Networking & Connectivity Chips — Supply-Chain Map

Switch, optics, and connectivity silicon, and the equipment vendors that build it into the routers, switches, and optical links carrying cloud and AI traffic.

Moving data between chips, boards, systems, and buildings depends on dedicated networking and connectivity silicon. Mapped here are the switch, optics-driver, and connectivity-chip designers alongside the equipment vendors that build them into routers, switches, and optical links. Rising bandwidth demand from cloud and AI workloads keeps pressure on this part of the supply chain, linking chipmakers tightly to the system vendors they serve.

Dark nodes are this theme’s core companies. Click any company to open its page · drag/zoom to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · grey dashed = suspended · how to read this data.

9 core companies83 companies in map127 sourced relationships32 source filings

Core companies

Supply & manufacturing relationships (38)

Showing 30 of 38 — strongest disclosure signals first, then most recent. The map above and each company page hold the full set.

Supplies to TSMC → Credo Sole / limited source

Filed 2026-06-15 · 21 days ago

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to Arm → Qualcomm % of revenue disclosed

Filed 2026-05-26 · 41 days ago

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”
— ARM 20-F, filed 2026-05-26 · View source filing ↗

Supplies to Broadcom → Arista Networks Sole / limited source

Filed 2026-02-17 · 139 days ago

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”
— ANET 10-K, filed 2026-02-17 · View source filing ↗

Supplies to Qualcomm → Samsung % of revenue disclosed

Filed 2025-11-05 · 243 days ago

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”
— QCOM 10-K, filed 2025-11-05 · View source filing ↗

Supplies to Qualcomm → Xiaomi % of revenue disclosed

Filed 2025-11-05 · 243 days ago

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”
— QCOM 10-K, filed 2025-11-05 · View source filing ↗

Supplies to Amkor → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to ASE → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to King Yuan Electronics → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to Sigurd Microelectronics → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to Bizlink Technology → Credo

Filed 2026-06-15 · 21 days ago

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Supplies to UMC → MediaTek

Filed 2026-04-30 · 67 days ago

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”
— UMC 20-F, filed 2026-04-30 · View source filing ↗

Supplies to MKSI → Huawei Suspended (US export controls)

Filed 2026-02-24 · 132 days ago

“Such regulatory changes include the addition by BIS of China-based Huawei Technologies Co., Ltd. (“Huawei”), Semiconductor Manufacturing International Corporation (“SMIC”), Yangtze Memory Technologies Corp (“YMTC”), NAURA Technology Group, Piotech, Inc. and many of their respective affiliates onto its Entity List. … Accordingly, we have implemented additional monitoring processes and suspended orders from these companies as well as other designated Chinese-based customers, where those orders are subject to U.S. jurisdiction.”
— MKSI 10-K, filed 2026-02-24 · View source filing ↗

Supplies to Amkor → Qualcomm

Last confirmed 2026-02-20 · 136 days ago · corroborated by 2 filings

“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
— AMKR 10-K, filed 2026-02-20 · View source filing ↗

Supplies to NXP → Huawei Suspended (US export controls)

Filed 2026-02-19 · 137 days ago

“In 2020, due to regulations imposed by the U.S. government, we ceased shipments of our products to Huawei pending approval of export licenses.”
— NXPI 10-K, filed 2026-02-19 · View source filing ↗

Supplies to Rambus → Broadcom

Filed 2026-02-18 · 138 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 · View source filing ↗

Supplies to Rambus → Marvell

Filed 2026-02-18 · 138 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 · View source filing ↗

Supplies to Rambus → MediaTek

Filed 2026-02-18 · 138 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 · View source filing ↗

Supplies to Rambus → Qualcomm

Filed 2026-02-18 · 138 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 · View source filing ↗

Supplies to Jabil → Arista Networks

Filed 2026-02-17 · 139 days ago

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”
— ANET 10-K, filed 2026-02-17 · View source filing ↗

Supplies to Sanmina → Arista Networks

Filed 2026-02-17 · 139 days ago

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”
— ANET 10-K, filed 2026-02-17 · View source filing ↗

Supplies to Foxconn → Arista Networks

Filed 2026-02-17 · 139 days ago

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”
— ANET 10-K, filed 2026-02-17 · View source filing ↗

Supplies to TSMC → Broadcom

Filed 2025-12-18 · 200 days ago

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Supplies to ASE → Broadcom

Filed 2025-12-18 · 200 days ago

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Supplies to Foxconn → Broadcom

Filed 2025-12-18 · 200 days ago

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Supplies to Amkor → Broadcom

Filed 2025-12-18 · 200 days ago

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Supplies to SPIL → Broadcom

Filed 2025-12-18 · 200 days ago

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K, filed 2025-12-18 · View source filing ↗

Supplies to Skyworks → Cisco

Filed 2025-11-07 · 241 days ago

“Our key customers include … Cisco,”
— SWKS 10-K, filed 2025-11-07 · View source filing ↗

Supplies to Qualcomm → Apple

Filed 2025-11-05 · 243 days ago

“Apple purchases our MDM (or thin modem) products”
— QCOM 10-K, filed 2025-11-05 · View source filing ↗

Supplies to TSMC → Qualcomm

Filed 2025-11-05 · 243 days ago

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”
— QCOM 10-K, filed 2025-11-05 · View source filing ↗

Supplies to Samsung → Qualcomm

Filed 2025-11-05 · 243 days ago

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”
— QCOM 10-K, filed 2025-11-05 · View source filing ↗

Partnerships & collaborations (4)

Partners with Credo ↔ Oracle

Filed 2026-06-15 · 21 days ago

“We partnered with Oracle to develop our ZeroFlap Optics”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Partners with Credo ↔ Microsoft

Filed 2026-06-15 · 21 days ago

“Created switch cable and open-sourced implementation with Microsoft to realize their vision for a highly reliable network-managed dual-ToR architecture”
— CRDO 10-K, filed 2026-06-15 · View source filing ↗

Partners with UMC ↔ Broadcom

Filed 2026-04-30 · 67 days ago

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”
— UMC 20-F, filed 2026-04-30 · View source filing ↗

Partners with STMicroelectronics ↔ Qualcomm

Filed 2026-02-26 · 130 days ago

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”
— STM 20-F, filed 2026-02-26 · View source filing ↗

Competitive landscape (85)

Showing 25 of 85 — strongest disclosure signals first, then most recent. The map above and each company page hold the full set.

Competes with Cirrus Logic ↔ Qualcomm

Filed 2026-05-21 · 46 days ago

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”
— CRUS 10-K, filed 2026-05-21 · View source filing ↗

Competes with Qualcomm ↔ Qorvo

Last confirmed 2026-05-08 · 59 days ago · corroborated by 2 filings

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”
— QRVO 10-K, filed 2026-05-08 · View source filing ↗

Competes with Qorvo ↔ Broadcom

Filed 2026-05-08 · 59 days ago

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”
— QRVO 10-K, filed 2026-05-08 · View source filing ↗

Competes with Astera Labs ↔ Marvell

Last confirmed 2026-03-11 · 117 days ago · corroborated by 2 filings

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”
— MRVL 10-K, filed 2026-03-11 · View source filing ↗

Competes with AMD ↔ Marvell

Last confirmed 2026-03-11 · 117 days ago · corroborated by 2 filings

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. ("AMD")”
— MRVL 10-K, filed 2026-03-11 · View source filing ↗

Competes with Marvell ↔ Alchip Technologies Alchip