AMD — 供應鏈與商業關係

“On February 23, 2026, in connection with a strategic arrangement between Advanced Micro Devices, Inc. (“AMD”) and Meta Platforms, Inc. (“Meta”) governing the purchase of AMD Instinct™ GPU products by Meta, AMD issued to Meta a performance-based warrant”

— AMD 8-K，申報於 2026-02-24 · 查看原始申報文件 ↗

AMD 因與 Meta 的策略安排，向 Meta 發行了一份績效型認股權證。（以原文為準）

“In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 OpenAI 於 2025 年 10 月簽署產品採購協議，以部署 6 吉瓦的 AMD GPU。（以原文為準）

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 的半客製化 SoC 產品用於 Sony 的 PlayStation 5。（以原文為準）

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 的半客製化 SoC 產品為 Microsoft 的 Xbox Series S 和 X 遊戲主機提供動力。（以原文為準）

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 的半客製化 SoC 產品為 Valve Steam Machine PC 提供動力。（以原文為準）

“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

AMD 已取得 Rambus 的專利授權。（以原文為準）

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 利用 TSMC 生產其 HPC、FPGA 及自適應 SoC 產品之晶圓。（以原文為準）

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

SPIL 透過 ATMP 合資企業為 AMD 的產品提供封測服務。（以原文為準）

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

King Yuan Electronics 透過 ATMP 合資企業為 AMD 的產品提供封測服務。（以原文為準）

“The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 Sanmina 簽訂了一份初始為期五年的製造服務協議。（以原文為準）

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 Tongfu 共同參與兩家 ATMP 合資企業。（以原文為準）

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 Higon 共同持有 THATIC 合資企業之權益。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 AMD 有專利交叉授權。（以原文為準）

“Sanmina will also be our preferred partner for manufacturing capabilities in building complex AI solutions.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Sanmina 指定為其建構複雜 AI 解決方案製造能力的首選合作夥伴。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. ("AMD")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 AMD 列為與其業務直接競爭之公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 的當前競爭對手包括 AMD。（以原文為準）

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Intel 是 AMD 在 CPU 和 APU 供應上的主要競爭者。（以原文為準）

“In addition, we compete against Altera with our FPGA and adaptive SoC server products.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Altera是AMD在FPGA及自適應SoC伺服器產品領域的競爭對手。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Lattice 列為其主要的 FPGA 競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Microsemi是AMD在FPGA領域的主要競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Broadcom 列為其 ASSP 供應商領域的競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Analog Devices 是 AMD 在 FPGA 領域的競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Texas Instruments 列為其 ASSP 競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 預期將與 NXP 在 ASSP 市場上競爭。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD預期與Qualcomm在ASSP領域持續競爭。（以原文為準）