AI Data-Center Compute & Interconnect — Supply-Chain Map

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“our largest customer individually, Arm China, accounted for approximately 16%, 17% and 21% of our total revenue … We utilize our commercial relationship with Arm Technology (China) Co. Limited ("Arm China") to access the PRC market.”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K, filed 2026-02-17 · View source filing ↗

“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K, filed 2026-01-23 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“Nuvia’s Architecture License Agreement (the “Nuvia ALA”) with us”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“recognized expenses under a service share arrangement with Arm China of $63.3 million, $59.4 million, and $74.1 million, respectively”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“The Company continues to have licensing and servicing arrangements with Ampere for which the Company may earn fees for services provided.”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“For the fiscal years ended March 31, 2026, 2025 and 2024, prior to resignation, the Company incurred subscription and other costs of $6.1 million, $10.4 million and $10.6 million, respectively, from Linaro.”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K, filed 2026-02-25 · View source filing ↗

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

— ALAB 10-K, filed 2026-02-20 · View source filing ↗

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”

— ALAB 10-K, filed 2026-02-20 · View source filing ↗

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”

— ALAB 10-K, filed 2026-02-20 · View source filing ↗

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Intel Corporation * * 12.4 % 12.0 % * 17.1 % 16.7 % 15.7 %”

— FORM 10-K, filed 2026-02-20 · View source filing ↗

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K, filed 2026-02-18 · View source filing ↗

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K, filed 2026-02-18 · View source filing ↗

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“In May 2025, we announced the M2000 supercomputer. The M2000 is a specialized, AI-accelerated platform co-developed with NVIDIA to dramatically speed up complex simulations in fields like semiconductor design, aerospace and defense, and drug discovery.”

— CDNS 10-K, filed 2026-02-19 · View source filing ↗

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“We partnered with Oracle to develop our ZeroFlap Optics”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“Created switch cable and open-sourced implementation with Microsoft to realize their vision for a highly reliable network-managed dual-ToR architecture”

— CRDO 10-K, filed 2026-06-15 · View source filing ↗

“we recently entered into a strategic partnership with Danantara Indonesia, the sovereign investment institution of the Republic of Indonesia”

— ARM 20-F, filed 2026-05-26 · View source filing ↗

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F, filed 2026-04-30 · View source filing ↗

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F, filed 2026-02-27 · View source filing ↗

“Sanmina will also be our preferred partner for manufacturing capabilities in building complex AI solutions.”

— AMD 10-K, filed 2026-02-04 · View source filing ↗

“We and Ablecom jointly established Super Micro Asia Science and Technology Park, Inc. (the "Management Company") in Taiwan to manage the common areas shared by us and Ablecom for its separately constructed manufacturing facilities.”

— SMCI 10-K, filed 2025-08-28 · View source filing ↗

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K, filed 2026-05-08 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. ("AMD")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Alchip Technologies ("Alchip")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Ayar Labs, Inc. ("Ayar Labs")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. ("Broadcom")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Cisco Systems, Inc. ("Cisco")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Global Unichip Corporation ("GUC")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Lightmatter, Inc. ("Lightmatter")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … MACOM Technology Solutions Holdings, Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Montage Technology”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Nvidia Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Phison Electronics Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated ("Qualcomm")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Ranovus Inc. ("Ranovus")”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Realtek Semiconductor Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Silicon Motion Technology Corporation”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗

“Companies that compete directly with our businesses include, but are not limited to, … Socionext Inc.”

— MRVL 10-K, filed 2026-03-11 · View source filing ↗