Bosch — 供應鏈與商業關係

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication … We have a supply agreement with Bosch under which Bosch has agreed to fabricate our MEMS wafers based on purchase orders placed by us.”

— SITM 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

SiTime 主要依賴 Bosch 進行其 MEMS 晶圓製造，並與 Bosch 簽有供應協議。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 將 Bosch 列為主要客戶之一。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的前十大終端客戶包括 Bosch。（以原文為準）

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Bosch, San'an Optoelectronics Co., … Silan Microelectronics Co. Ltd., and SiChain Semiconductor, as well as an increasing number of smaller competitors.”

— WOLF 10-K，申報於 2025-08-26 · 查看原始申報文件 ↗

Wolfspeed 的碳化矽功率元件與 Bosch 的碳化矽功率半導體解決方案競爭。（以原文為準）

“In January 2024, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors Germany GmbH, a wholly-owned subsidiary of NXP Semiconductors N.V. (“NXP”), each acquired 10% equity interest and together acquired 30% equity interest in ESMC.”

— TSM 20-F，申報於 2026-04-16 · 查看原始申報文件 ↗

Bosch 與 NXP 各自收購了 ESMC 10% 的股權（合計 30%）。（以原文為準）