AMD — Supply Chain & Business Relationships

“Expanded collaboration with Microsoft to deploy AMD Helios racks at scale on Azure to power frontier model inference.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Anthropic and AMD announced a strategic agreement to deploy up to 2 GW of AMD Instinct MI450 Series GPUs in AMD Helios racks.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“Consumer systems (laptops, 2‑in‑1s, and Mini PCs) are primarily designed on Intel Panther Lake, Lunar Lake, Arrow Lake, Raptor Lake Refresh, Twin Lake, AMD Ryzen AI series, and ARM‑based CPU platforms, and support next‑generation operating systems.”

— Pegatron Annual report, filed 2026-05-28 TWSE (English translation of the Chinese original) · View source filing ↗

“Meta plans to deploy up to 6 GW of AMD Instinct GPUs, with the first 1-GW deployment powered by a custom AMD Instinct MI450-based GPU. Meta will also be a lead customer for 6th Gen AMD EPYC CPUs.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“Cisco announced that AMD Ryzen Embedded V3000 processors will power new Cisco N9300 Series switches and 8000 Series routers for AI workloads.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“Zyphra’s ZAYA1 is the first large-scale mixture-of-experts model trained entirely on AMD Instinct MI300X GPUs, AMD Pensando™ networking and AMD ROCm™ open software.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“HPE announced it will be one of the first system providers to adopt the AMD Helios rack-scale platform and deliver the Herder supercomputer powered by next-gen AMD Instinct MI430X GPUs and EPYC “Venice” CPUs.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“Cisco and AMD announced an expanded collaboration with G42 to deploy a large-scale AI cluster powered by AMD Instinct MI355X GPUs to advance secure AI infrastructure across UAE.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“Cohere and AMD expanded their collaboration, bringing AMD Instinct GPU-powered infrastructure to Cohere’s full suite of enterprise AI offerings.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“Vultr announced the global availability of AMD Instinct MI355X GPUs across its cloud platform.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“DigitalOcean expanded its AMD-based cloud offerings to support a broader range of AI workloads with AMD Instinct MI325X GPUs available now and AMD Instinct MI350X GPUs available later this year.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“AMD and KDDI announced an agreement to leverage 4th Gen AMD EPYC CPUs for its advanced 5G virtualized network.”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“Dell announced the new Dell AI platform including the Dell PowerEdge XE9785 and XE9785L servers that maximize performance and efficiency with AMD Instinct MI350 Series GPUs and AMD EPYC CPUs.”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“First Copilot+ mobile workstations, Lenovo ThinkPad P14s and P16s and HP ZBook 8 powered by Ryzen PRO processors, went into production”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“First Copilot+ mobile workstations, Lenovo ThinkPad P14s and P16s and HP ZBook 8 powered by Ryzen PRO processors, went into production”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“AMD and Samsung announced a collaboration on HBM4 supply for AMD Instinct MI455X GPUs and advanced DRAM solutions for 6th Gen AMD EPYC CPUs.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K, filed 2026-02-18 EDGAR · View source filing ↗

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“主な相手先別の販売実績及び当該販売実績の総販売実績に対する割合は、次のとおりです。 … Advanced Micro Devices Inc. − − 40,707 11.0”

— Ibiden Co., Ltd. Annual securities report, filed 2025-03-31 EDINET (Statutory Japanese annual securities report; quote in the original Japanese) · View source filing ↗

Not re-confirmed in the filer’s latest annual report (FY2026-03): fell below the ≥10% disclosure threshold.

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“AMD and Tata Consultancy Services (TCS) are co-developing AMD Helios-based rack-scale AI infrastructure to accelerate enterprise AI deployments and sovereign AI initiatives in India.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“Demonstrated ecosystem partnership and compatibility at AMD Advancing AI 2026 with multiple exhibits highlighting Astera Labs’ solutions to resolve data movement bottlenecks across PCIe, CXL, and Ethernet. … Joint architectures included AMD Instinct platforms operating with Scorpio P-Series 320L for fabric optimization, Leo CXL memory controller for smart memory tiering, and Taurus 1.6T Smart Ethernet Retimers for scale-out connectivity, all with full-stack interop validated from end to end.”

— ALAB 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Announced a collaboration with Cerebras to bring together AMD Helios and Cerebras Wafer-Scale Engine to improve efficiency, scalability and economics for ultra-low-latency inference serving.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“GIGABYTE has formed strategic partnerships with major suppliers such as Intel, AMD, and NVIDIA”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“The Company continues to deepen cooperation with AMD, Intel, and NVIDIA”

— Chenbro Micom Annual report, filed 2026-05-29 TWSE (English translation of the Chinese original) · View source filing ↗

“the strategic partnership with Meta and the deployment of up to six gigawatts of AMD Instinct GPUs”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“AMD is collaborating with NAVER Cloud and Upstage to deploy AMD Instinct GPUs and EPYC CPUs across their AI infrastructure, advancing sovereign AI initiatives in Korea.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“AMD is collaborating with NAVER Cloud and Upstage to deploy AMD Instinct GPUs and EPYC CPUs across their AI infrastructure, advancing sovereign AI initiatives in Korea.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 EDGAR · View source filing ↗

“Sanmina will also be our preferred partner for manufacturing capabilities in building complex AI solutions.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“OpenAI and AMD announced a strategic partnership where AMD will be a core preferred partner to deploy 6 gigawatts of AMD GPUs to power OpenAI’s next generation AI infrastructure, with the first 1-gigawatt deployment of AMD Instinct MI450 GPUs set to begin in the second half of 2026.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“IBM and AMD announced plans to combine quantum computers and high-performance compute to drive scalable, open-source next-generation computing architectures. … IBM and AMD announced a multi-year collaboration to provide Zyphra with advanced AI infrastructure, leveraging a large cluster of AMD Instinct MI350X GPUs to power next-generation multimodal AI models.”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“the strategic partnership with Oracle and the deployment of 50,000 GPUs and timing thereof;”

— AMD 8-K, filed 2025-11-04 EDGAR · View source filing ↗

“At Advancing AI 2025, AMD announced its latest AI solutions, roadmap and vision for an open AI ecosystem alongside partners including Meta, OpenAI, xAI, Oracle and Microsoft.”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“Announced a new multi-year collaboration with Microsoft for custom chips that will power the next generation of Xbox devices including consoles, PCs, and handhelds”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“Red Hat and AMD expanded their strategic collaboration to deliver high-performance AI inference with vLLM on AMD Instinct GPUs along with Red Hat OpenShift Virtualization on AMD EPYC CPUs for optimized enterprise application deployment across the hybrid cloud.”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“Bosch and AMD are collaborating on next- generation robotaxi services in Europe, including a pilot program using the AMD Versal device to support security and real-time encryption”

— AMD 8-K, filed 2025-08-05 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. (“AMD”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K, filed 2026-02-25 EDGAR · View source filing ↗

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“In addition, we compete against Altera with our FPGA and adaptive SoC server products.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗