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IBM — 供應鏈與商業關係

下方的每一段關係都源自公開公司申報文件中的逐字引用,點名了交易對手,並附有一鍵連結至原始文件。

點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠=供應 · 橘虛線=競爭 · 藍=合作 · 紫=持股 · 灰虛線=暫停 · 如何閱讀這些資料

2 家供應商2 家客戶2 家合作夥伴5 份來源申報文件

客戶(其供應的公司)

供應給 → Auras Technology
申報於 2026-05-21 · 102 天前
“Auras has strived to advance and optimize the liquid-cooling technology through the technology-transfer of liquid cooling thermal solution from IBM as early as 2012 years ago.”
— Auras Technology Annual report,申報於 2026-05-21 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗
Auras Technology 自 2012 年起透過 IBM 的液冷散熱技術移轉來推進並最佳化液冷技術。(以原文為準)
供應給 → UMC
申報於 2026-04-30 · 123 天前
“IBM licensed its 20nm CMOS and FinFET technology to UMC”
— UMC 20-F,申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗
IBM 將其 20nm CMOS 及 FinFET 技術授權給 UMC。(以原文為準)

供應商(供應其產品或服務的公司)

供應來自 ← Celestica
申報於 2026-02-27 · 185 天前
“Our CCS segment customers include Amazon Fulfillment Services, Inc., Meta Platforms, Inc., Google Inc., Ciena Corporation, Dell Technologies, Hewlett-Packard Enterprise, and IBM Corporation, Inc.”
— CLS 10-K,申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗
Celestica 將 IBM 列為其 CCS 部門之客戶。(以原文為準)
供應來自 ← Rambus
申報於 2026-02-18 · 194 天前
“Leading semiconductor and electronic system companies such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”
— RMBS 10-K,申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗
Rambus 將 IBM 列為已取得 Rambus 專利授權的公司之一。(以原文為準)

合作夥伴與協作

合作夥伴 ↔ UMC
申報於 2026-04-30 · 123 天前
“We also joined the IBM chip alliance, for advanced process development. … We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”
— UMC 20-F,申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗
UMC 已加入 IBM 晶片聯盟以進行先進製程開發,並與 IBM 簽訂專利交叉授權。(以原文為準)
合作夥伴 ↔ AMD
申報於 2025-11-04 · 300 天前
“IBM and AMD announced plans to combine quantum computers and high-performance compute to drive scalable, open-source next-generation computing architectures. … IBM and AMD announced a multi-year collaboration to provide Zyphra with advanced AI infrastructure, leveraging a large cluster of AMD Instinct MI350X GPUs to power next-generation multimodal AI models.”
— AMD 8-K,申報於 2025-11-04 EDGAR · 查看原始申報文件 ↗
AMD 與 IBM 宣布計畫結合量子電腦與高效能運算,推動可擴展、開源的次世代運算架構;此外,AMD 與 IBM 宣布多年合作,為 Zyphra 提供先進 AI 基礎設施,運用大型 AMD Instinct MI350X GPU 叢集驅動次世代多模態 AI 模型。(以原文為準)