Semiconductor Equipment & Materials — Supply-Chain Map
The picks and shovels of chipmaking: lithography, deposition, etch, and metrology tools, plus the specialty materials that keep every fab in the world running.
Every chip is built with highly specialized manufacturing tools and consumable materials. The map takes in the lithography, deposition, etch, and metrology systems that pattern and inspect wafers, along with the specialty chemicals, gases, optics, and components that keep fabrication lines running. These suppliers sit upstream of every foundry and integrated device maker, so their relationships reach across the entire semiconductor industry.
Dark nodes are this theme’s core companies. Click any company to open its page · drag/zoom to explore · hover a line to read the source quote. Green = supplies · orange dashed = competes · blue = partners · grey dashed = suspended · how to read this data.
Core companies
Supply & manufacturing relationships (21)
“For the fiscal years ended June 30, 2026, 2025 and 2024, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Year Ended June 30, 2026 2025 2024 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”— INTC 10-K, filed 2026-01-23 EDGAR · View source filing ↗
“The number of lithography systems we are able to produce is limited by the production capacity of one of our key suppliers, Carl Zeiss SMT, our sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components (which we refer to as optics). … We have an exclusive arrangement with Carl Zeiss SMT.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”— KLAC 10-K, filed 2025-08-08 EDGAR · View source filing ↗Not re-confirmed in the filer’s latest annual report (Form 10-K filed 2026-08-06): not mentioned in it.
“we stopped all of our product shipments to Huawei, historically our largest networking customer in China, in the beginning of calendar year 2024.”— LITE 10-K, filed 2026-08-17 EDGAR · View source filing ↗
“During fiscal 2026, we announced the expansion of our Sherman, Texas, manufacturing facility, entered into a strategic multi-year supply agreement with NVIDIA for advanced lasers and optical networking products supporting next-generation AI infrastructure, and received a $50 million preliminary memorandum of terms under the CHIPS and Science Act to support the Sherman expansion.”— COHR 10-K, filed 2026-08-14 EDGAR · View source filing ↗
“In January 2025, we received an inquiry from BIS concerning past product sales to Huawei … We have stopped shipping products to Huawei”— COHR 10-K, filed 2026-08-14 EDGAR · View source filing ↗
“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“Received a 2026 Intel EPIC Supplier Award for Excellence in Technology Development.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”— ASX 20-F, filed 2026-04-01 EDGAR · View source filing ↗
“Our ATS segment customers include Applied Materials, Inc., LAM Research and Honeywell Inc.”— CLS 10-K, filed 2026-02-27 EDGAR · View source filing ↗
“Our ATS segment customers include Applied Materials, Inc., LAM Research and Honeywell Inc.”— CLS 10-K, filed 2026-02-27 EDGAR · View source filing ↗
“we were honored to receive the TSMC Supplier ‘Excellence in Green Manufacturing’ Award”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“Received 2025 TSMC Excellent Performance Awards for Excellent Technology Development and Production Support and Excellent Contribution in Green Manufacturing.”— AMAT 8-K, filed 2026-02-12 EDGAR · View source filing ↗
“Percentage of net sales to top customers: Taiwan Semiconductor Manufacturing Company (TSMC) 16%”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Mit der Strategic Business Unit (SBU) Semiconductor & Advanced Manufacturing ist Jenoptik ein globaler OEM-Lieferant für Lösungen auf Basis von Photonik. … Die SBU arbeitet mit führenden internationalen Herstellern der Halbleiterausrüstungsindustrie, wie z. B. ASML, zusammen.”— JENOPTIK AG Annual report (Geschäftsbericht), filed 2025-12-31 (German statutory annual report; quote in the original German) · View source filing ↗“The SBU collaborates with leading international manufacturers in the semiconductor equipment industry, such as ASML.”— Jenoptik Annual Report 2025 (official English translation) · View source filing ↗(Official English translation published by the company; the German original prevails)
“Significant customers Total revenues, by percentage, from individual customers representing 10% or more of total revenues in the respective periods were as follows: … Lumentum Operations LLC * * 15.4 %”— FN 10-K, filed 2025-08-19 EDGAR · View source filing ↗Not re-confirmed in the filer’s latest annual report (Form 10-K filed 2026-08-18): fell below the ≥10% disclosure threshold.
“Other customers, such as FiberHome Technologies Group”— LITE 10-K, filed 2025-08-19 EDGAR · View source filing ↗
Partnerships & collaborations (16)
“Announced a long-term joint development agreement with EssilorLuxottica to accelerate the commercialization of next-generation intelligent optical systems for augmented reality and AI-powered smart eyewear.”— AMAT 8-K, filed 2026-08-13 EDGAR · View source filing ↗
“On September 9, 2025, ASML and Mistral AI announced an investment and partnership agreement for which ASML invested € 1.3 billion in Mistral AI’s Series C funding round as lead investor.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“We signed a joint development agreement with Applied Materials in October 2020 to develop the industry’s first integrated equipment solution for die-based hybrid bonding.”— BE Semiconductor Industries N.V. Annual report (ESEF), filed 2023-12-31 ESEF · View source filing ↗
“SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) will join the EPIC Center as an innovation partner, bringing together SCREEN SPE’s expertise in wafer cleaning technology with Applied's leadership in materials engineering to develop co-optimized process solutions for the world’s most advanced chips.”— AMAT 8-K, filed 2026-08-13 EDGAR · View source filing ↗
“Announced multi-year strategic agreements with Coherent, Corning and Lumentum to accelerate innovation in advanced optics technologies.”— NVDA 8-K, filed 2026-05-20 EDGAR · View source filing ↗
“Announced multi-year strategic agreements with Coherent, Corning and Lumentum to accelerate innovation in advanced optics technologies.”— NVDA 8-K, filed 2026-05-20 EDGAR · View source filing ↗
“These engagements build upon the previously announced partnership with Samsung Electronics.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“A new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“A long-term collaboration agreement between Applied and SK hynix to accelerate the development and deployment of next-generation DRAM and high-bandwidth memory (HBM) essential for AI and high-performance computing.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“Applied and Micron Technology are working to develop next-generation DRAM, HBM and NAND solutions that increase the energy-efficient performance of AI systems, bringing together advanced R&D capabilities from Applied’s EPIC Center in Silicon Valley and Micron’s state-of-the-art innovation center in Boise, Idaho.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“Joined Synopsys and NVIDIA in a collaboration to advance AI and quantum chemistry R&D with accelerated materials modeling.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“Joined Synopsys and NVIDIA in a collaboration to advance AI and quantum chemistry R&D with accelerated materials modeling.”— AMAT 8-K, filed 2026-05-14 EDGAR · View source filing ↗
“Our relationship with Carl Zeiss SMT GmbH is structured as a strategic alliance”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“In 2025, ASML and imec entered a new five- year collaboration, with ASML supporting the joint ESG research program.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“Intel Foundry and ASML have demonstrated technical viability of the most advanced lithography scanner available in delivering improved accuracy and productivity that positions High Numerical Aperture (High NA) EUV for future high-volume manufacturing.”— INTC 8-K, filed 2026-01-22 EDGAR · View source filing ↗
Competitive landscape (30)
Showing 25 of 30 — strongest disclosure signals first, then most recent. The map above and each company page hold the full set.
“Our primary competitor in the dielectric and metals deposition market is Applied Materials, Inc.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“For ALD and PECVD, we also compete against ASM International and Wonik IPS.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“For ALD and PECVD, we also compete against ASM International and Wonik IPS.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“In the etch market, our primary competitors are Applied Materials, Inc.; Hitachi, Ltd.; and Tokyo Electron, Ltd.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“In the etch market, our primary competitors are Applied Materials, Inc.; Hitachi, Ltd.; and Tokyo Electron, Ltd.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“our primary competitors in the wet clean market are Screen Holding Co., Ltd.; Semes Co., Ltd.; and Tokyo Electron, Ltd.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“our primary competitors in the wet clean market are Screen Holding Co., Ltd.; Semes Co., Ltd.; and Tokyo Electron, Ltd.”— LRCX 10-K, filed 2026-08-07 EDGAR · View source filing ↗
“In each of our product markets, we have many competitors, including companies such as Applied Materials, Inc., ASML Holding N.V., Hitachi High-Tech Corporation, Lasertec, Inc. and Onto Innovation, Inc.”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“In each of our product markets, we have many competitors, including companies such as Applied Materials, Inc., ASML Holding N.V., Hitachi High-Tech Corporation, Lasertec, Inc. and Onto Innovation, Inc.”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“In each of our product markets, we have many competitors, including companies such as Applied Materials, Inc., ASML Holding N.V., Hitachi High-Tech Corporation, Lasertec, Inc. and Onto Innovation, Inc.”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“In each of our product markets, we have many competitors, including companies such as Applied Materials, Inc., ASML Holding N.V., Hitachi High-Tech Corporation, Lasertec, Inc. and Onto Innovation, Inc.”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“In each of our product markets, we have many competitors, including companies such as Applied Materials, Inc., ASML Holding N.V., Hitachi High-Tech Corporation, Lasertec, Inc. and Onto Innovation, Inc.”— KLAC 10-K, filed 2026-08-06 EDGAR · View source filing ↗
“We compete primarily with Canon and Nikon in respect of DUV systems.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“We compete primarily with Canon and Nikon in respect of DUV systems.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“We also compete with providers of applications that support or enhance complex patterning solutions, such as Applied Materials Inc. and KLA-Tencor Corporation.”— ASML 20-F, filed 2026-02-25 EDGAR · View source filing ↗
“Our current competitors include: … • networking products consisting of switches, network adapters (including DPUs), and cable solutions (including optical modules) include such as AMD, Arista Networks, Broadcom, Cisco Systems, Inc., Hewlett Packard Enterprise Company, Huawei, Intel, Lumentum Holdings Inc., and Marvell Technology, Inc, as well as internal teams of system vendors and large cloud services companies.”— NVDA 10-K, filed 2026-02-25 EDGAR · View source filing ↗
“In PSD, Trumpf Group, Lumentum Holdings Inc., IPG Photonics Corporation, EdgeWave GmbH and Amplitude Laser Group offer products that compete with our laser products.”— MKSI 10-K, filed 2026-02-24 EDGAR · View source filing ↗
“Coherent Corp., Excelitas Technologies Corp., Jenoptik AG and Thorlabs, Inc. offer products that compete with our laser and photonics products.”— MKSI 10-K, filed 2026-02-24 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Pall Corporation (part of Danaher Corporation)”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Shin-Etsu Polymer Co. Ltd.”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Qnity Electronics, Inc.”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Cobetter Filtration Electronics”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Gudeng Precision Industrial”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … Aicello Corporation”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗
“Notable competitors with respect to our reporting segments include: … EMD Performance Materials division of Merck KGaA”— ENTG 10-K, filed 2026-02-11 EDGAR · View source filing ↗