Rambus — Supply Chain & Business Relationships

Every relationship below is sourced to a verbatim quote from a public company filing that names the counterparty, with a one-click link to the original document.

Click a company to open its map · drag to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · purple = ownership · grey dashed = suspended · how to read this data.

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23 customers8 competitors3 source filings

Featured in supply-chain maps: AI Data-Center Compute & Interconnect

Customers (companies it supplies)

Supplies to → AMD

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Amlogic

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Broadcom

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Changxin Memory

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → IBM

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Infineon

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Kioxia

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Marvell

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → MediaTek

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Micron

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Nanya

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Nuvoton

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → NVIDIA

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Phison

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Qualcomm

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Samsung

Filed 2026-02-18 · 184 days ago

“Our memory interface chips are sold to major DRAM manufacturers, Micron, Samsung and SK hynix”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Silicon Motion Technology

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → SK Hynix

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Socionext

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → STMicroelectronics

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Toshiba

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → WDC

Filed 2026-02-18 · 184 days ago

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Supplies to → Winbond

Filed 2026-02-18 · 184 days ago

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competitors

Competes with ↔ Marvell

Filed 2026-03-11 · 163 days ago

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”
— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

Competes with ↔ Astera Labs

Filed 2026-02-20 · 182 days ago

“Our principal competitors include Broadcom, Inc., Credo Technology Group Holding Ltd., Marvell Technology, Inc., Microchip Technology Inc., Montage Technology, Parade Technologies, Ltd., and Rambus, Inc.”
— ALAB 10-K, filed 2026-02-20 EDGAR · View source filing ↗

Competes with ↔ Monolithic Power

Filed 2026-02-18 · 184 days ago

“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competes with ↔ Montage Technology

Filed 2026-02-18 · 184 days ago

“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competes with ↔ Renesas

Filed 2026-02-18 · 184 days ago

“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competes with ↔ Texas Instruments

Filed 2026-02-18 · 184 days ago

“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competes with ↔ Cadence

Filed 2026-02-18 · 184 days ago

“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Competes with ↔ Synopsys

Filed 2026-02-18 · 184 days ago

“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”
— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

Filed activity

Filings by Rambus itself, from our archive: US SEC earnings filings (Form 8-K Item 2.02 and Form 6-K results reports) since 2025-07-22, plus Taiwan Stock Exchange material announcements where covered. Not a complete filing history; subjects appear verbatim in their original language.

2026-07-27Earnings releaseRAMBUS REPORTS SECOND QUARTER 2026 FINANCIAL RESULTS

• Record quarterly revenue of $207.4 million, up 20% year over year, exceeding revenue guidance range • GAAP diluted earnings per share of $0.61 and non-GAAP diluted earnings per share of $0.77, exceeding non-GAAP diluted earnings per share guidance range • Record product revenue of $99.2 million, up 13% quarter over quarter and 22% year over year
Show more from the filing
• Expanded product and IP offerings for next-generation AI systems, including complete chipsets for DDR5 9600 server and client memory modules, and PCIe 7 Switch IP SAN JOSE, Calif. – July 27, 2026 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the second quarter ended June 30, 2026. Total revenue for the second quarter was $207.4 million, product revenue was $99.2 million, royalties revenue was $84.2 million and contract and other revenue was $24.0 million. GAAP diluted earnings per share was $0.61 and non-GAAP diluted earnings per share was $0.77. The Company also generated $61.2 million in cash from operating activities in the second quarter.

— Form 8-K · Items 2.02, 9.01 · US SEC EDGAR · View source filing ↗

2026-04-27Earnings releaseRAMBUS REPORTS FIRST QUARTER 2026 FINANCIAL RESULTS

• Achieved strong Q1 results, delivering quarterly product revenue of $88.0 million, up 15% year over year • Generated strong quarterly cash from operations of $83.2 million • Expanded product and IP offerings for next-generation AI platforms, including the LPDDR5X SOCAMM2 server module chipset, the industry’s fastest HBM4E memory controller IP SAN JOSE, Calif. – April 27, 2026 – Rambus Inc.
Show more from the filing
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the first quarter ended March 31, 2026. GAAP revenue for the first quarter was $180.2 million, licensing billings were $70.8 million, product revenue was $88.0 million, and contract and other revenue was $22.6 million. The Company also generated $83.2 million in cash from operating activities in the first quarter. “Rambus opened 2026 with a solid first quarter, delivering financial results in line with guidance and generating strong cash from operations,” said Luc Seraphin, president and chief executive officer of Rambus.

— Form 8-K · Items 2.02, 9.01 · US SEC EDGAR · View source filing ↗

2026-02-02Earnings releaseRAMBUS REPORTS FOURTH QUARTER AND FISCAL YEAR 2025 FINANCIAL RESULTS

• Achieved record 2025 revenue and earnings results • Delivered record quarterly product revenue of $96.8 million, fueling record annual product revenue of $347.8 million, up 41% from 2024 • Generated record quarterly and annual cash from operations of $99.8 million and $360.0 million, respectively SAN JOSE, Calif. – February 2, 2026 – Rambus Inc.
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(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the fourth quarter ended December 31, 2025. GAAP revenue for the fourth quarter was $190.2 million, licensing billings were $71.5 million, product revenue was $96.8 million, and contract and other revenue was $21.8 million. The Company also generated $99.8 million in cash from operating activities in the fourth quarter. “2025 was a record-breaking year for Rambus, delivering strong growth in revenue and earnings, and new quarterly and annual highs for product revenue and cash from operations,” said Luc Seraphin, president and chief executive officer of Rambus. “Our sustained leadership in DDR5 RCDs and growing contributions from new products drove substantial year-over-year product growth.

— Form 8-K · Items 2.02, 9.01 · US SEC EDGAR · View source filing ↗

2025-10-27Earnings releaseRAMBUS REPORTS THIRD QUARTER 2025 FINANCIAL RESULTS

• Delivered very strong Q3 results and generated excellent quarterly cash from operations of $88.4 million • Achieved fourth consecutive quarterly product revenue record at $93.3 million SAN JOSE, Calif. – October 27, 2025 – Rambus Inc.
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(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the third quarter ended September 30, 2025. GAAP revenue for the third quarter was $178.5 million, licensing billings were $66.1 million, product revenue was $93.3 million, and contract and other revenue was $20.1 million. The Company also generated $88.4 million in cash from operating activities in the third quarter. “Rambus delivered a very strong third quarter, with record product revenue and excellent cash from operations, while continuing to execute on our strategic roadmap,” said Luc Seraphin, president and chief executive officer of Rambus. “Sustained DDR5 product leadership and ramping contributions from new products put us on track to deliver full-year product revenue growth that outpaces the market.

— Form 8-K · Items 2.02, 9.01 · US SEC EDGAR · View source filing ↗

2025-07-28Earnings releaseRAMBUS REPORTS SECOND QUARTER 2025 FINANCIAL RESULTS

• Exceeded expectations for Q2 revenue and earnings • Achieved record quarterly product revenue of $81.3 million, up 43% year over year • Generated record quarterly cash from operations of $94.4 million SAN JOSE, Calif. – July 28, 2025 – Rambus Inc.
Show more from the filing
(NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the second quarter ended June 30, 2025. GAAP revenue for the second quarter was $172.2 million, licensing billings were $66.4 million, product revenue was $81.3 million, and contract and other revenue was $22.3 million. The Company also generated $94.4 million in cash provided by operating activities in the second quarter. “Rambus delivered a very strong Q2, with record product revenue and record cash generation reflecting the strength of our business model and execution,” said Luc Seraphin, president and chief executive officer of Rambus. “Our chip business continues to be a key growth engine for the company.

— Form 8-K · Items 2.02, 9.01 · US SEC EDGAR · View source filing ↗