TSMC — 供應鏈與商業關係

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

SiTime 主要依賴 TSMC 進行其類比電路的製造。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 在晶圓生產中使用多種晶圓代工廠，主要由 GlobalFoundries 和 TSMC 供應。（以原文為準）

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Allegro MicroSystems 主要依賴 TSMC 等第三方晶圓代工廠進行晶圓製造。（以原文為準）

“In 2025, we had total sales of NT $31,094 million (US $991 million) to GUC, representing 0.8% of our total revenue.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

2025 年，TSMC 對 GUC 的銷售額佔其總營收的 0.8%。（以原文為準）

“For GaN products, our existing wafer fabrication partner is TSMC located in Taiwan.”

— NVTS 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Navitas 的 GaN 產品現有晶圓代工合作夥伴為 TSMC。（以原文為準）

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 利用 TSMC 等晶圓代工廠生產其半導體晶圓。（以原文為準）

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 採用無晶圓廠模式，與 TSMC 合作製造其所有 IC。（以原文為準）

“We partner with Taiwan Semiconductor Manufacturing Company ("TSMC") to develop and manufacture on 16nm technology, which is used in our Avant and Nexus 2 platforms of FPGA products, and to manufacture our 350nm, 130nm, 55nm and 40nm products.”

— LSCC 10-K，申報於 2026-02-13 · 查看原始申報文件 ↗

Lattice與TSMC合作，使用16nm技術開發及製造其Avant與Nexus 2 FPGA平台產品，並製造其350nm、130nm、55nm及40nm產品。（以原文為準）

“We currently partner primarily with Taiwan Semiconductor Manufacturing Co. (“TSMC”) and Semiconductor Manufacturing International Corporation (“SMIC”) to manufacture the majority of our semiconductor wafers.”

— SLAB 10-K，申報於 2026-02-10 · 查看原始申報文件 ↗

Silicon Labs 主要與 TSMC 合作製造其大部分半導體晶圓。（以原文為準）

“We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 利用 TSMC 生產其 HPC、FPGA 及自適應 SoC 產品之晶圓。（以原文為準）

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 的前端晶圓製造多數外包給外部晶圓代工廠，其中 TSMC 在 2025 會計年度生產了約 95% 的晶圓。（以原文為準）

“We currently source more than half of our wafer requirements annually from third-party wafer fabrication foundries, such as Taiwan Semiconductor Manufacturing Company (TSMC) and others”

— ADI 10-K，申報於 2025-11-25 · 查看原始申報文件 ↗

Analog Devices 每年超過一半的晶圓需求來自第三方晶圓代工廠，其中包括 TSMC。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要晶圓代工供應商包括 TSMC。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 · 查看原始申報文件 ↗

在截至2025年、2024年及2023年6月30日的會計年度中，TSMC是KLA營收佔比超過10%的客戶之一，主要在半導體製程控制領域。（以原文為準）

“In 2025, we had total purchases of NT$ 878 million (US$ 28 million) from VIS, representing 0.1% of our total cost of revenue.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

TSMC 在 2025 年向 VIS 採購總額為新台幣 8.78 億元（約 2800 萬美元），佔 TSMC 總營運成本 0.1%。（以原文為準）

“In 2025, we had total purchases of NT$ 4,113 million (US$ 131 million) from SSMC, representing 0.3% of our total cost of revenue.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

2025年，TSMC向SSMC採購總額NT$4,113 million（US$131 million），佔TSMC總營收成本0.3%。（以原文為準）

“In 2025, we incurred total manufacturing expenses of NT$ 5,448 million (US$ 174 million) from Xintec, representing 0.4% of our total cost of revenue.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

TSMC在2025年因向Xintec採購而產生製造費用新台幣54.48億元，佔其總銷貨成本0.4%。（以原文為準）

“we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award”

— ASML 20-F，申報於 2026-02-25 · 查看原始申報文件 ↗

ASML 曾獲 TSMC 頒發「綠色製造卓越獎」。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Taiwan Semiconductor Manufacturing Company Ltd. * * 10.4 % * * * * *”

— FORM 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

TSMC 在 FormFactor 的某些季度營收中佔比 10% 以上。（以原文為準）

“Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16%”

— ENTG 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

TSMC 佔 Entegris 淨銷售額的 16%。（以原文為準）

“Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2025-08-11 · 查看原始申報文件 ↗

TSMC 是 Lam Research 在截至 2025 年 6 月 29 日、2024 年 6 月 30 日及 2023 年 6 月 25 日之會計年度內最重要的客戶之一。（以原文為準）

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 與 TSMC 共同持有合資公司 SSMC。（以原文為準）

“In May 2026, SSS and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) entered into a non-binding memorandum of understanding to pursue a strategic partnership for the development and manufacturing of next-generation image sensors.”

— SONY 20-F，申報於 2026-06-18 · 查看原始申報文件 ↗

Sony 與 TSMC 於 2026 年 5 月簽署了一份非約束性備忘錄，以尋求在下一代影像感測器的開發與製造上建立策略合作關係。（以原文為準）

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 與 TSMC 自 1997 年起維持策略聯盟，ASE 為 TSMC 的非獨家首選封測服務供應商。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 TSMC 等公司簽訂了專利交叉授權協議。（以原文為準）

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 的封測業務面臨來自 TSMC 的競爭，因為 TSMC 提供了先進封裝技術如 InFO。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 的主要競爭對手包括 TSMC。（以原文為準）

“including at one of our key foundry competitors, TSMC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

TSMC 是 Intel 的關鍵晶圓代工競爭對手之一。（以原文為準）

“In October 2024, we acquired additional shares in VIS’ capital increase transaction.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

TSMC 於 2024 年 10 月參與 VIS 的增資交易，取得額外股份。（以原文為準）

“In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

TSMC 於 2003 年 1 月收購了 GUC 52.0% 的股權。（以原文為準）