UMC — 供應鏈與商業關係

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

SiTime 主要依賴 UMC 進行其類比電路製造。（以原文為準）

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Allegro MicroSystems 主要依賴 UMC 等第三方晶圓代工廠製造晶圓。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Texas Instruments 是 UMC 的主要客戶之一。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 是 UMC 的主要客戶之一，屬於整合元件製造商。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 的主要客戶包括 MediaTek 等領先的無晶圓廠設計公司。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Realtek是UMC的主要客戶之一（以營收計），屬於領先的無晶圓廠設計公司。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Novatek 是 UMC 的主要客戶之一（一家領先的無晶圓廠設計公司）。（以原文為準）

“We provide foundry services to these fabless design companies … Silicon Integrated Systems Corp.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Silicon Integrated Systems 是 UMC 提供晶圓代工服務的 fabless 設計公司之一。（以原文為準）

“We provide foundry services to these fabless design companies … Faraday Technology Corp.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 為無晶圓廠設計公司 Faraday Technology 提供晶圓代工服務。（以原文為準）

“UMC licensed its 0.13um process technology to Hejian Technology (Suzhou) Co., Ltd.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC將其0.13微米製程技術授權給Hejian Technology Suzhou。（以原文為準）

“UMC licensed its 28nm process technology to United Semiconductor (Xiamen) Co., Ltd. … UMC licensed its 80/90nm process technology to United Semiconductor (Xiamen) Co., Ltd.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 將其 28nm 及 80/90nm 製程技術授權給 United Semiconductor Xiamen。（以原文為準）

“Lattice partners with United Microelectronics Corporation ("UMC") and its subsidiary United Semiconductor Japan Corporation ("USJC") to manufacture our products on its 130nm, 90nm, 65nm, and 40nm CMOS process technologies, as well as embedded flash memory in these process nodes.”

— LSCC 10-K，申報於 2026-02-13 · 查看原始申報文件 ↗

Lattice與UMC合作，由UMC以多種製程技術為Lattice製造產品。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 向 Shin-Etsu 等公司採購大部分矽晶圓。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Globalwafers 是 UMC 的主要矽晶圓供應商之一。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 向 Sumco 等供應商採購大部分矽晶圓。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 向 Formosa Sumco Technology 等供應商採購大部分矽晶圓。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 向 Soitec 採購矽晶圓，Soitec 是其主要供應商之一。（以原文為準）

“On December 8, 2025, we announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate our silicon photonics roadmap.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 Imec 簽署了一項授權協議，以取得 Imec 的 iSiPP300 矽光子製程技術。（以原文為準）

“we entered into a corporate power purchase agreement (“CPPA”) with Fengmiao I Offshore Wind Farm”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 Fengmiao I Offshore Wind Farm 簽訂了企業購電協議。（以原文為準）

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 將封測服務外包給 SPIL。（以原文為準）

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 將封測服務外包給 ASE 等供應商。（以原文為準）

“IBM licensed its 20nm CMOS and FinFET technology to UMC”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

IBM 將其 20nm CMOS 及 FinFET 技術授權給 UMC。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 Avalanche 在 2018 年合作，共同開發及生產 MRAM，為 22 奈米技術提供嵌入式快閃記憶體以外的替代方案。（以原文為準）

“we currently have patent cross-licensing agreements with several companies, including International Business Machines Corporation, or IBM.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 IBM 有專利交叉授權協議。（以原文為準）

“In December 2025, we signed a MOU with Polar Semiconductor, LLC to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace and defense.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Polar Semiconductor 與 UMC 於 2025 年 12 月簽署備忘錄，探討合作以提供美國本土 8 吋晶圓生產。（以原文為準）

“We and Cadence Design Systems collaborate on certification of analog/mixed-signal flow for 28HPC+ process.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Cadence 和 UMC 合作認證 28HPC+ 製程的類比/混合訊號流程。（以原文為準）

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC與Broadcom簽訂了專利交叉授權協議。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries和UMC都是主要的競爭對手。（以原文為準）

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel Foundry 的其他競爭者包括 UMC。（以原文為準）

“Bargain purchase gain, which is derived from the acquisition of significant influence over SILICON INTEGRATED SYSTEMS CORP. (SIS).”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 因取得對 Silicon Integrated Systems 的重大影響力而產生議價購買利益。（以原文為準）

“On March 22, 2024, our board approved capital injection of up to NT$800 million in Faraday Technology Corp. to participate in its capital increase.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 董事會核准向 Faraday Technology 注資最高 8 億新台幣，參與其增資。（以原文為準）

“On December 17, 2025, our board approved capital injection of up to NT$700 million in Unimicron Technology Corp. to participate in its capital increase.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 於 2025 年 12 月 17 日經董事會核准，對 Unimicron 注資最高新臺幣 7 億元，參與其增資。（以原文為準）