AMD — 供應鏈與商業關係

“Expanded collaboration with Microsoft to deploy AMD Helios racks at scale on Azure to power frontier model inference.”

— AMD 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

AMD 擴大與 Microsoft 的合作，在 Azure 大規模部署 AMD Helios 機架進行前沿模型推論。（以原文為準）

“Anthropic and AMD announced a strategic agreement to deploy up to 2 GW of AMD Instinct MI450 Series GPUs in AMD Helios racks.”

— AMD 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Anthropic 達成策略協議，將部署高達 2 GW 的 AMD Instinct MI450 系列 GPU 於 AMD Helios 機架中。（以原文為準）

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report，申報於 2026-06-09 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Gigabyte Technology 將 AMD 列為主要供應來源之一。（以原文為準）

“Consumer systems (laptops, 2‑in‑1s, and Mini PCs) are primarily designed on Intel Panther Lake, Lunar Lake, Arrow Lake, Raptor Lake Refresh, Twin Lake, AMD Ryzen AI series, and ARM‑based CPU platforms, and support next‑generation operating systems.”

— Pegatron Annual report，申報於 2026-05-28 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Pegatron 在其消費性系統產品設計中採用 AMD 處理器平台。（以原文為準）

“Meta plans to deploy up to 6 GW of AMD Instinct GPUs, with the first 1-GW deployment powered by a custom AMD Instinct MI450-based GPU. Meta will also be a lead customer for 6th Gen AMD EPYC CPUs.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 表示 Meta 計劃部署最多 6 GW 的 AMD Instinct GPU，並將成為第 6 代 AMD EPYC CPU 的主要客戶。（以原文為準）

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 宣布 AWS 等雲端服務商推出搭載第 5 代 EPYC 的新雲端實例。（以原文為準）

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 的第五代 EPYC 處理器被用於 Google/Alphabet 等雲端服務商新推出的雲端實例中。（以原文為準）

“AWS , Google Cloud, Microsoft Azure and Tencent announced new and expanded 5 th Gen EPYC-powered cloud instances, including Google Cloud H4D VMs for HPC and Azure instances across general-purpose, memory- and compute-optimized workloads.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 宣布 Tencent 等雲端服務商推出搭載第 5 代 EPYC 的新雲端實例。（以原文為準）

“Cisco announced that AMD Ryzen Embedded V3000 processors will power new Cisco N9300 Series switches and 8000 Series routers for AI workloads.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

Cisco 宣布 AMD Ryzen Embedded V3000 處理器將用於新的 Cisco N9300 系列交換器和 8000 系列路由器，以支援 AI 工作負載。（以原文為準）

“In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 OpenAI 於 2025 年 10 月簽署產品採購協議，以部署 6 GW 的 AMD GPU。（以原文為準）

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 的半客製化 SoC 產品用於 Sony 的 PlayStation 5。（以原文為準）

“AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 的半客製化 SoC 產品為 Valve Steam Machine PC 提供動力。（以原文為準）

“Zyphra’s ZAYA1 is the first large-scale mixture-of-experts model trained entirely on AMD Instinct MI300X GPUs, AMD Pensando™ networking and AMD ROCm™ open software.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

Zyphra 的 ZAYA1 是第一個完全在 AMD Instinct MI300X GPU、AMD Pensando™ 網路和 AMD ROCm™ 開放軟體上訓練的大規模混合專家模型。（以原文為準）

“HPE announced it will be one of the first system providers to adopt the AMD Helios rack-scale platform and deliver the Herder supercomputer powered by next-gen AMD Instinct MI430X GPUs and EPYC “Venice” CPUs.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

AMD 宣布 HPE 將成為首批採用 AMD Helios 機櫃級平台的系統供應商之一，並交付由次世代 AMD Instinct MI430X GPU 及 EPYC「Venice」CPU 驅動的 Herder 超級電腦。（以原文為準）

“Cisco and AMD announced an expanded collaboration with G42 to deploy a large-scale AI cluster powered by AMD Instinct MI355X GPUs to advance secure AI infrastructure across UAE.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 宣布 Cisco 與 AMD 擴大與 G42 的合作，部署由 AMD Instinct MI355X GPU 驅動的大規模 AI 叢集。（以原文為準）

“Cohere and AMD expanded their collaboration, bringing AMD Instinct GPU-powered infrastructure to Cohere’s full suite of enterprise AI offerings.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Cohere 擴大合作，將 AMD Instinct GPU 基礎設施導入 Cohere 的企業 AI 產品。（以原文為準）

“Vultr announced the global availability of AMD Instinct MI355X GPUs across its cloud platform.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

Vultr 宣布在其雲端平台上全球推出 AMD Instinct MI355X GPU。（以原文為準）

“DigitalOcean expanded its AMD-based cloud offerings to support a broader range of AI workloads with AMD Instinct MI325X GPUs available now and AMD Instinct MI350X GPUs available later this year.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 將其 AMD Instinct MI325X 與 MI350X GPU 提供給 DigitalOcean，以支援其雲端 AI 工作負載。（以原文為準）

“AMD and KDDI announced an agreement to leverage 4th Gen AMD EPYC CPUs for its advanced 5G virtualized network.”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 與 KDDI 宣布一項協議，由 KDDI 採用第 4 代 AMD EPYC CPU 用於其先進 5G 虛擬化網路。（以原文為準）

“Dell announced the new Dell AI platform including the Dell PowerEdge XE9785 and XE9785L servers that maximize performance and efficiency with AMD Instinct MI350 Series GPUs and AMD EPYC CPUs.”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 的 AMD Instinct MI350 系列 GPU 與 AMD EPYC CPU 被用於 Dell 新發表的 Dell AI 平台伺服器中。（以原文為準）

“First Copilot+ mobile workstations, Lenovo ThinkPad P14s and P16s and HP ZBook 8 powered by Ryzen PRO processors, went into production”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 指出首款搭載 Ryzen PRO 處理器的 Copilot+ 行動工作站 Lenovo ThinkPad P14s 及 P16s 已進入量產。（以原文為準）

“First Copilot+ mobile workstations, Lenovo ThinkPad P14s and P16s and HP ZBook 8 powered by Ryzen PRO processors, went into production”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 的 Ryzen PRO 處理器用於 HP 的 Copilot+ 行動工作站。（以原文為準）

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“AMD and Samsung announced a collaboration on HBM4 supply for AMD Instinct MI455X GPUs and advanced DRAM solutions for 6th Gen AMD EPYC CPUs.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Samsung 合作，由 Samsung 供應 AMD Instinct MI455X GPU 的 HBM4，並提供第 6 代 AMD EPYC CPU 的先進 DRAM 解決方案。（以原文為準）

“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗

Rambus 將 AMD 列為已取得 Rambus 專利授權的公司之一。（以原文為準）

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 利用 TSMC 生產其 HPC、FPGA 及自適應 SoC 產品之晶圓。（以原文為準）

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

SPIL 透過 ATMP 合資企業為 AMD 的產品提供封測服務。（以原文為準）

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

King Yuan Electronics 透過 ATMP 合資企業為 AMD 的產品提供封測服務。（以原文為準）

“The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Sanmina 簽訂了一份初始為期五年的製造服務協議。（以原文為準）

“主な相手先別の販売実績及び当該販売実績の総販売実績に対する割合は、次のとおりです。 … Advanced Micro Devices Inc. − − 40,707 11.0”

— Ibiden Co., Ltd. Annual securities report，申報於 2025-03-31 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

未在申報方最新年報（FY2026-03）中再次確認：低於 10% 揭露門檻

Ibiden 將 AMD 列為主要客戶，銷售實績如原文表格所示，佔總銷售實績 11.0%。（以原文為準）

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Cisco 及 HUMAIN 成立合資企業，計劃於 2030 年前部署 1 GW 的人工智慧基礎設施。（以原文為準）

“AMD and Tata Consultancy Services (TCS) are co-developing AMD Helios-based rack-scale AI infrastructure to accelerate enterprise AI deployments and sovereign AI initiatives in India.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 與 Tata Consultancy Services 共同開發以 AMD Helios 為基礎的機架級人工智慧基礎架構，以加速印度的企業人工智慧部署與主權人工智慧計畫。（以原文為準）

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Tongfu 共同參與兩家 ATMP 合資企業。（以原文為準）

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Higon 共同持有 THATIC 合資企業之權益。（以原文為準）

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 HUMAIN 及 Cisco 成立合資企業，計劃於 2030 年前部署 1 GW 的人工智慧基礎設施。（以原文為準）

“Demonstrated ecosystem partnership and compatibility at AMD Advancing AI 2026 with multiple exhibits highlighting Astera Labs’ solutions to resolve data movement bottlenecks across PCIe, CXL, and Ethernet. … Joint architectures included AMD Instinct platforms operating with Scorpio P-Series 320L for fabric optimization, Leo CXL memory controller for smart memory tiering, and Taurus 1.6T Smart Ethernet Retimers for scale-out connectivity, all with full-stack interop validated from end to end.”

— ALAB 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

Astera Labs 在 AMD Advancing AI 2026 以多項展示呈現與 AMD 的生態系合作及相容性。（以原文為準）

“Announced a collaboration with Cerebras to bring together AMD Helios and Cerebras Wafer-Scale Engine to improve efficiency, scalability and economics for ultra-low-latency inference serving.”

— AMD 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Cerebras 合作，結合 AMD Helios 與 Cerebras Wafer-Scale Engine 以提升超低延遲推論服務的效率、可擴展性與經濟效益。（以原文為準）

“GIGABYTE has formed strategic partnerships with major suppliers such as Intel, AMD, and NVIDIA”

— Gigabyte Technology Annual report，申報於 2026-06-09 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Gigabyte Technology 已與 AMD 等主要供應商建立策略夥伴關係。（以原文為準）

“The Company continues to deepen cooperation with AMD, Intel, and NVIDIA”

— Chenbro Micom Annual report，申報於 2026-05-29 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Chenbro Micom 持續深化與 AMD 的合作。（以原文為準）

“the strategic partnership with Meta and the deployment of up to six gigawatts of AMD Instinct GPUs”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 說明其與 Meta 之策略夥伴關係，以及高達 6 GW 之 AMD Instinct GPU 部署。（以原文為準）

“AMD is collaborating with NAVER Cloud and Upstage to deploy AMD Instinct GPUs and EPYC CPUs across their AI infrastructure, advancing sovereign AI initiatives in Korea.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 正與 NAVER Cloud 及 Upstage 合作，在其 AI 基礎設施中部署 AMD Instinct GPU 與 EPYC CPU。（以原文為準）

“AMD is collaborating with NAVER Cloud and Upstage to deploy AMD Instinct GPUs and EPYC CPUs across their AI infrastructure, advancing sovereign AI initiatives in Korea.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 正與 Upstage 合作，在其 AI 基礎設施中部署 AMD Instinct GPU 及 EPYC CPU。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 與 AMD 有專利交叉授權。（以原文為準）

“Sanmina will also be our preferred partner for manufacturing capabilities in building complex AI solutions.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 將 Sanmina 指定為其建構複雜 AI 解決方案製造能力的首選合作夥伴。（以原文為準）

“OpenAI and AMD announced a strategic partnership where AMD will be a core preferred partner to deploy 6 gigawatts of AMD GPUs to power OpenAI’s next generation AI infrastructure, with the first 1-gigawatt deployment of AMD Instinct MI450 GPUs set to begin in the second half of 2026.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 與 OpenAI 宣布策略合作夥伴關係，AMD 將成為核心首選合作夥伴，部署 6 GW 的 AMD GPU 以支援 OpenAI 的下一代 AI 基礎設施。（以原文為準）

“IBM and AMD announced plans to combine quantum computers and high-performance compute to drive scalable, open-source next-generation computing architectures. … IBM and AMD announced a multi-year collaboration to provide Zyphra with advanced AI infrastructure, leveraging a large cluster of AMD Instinct MI350X GPUs to power next-generation multimodal AI models.”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 與 IBM 宣布計畫結合量子電腦與高效能運算，推動可擴展、開源的次世代運算架構；此外，AMD 與 IBM 宣布多年合作，為 Zyphra 提供先進 AI 基礎設施，運用大型 AMD Instinct MI350X GPU 叢集驅動次世代多模態 AI 模型。（以原文為準）

“the strategic partnership with Oracle and the deployment of 50,000 GPUs and timing thereof;”

— AMD 8-K，申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Oracle 的策略合作夥伴關係及 50,000 顆 GPU 的部署與時程。（以原文為準）

“At Advancing AI 2025, AMD announced its latest AI solutions, roadmap and vision for an open AI ecosystem alongside partners including Meta, OpenAI, xAI, Oracle and Microsoft.”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

在 Advancing AI 2025 大會上，AMD 宣布其最新 AI 解決方案，合作夥伴包括 xAI。（以原文為準）

“Announced a new multi-year collaboration with Microsoft for custom chips that will power the next generation of Xbox devices including consoles, PCs, and handhelds”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Microsoft 展開新的多年合作，開發將用於下一代 Xbox 裝置（包括遊戲主機、PC 與掌上型裝置）的客製化晶片。（以原文為準）

“Red Hat and AMD expanded their strategic collaboration to deliver high-performance AI inference with vLLM on AMD Instinct GPUs along with Red Hat OpenShift Virtualization on AMD EPYC CPUs for optimized enterprise application deployment across the hybrid cloud.”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 與 Red Hat 擴大了策略合作，在 AMD Instinct GPU 上透過 vLLM 提供高效能 AI 推論，並在 AMD EPYC CPU 上搭配 Red Hat OpenShift Virtualization 以最佳化混合雲端企業應用部署。（以原文為準）

“Bosch and AMD are collaborating on next- generation robotaxi services in Europe, including a pilot program using the AMD Versal device to support security and real-time encryption”

— AMD 8-K，申報於 2025-08-05 EDGAR · 查看原始申報文件 ↗

AMD 與 Bosch 合作開發歐洲下一代機器人計程車服務，包括使用 AMD Versal 裝置的試點計畫。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. (“AMD”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 AMD 列為與其業務直接競爭之公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 的當前競爭對手包括 AMD。（以原文為準）

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

Intel 是 AMD 在 CPU 和 APU 供應上的主要競爭者。（以原文為準）

“In addition, we compete against Altera with our FPGA and adaptive SoC server products.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

Altera 是 AMD 在 FPGA 及自適應 SoC 伺服器產品領域的競爭對手。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 將 Lattice 列為其主要的 FPGA 競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

Microsemi 是 AMD 在 FPGA 領域的主要競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 將 Broadcom 列為其 ASSP 供應商領域的競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

Analog Devices 是 AMD 在 FPGA 領域的競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 將 Texas Instruments 列為其 ASSP 競爭對手之一。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 預期將與 NXP 在 ASSP 市場上競爭。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 預期與 Qualcomm 在 ASSP 領域持續競爭。（以原文為準）