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Rambus — 供應鏈與商業關係

下方的每一段關係都源自公開公司申報文件中的逐字引用，點名了交易對手，並附有一鍵連結至原始文件。

點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠＝供應 · 橘虛線＝競爭 · 藍＝合作 · 紫＝持股 · 灰虛線＝暫停 · 如何閱讀這些資料。

在完整地圖中查看 Rambus →

23 家客戶8 家競爭對手3 份來源申報文件

收錄於供應鏈主題地圖：AI 資料中心運算與互連

客戶（其供應的公司）

供應給 → AMD
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
AMD 已取得 Rambus 的專利授權。（以原文為準）
供應給 → Amlogic
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Amlogic 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Broadcom
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Broadcom 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Changxin Memory
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Changxin Memory 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → IBM
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
IBM 已取得 Rambus 的專利授權。（以原文為準）
供應給 → Infineon
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Infineon 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Kioxia
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Kioxia 是已取得 Rambus 專利授權的公司之一。（以原文為準）
供應給 → Marvell
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Rambus 指出 Marvell 等公司已取得其專利授權。（以原文為準）
供應給 → MediaTek
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
MediaTek 是 Rambus 的專利授權客戶之一。（以原文為準）
供應給 → Micron
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Micron 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Nanya
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Nanya 已取得 Rambus 的專利授權。（以原文為準）
供應給 → Nuvoton
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Rambus 的專利已授權給 Nuvoton 等多家公司。（以原文為準）
供應給 → NVIDIA
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
NVIDIA 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Phison
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Phison 等多家公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → Qualcomm
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Qualcomm 已取得 Rambus 的專利授權。（以原文為準）
供應給 → Samsung
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Rambus 的專利已授權給 Samsung 等公司。（以原文為準）
供應給 → Silicon Motion Technology
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Silicon Motion Technology 是 Rambus 的專利授權對象之一。（以原文為準）
供應給 → SK Hynix
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
SK Hynix 已獲得 Rambus 的專利授權。（以原文為準）
供應給 → Socionext
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Socionext 已取得 Rambus 的專利授權。（以原文為準）
供應給 → STMicroelectronics
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
STMicroelectronics 已取得 Rambus 的專利授權。（以原文為準）
供應給 → Toshiba
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Toshiba 等公司已取得 Rambus 的專利授權。（以原文為準）
供應給 → WDC
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
WDC（Western Digital）已取得 Rambus 的專利授權。（以原文為準）
供應給 → Winbond
申報於 2026-02-18 · 143 天前
“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Winbond 是已取得 Rambus 專利授權的公司之一。（以原文為準）

競爭對手

相互競爭 ↔ Marvell
申報於 2026-03-11 · 122 天前
“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”
— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗
Rambus 是 Marvell 的直接競爭者之一。（以原文為準）
相互競爭 ↔ Astera Labs
申報於 2026-02-20 · 141 天前
“Our principal competitors include Broadcom, Inc., Credo Technology Group Holding Ltd., Marvell Technology, Inc., Microchip Technology Inc., Montage Technology, Parade Technologies, Ltd., and Rambus Inc.”
— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗
Astera Labs 將 Rambus 列為其主要競爭對手之一。（以原文為準）
相互競爭 ↔ Monolithic Power
申報於 2026-02-18 · 143 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Monolithic Power 在記憶體介面晶片市場與 Rambus 等國際半導體公司競爭。（以原文為準）
相互競爭 ↔ Montage Technology
申報於 2026-02-18 · 143 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Montage Technology是Rambus在記憶體介面晶片市場的競爭對手之一。（以原文為準）
相互競爭 ↔ Renesas
申報於 2026-02-18 · 143 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
在記憶體介面晶片市場，Rambus 的競爭對手包括 Renesas。（以原文為準）
相互競爭 ↔ Texas Instruments
申報於 2026-02-18 · 143 天前
“In the memory interface chip market, we compete with international semiconductor companies, including but not limited to Monolithic Power Systems, Montage Technology, Renesas and Texas Instruments.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
Rambus 在記憶體介面晶片市場與 Texas Instruments 等國際半導體公司競爭。（以原文為準）
相互競爭 ↔ Cadence
申報於 2026-02-18 · 143 天前
“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
在矽智財市場，Rambus與Cadence是競爭對手。（以原文為準）
相互競爭 ↔ Synopsys
申報於 2026-02-18 · 143 天前
“In the Silicon IP market, Rambus competes with the in-house design teams at our potential customers, as well as with third-party IP suppliers, such as Cadence and Synopsys.”
— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗
在矽智財市場，Rambus 的競爭對手包括 Synopsys。（以原文為準）