AI Data-Center Compute & Interconnect — Supply-Chain Map

“our largest customer individually, Arm China, accounted for approximately 16%, 17% and 21% of our total revenue … We utilize our commercial relationship with Arm Technology (China) Co. Limited (“Arm China”) to access the PRC market.”

— ARM 20-F, filed 2026-05-26 EDGAR · View source filing ↗

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F, filed 2026-05-26 EDGAR · View source filing ↗

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K, filed 2026-02-17 EDGAR · View source filing ↗

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K, filed 2026-08-18 EDGAR · View source filing ↗

“OpenAI, as the tenant, will utilize capacity at the Portsmouth Site supporting approximately 4.25 gigawatts of IT load to deploy NVIDIA’s full-stack DSX AI factory platform, subject to limited exceptions.”

— NVDA 8-K, filed 2026-08-17 EDGAR · View source filing ↗

“During fiscal 2026, we announced the expansion of our Sherman, Texas, manufacturing facility, entered into a strategic multi-year supply agreement with NVIDIA for advanced lasers and optical networking products supporting next-generation AI infrastructure, and received a $50 million preliminary memorandum of terms under the CHIPS and Science Act to support the Sherman expansion.”

— COHR 10-K, filed 2026-08-14 EDGAR · View source filing ↗

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗

“Expanded collaboration with Microsoft to deploy AMD Helios racks at scale on Azure to power frontier model inference.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Anthropic and AMD announced a strategic agreement to deploy up to 2 GW of AMD Instinct MI450 Series GPUs in AMD Helios racks.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“The Company continues to have licensing and servicing arrangements with Ampere for which the Company may earn fees for services provided. … For the three months ended June 30, 2026 and 2025, the Company recognized revenue of $ 5.4 million and $ 0.6 million, respectively, from Ampere.”

— ARM 6-K, filed 2026-07-29 EDGAR · View source filing ↗

“Effective March 2026, the Company entered into a development agreement with Ampere (the “Ampere Development Agreement”), enabling Ampere to provide development services to the Company under one or more statements of work. … For the three months ended June 30, 2026, the Company recognized expenses under the Ampere Development Agreement of $ 5.0 million.”

— ARM 6-K, filed 2026-07-29 EDGAR · View source filing ↗

“IP revenue grew more than 40% year-over-year, driven by strong demand for Cadence’s Star IP portfolio, highlighted by a significant agreement with Intel and additional wins with leading semiconductor companies”

— CDNS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“Vector Core Compute (VC2) unveiled a disaggregated agentic cloud combining Intel® Xeon® processors, SambaNova RDUs and NVIDIA Blackwell GPUs”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel expanded its purpose-built silicon business beyond networking and IPUs through a strategic collaboration with Fortinet to develop Fortinet Security Processor 6 using Intel's advanced design, packaging and manufacturing capabilities.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“In June 2026, we announced a technology partnership with NVIDIA Corporation (“NVIDIA”) to advance next-generation memory aligned with NVIDIA’s AI infrastructure roadmap, which also includes the supply of memory semiconductors.”

— SKHY F-1/A, filed 2026-07-06 EDGAR · View source filing ↗

“Broadcom Inc. (“Broadcom”) and Apple Inc. (“Apple”) have agreed to expand their long-standing technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply a range of custom ASIC silicon products for use in multiple generations of Apple products.”

— AVGO 8-K, filed 2026-07-06 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 EDGAR · View source filing ↗

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“Primary source of supply Primary source of supply Status Stable Stable Stable Stable Stable Stable Stable Stable Stable Stable INTEL NVIDIA AMD HP-SINGAPO SK Hynix WT MICROELECTRONICS CO., LTD WORLD PEACE INDUSTRIAL CO., LTD Supreme Electronics Co., Ltd. Promate Electronic Co., Ltd. Weikeng Industrial Co., Ltd.”

— Gigabyte Technology Annual report, filed 2026-06-09 TWSE (English translation of the Chinese original) · View source filing ↗

“Integrate Nvidia BlueField®‑4 DPUs to provide cloud network acceleration, enhanced security, and flexible GPU computing for large‑scale AI environments”

— Pegatron Annual report, filed 2026-05-28 TWSE (English translation of the Chinese original) · View source filing ↗

“Consumer systems (laptops, 2‑in‑1s, and Mini PCs) are primarily designed on Intel Panther Lake, Lunar Lake, Arrow Lake, Raptor Lake Refresh, Twin Lake, AMD Ryzen AI series, and ARM‑based CPU platforms, and support next‑generation operating systems.”

— Pegatron Annual report, filed 2026-05-28 TWSE (English translation of the Chinese original) · View source filing ↗

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“Intel and Google announced a multiyear collaboration for continued deployment of Intel ® Xeon ® processors across Google’s workload-optimized instances, including the latest Intel ® Xeon ® 6 processors powering C4 and N4 instances. … The collaboration also includes co-development of custom ASIC infrastructure processing units (IPUs) designed to improve utilization, reduce complexity, and scale AI workloads more efficiently.”

— INTC 8-K, filed 2026-04-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K, filed 2026-07-23 EDGAR · View source filing ↗

“AMD and Tata Consultancy Services (TCS) are co-developing AMD Helios-based rack-scale AI infrastructure to accelerate enterprise AI deployments and sovereign AI initiatives in India.”

— AMD 8-K, filed 2026-05-05 EDGAR · View source filing ↗

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F, filed 2026-04-30 EDGAR · View source filing ↗

“In May 2025, we announced the M2000 supercomputer. The M2000 is a specialized, AI-accelerated platform co-developed with NVIDIA to dramatically speed up complex simulations in fields like semiconductor design, aerospace and defense, and drug discovery.”

— CDNS 10-K, filed 2026-02-19 EDGAR · View source filing ↗

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K, filed 2026-02-04 EDGAR · View source filing ↗

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K, filed 2026-02-03 EDGAR · View source filing ↗

“Announced a collaboration with Intel to jointly develop multiple generations of custom data center and PC products with NVIDIA NVLink.”

— NVDA 8-K, filed 2025-11-19 EDGAR · View source filing ↗

“On August 17, 2026, NVIDIA Corporation (“NVIDIA”) announced a multi-year partnership with SB Energy Corp. (collectively with its affiliates, “SB Energy”) to advance the development of the PORTS Technology Campus, a large-scale AI data center campus in Pike County, Ohio (the “Portsmouth Site”).”

— NVDA 8-K, filed 2026-08-17 EDGAR · View source filing ↗

“Announced multi-year strategic agreements with Coherent, Corning and Lumentum to accelerate innovation in advanced optics technologies.”

— NVDA 8-K, filed 2026-05-20 EDGAR · View source filing ↗

“Demonstrated ecosystem partnership and compatibility at AMD Advancing AI 2026 with multiple exhibits highlighting Astera Labs’ solutions to resolve data movement bottlenecks across PCIe, CXL, and Ethernet. … Joint architectures included AMD Instinct platforms operating with Scorpio P-Series 320L for fabric optimization, Leo CXL memory controller for smart memory tiering, and Taurus 1.6T Smart Ethernet Retimers for scale-out connectivity, all with full-stack interop validated from end to end.”

— ALAB 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Astera Labs’ expanded Taiwan footprint positions the company to bring together broader engineering, cross-functional support, and closer business coordination with key AI platform providers including AMD, Arm, Intel, and NVIDIA.”

— ALAB 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Announced a collaboration with Cerebras to bring together AMD Helios and Cerebras Wafer-Scale Engine to improve efficiency, scalability and economics for ultra-low-latency inference serving.”

— AMD 8-K, filed 2026-08-04 EDGAR · View source filing ↗

“Deepened collaboration with NVIDIA MGX Ecosystem, accelerating 800V DC rack architectures for next-gen AI DC’s”

— NVTS 8-K, filed 2026-07-27 EDGAR · View source filing ↗

“Our major competitors in the DRAM market include Samsung Electronics Co., Ltd. (“Samsung Electronics”), Micron Technology, Inc. (“Micron Technology”) and ChangXin Memory Technologies (“CXMT”).”

— SKHY F-1/A, filed 2026-07-06 EDGAR · View source filing ↗

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K, filed 2026-05-08 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. (“AMD”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Alchip Technologies (“Alchip”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Ayar Labs, Inc. (“Ayar Labs”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. (“Broadcom”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Cisco Systems, Inc. (“Cisco”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Global Unichip Corporation (“GUC”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Lightmatter, Inc. (“Lightmatter”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … MACOM Technology Solutions Holdings, Inc.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Montage Technology”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Nvidia Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Phison Electronics Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated (“Qualcomm”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Ranovus Inc. (“Ranovus”)”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Realtek Semiconductor Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Silicon Motion Technology Corporation”

— MRVL 10-K, filed 2026-03-11 EDGAR · View source filing ↗