnouncement for the short-form merger on behalf of MediaTek's major subsidiary Hsiang Fa Co. and InnoFusion Technology Corp.
4.Counterparty (e.g., name of the other company participating in the merger or consolidation, company taking assignment of the spin-off, or counterparty to the acquisition or assignment of shares): InnoFusion Technology Corp.(the dissolved company)
Show more from the filing
1.Type of merger and acquisition (e.g., merger, spin-off, acquisition, or share transfer):Merger 2.Date of occurrence of the event:2026/05/29 3.Names of companies participating in the merger and acquisition (e.g., name of the other company participating in the merger or consolidation, newly established company in a spin-off, acquired company, or company whose shares are taken assignment of): Hsiang Fa Co.(the surviving company) 4.Counterparty (e.g., name of the other company participating in the merger or consolidation, company taking assignment of the spin-off, or counterparty to the acquisition or assignment of shares): InnoFusion Technology Corp.(the dissolved company) 5.Whether the counterparty of the current transaction is a related party:Yes. 6.Relationship between the counterparty and the Company (investee company in which the Company has re-invested and has shareholding of XX%), and
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-05-29Transaction announcementAnnouncement of acquisition of intangible assets on behalf of its Subsidiary, HFI Innovation Inc.
1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.):Patents
5.Amount, unit price, and total monetary amount of the transaction: A package of patents, NT$1,600,000,000 (equivalent to USD 50,000,000)
LG Electronics Inc., not a related party
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1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.):Patents 2.Date of occurrence of the event:2026/05/29 3.Date of the board of directors resolution:2026/05/29 4.Other approval date:NA 5.Amount, unit price, and total monetary amount of the transaction: A package of patents, NT$1,600,000,000 (equivalent to USD 50,000,000) 6.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed):LG Electronics Inc., not a related party 7.Where the trading counterparty is a related party, announcement shall also be made of the reason for choosing the related party as trading counterparty
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-04-30Transaction announcementTo announce on behalf of subsidiary Hefei Xuhui Management Consulting Co., Ltd. for the acquisition of financial assets.
5.Amount, unit price, and total monetary amount of the transaction: Transaction volume:NA; Unit price:NA; Total amount of the transaction: up to CNY 300,000,000.
14.Trading counterparty and its relationship with the Company: Non-related party
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1.Date of occurrence of the event:2026/04/30 2.Method of the current increase (decrease) in investment: Hefei Xuhui Management Consulting Co., Ltd. will invest in KQ III (Shanghai) Technology Private Equity Fund, L.P.(tentative name) up to CNY 300,000,000. 3.Date of the board of directors resolution:NA 4.Other approval date:Shareholder resolution dated on 2026/04/30 5.Amount, unit price, and total monetary amount of the transaction: Transaction volume:NA; Unit price:NA; Total amount of the transaction: up to CNY 300,000,000. 6.Company name of the mainland Chinese investee: KQ III (Shanghai) Technology Private Equity Fund, L.P.(tentative name) 7.Paid-in capital of aforementioned mainland Chinese investee:NA 8.Amount of capital increase currently planned for the aforementioned mainland Chinese investee: up to CNY 3,000,000,000. 9.Main businesses of the aforementioned mainland Chinese investee: Equity investment and investment management.
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-03-20Transaction announcementTo announce the disposal of securities on behalf of the subsidiary, Gold Rich International (HK) Limited ("Gold Rich")
1.Name of the securities: Common shares of Shenzhen Goodix Technology Co., Ltd. (”Goodix”)
13.Trading counterparty and its relationship with the Company: Not a related party
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1.Name of the securities: Common shares of Shenzhen Goodix Technology Co., Ltd. (”Goodix”) 2.Trading date:2026/03/20 3.Date of the board of directors resolution:2026/03/20 4.Other approval date: NA 5.Amount, unit price, and total monetary amount of the transaction: The board of directors of Gold Rich has approved the disposal of Goodix shares, not exceeding 9,300,000 shares, at market price, during the period of March 23, 2026 to March 22, 2027. The implementation of this disposal plan is subject to, among others, the market conditions, and the share price of Goodix. Transaction details will be announced once the transaction is completed. 6.Gain (or loss) through disposal (not applicable in case of acquisition of securities): The disposal gains will be included in other comprehensive income, with no impact on the net income and EPS. The actual disposal result will be announced once the transaction is completed. 7.Relationship with the underlying company of the trade: Not a related party
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-03-16Transaction announcementAnnouncement of acquisition of intangible assets on behalf of Subsidiary, HFI Innovation Inc.
1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.):Patents
5.Amount, unit price, and total monetary amount of the transaction: A package of patents, NT$1,248,000,000 (equivalent to USD 39,000,000)
not a related party
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1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.):Patents 2.Date of occurrence of the event:2026/03/16 3.Date of the board of directors resolution:2026/03/16 4.Other approval date:NA 5.Amount, unit price, and total monetary amount of the transaction: A package of patents, NT$1,248,000,000 (equivalent to USD 39,000,000) 6.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed): not a related party 7.Where the trading counterparty is a related party, announcement shall also be made of the reason for choosing the related party as trading counterparty
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-02-27Transaction announcementTo announce on behalf of the subsidiary, Digimoc Holdings Limited, the acquisition of securities
1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.): Ayar Labs, Inc.; preferred shares
5.Amount, unit price, and total monetary amount of the transaction: 1,722,759 shares; approximately US$52.24 per share; approximately US$90 million
Ayar Labs, Inc.; non-related party
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1.Name and nature of the underlying assets (if preferred shares, the terms and conditions of issuance shall also be indicated, e.g., dividend yield, etc.): Ayar Labs, Inc.; preferred shares 2.Date of occurrence of the event: 2026/02/26 3.Date of the board of directors resolution: 2026/02/26 4.Other approval date: Not applicable 5.Amount, unit price, and total monetary amount of the transaction: 1,722,759 shares; approximately US$52.24 per share; approximately US$90 million 6.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed): Ayar Labs, Inc.; non-related party 7.Where the trading counterparty is a related party, announcement shall also
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗
2026-02-04Transaction announcementAnnouncement of the purchase of machinery equipment
1.Name and nature of the underlying asset (e.g., land located at Sublot XX, Lot XX, North District, Taichung City):machinery equipment
5.Transaction unit amount (e.g.XX square meters, equivalent to XX ping), unit price, and total transaction price: Transaction volume:1 batch Total transaction price:TWD$15.5 billion
Show more from the filing
1.Name and nature of the underlying asset (e.g., land located at Sublot XX, Lot XX, North District, Taichung City):machinery equipment 2.Date of occurrence of the event:2026/02/04 3.Date of the board of directors resolution:2026/02/04 4.Other approval date:NA 5.Transaction unit amount (e.g.XX square meters, equivalent to XX ping), unit price, and total transaction price: Transaction volume:1 batch Total transaction price:TWD$15.5 billion 6.Trading counterparty and its relationship with the Company (if the trading counterparty is a natural person and furthermore is not a related party of the Company, the name of the trading counterparty is not required to be disclosed): ADVANTEST TAIWAN INC.;HON. PRECISION, INC.;Micro Control Company; Taiwan Semiconductor Manufacturing Company, Limited; Chunghwa Precision Test Tech. Co., Ltd.; Relationship with the Company: None.
— TWSE eMOPS material announcement (paragraph 20) · View announcement ↗