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Amkor — 供應鏈與商業關係

下方的每一段關係都源自公開公司申報文件中的逐字引用,點名了交易對手,並附有一鍵連結至原始文件。

點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠=供應 · 橘虛線=競爭 · 藍=合作 · 紫=持股 · 灰虛線=暫停 · 如何閱讀這些資料

1 家供應商7 家客戶1 家合作夥伴3 家競爭對手10 份來源申報文件

它在 AI 伺服器鏈上的位置

依申報引文,這家公司被定位在 AI 伺服器鏈上的環節。

客戶(其供應的公司)

供應給 → Credo
申報於 2026-06-15 · 77 天前
“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”
— CRDO 10-K,申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗
Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。(以原文為準)
供應給 → Cirrus Logic
申報於 2026-05-21 · 102 天前
“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”
— CRUS 10-K,申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗
Cirrus Logic 將 Amkor 列為其主要封測廠商之一。(以原文為準)
供應給 → Astera Labs
申報於 2026-02-20 · 192 天前
“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”
— ALAB 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
Astera Labs 使用 Amkor 進行 IC 的組裝、封裝和測試。(以原文為準)
供應給 → Apple
申報於 2026-02-20 · 192 天前
“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
截至 2025 年 12 月 31 日止年度,對 Apple 的直接銷售佔 Amkor 淨銷售額的 29.8%。(以原文為準)
供應給 → Qualcomm
最近確認於 2026-02-20 · 192 天前 · 經 2 份申報文件佐證
“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
截至 2025 年 12 月 31 日止年度,Amkor 對 Qualcomm 的直接銷售佔其淨銷售額的 11.1%。(以原文為準)
供應給 → Lattice
申報於 2026-02-13 · 199 天前
“We have qualified two major assembly partners, ASE and Amkor Technology ("Amkor") and are second sourced where volume and customer requirements make it necessary.”
— LSCC 10-K,申報於 2026-02-13 EDGAR · 查看原始申報文件 ↗
Lattice 已認證 Amkor 為兩大封測夥伴之一,並在必要時採用第二供應來源。(以原文為準)
供應給 → Broadcom
申報於 2025-12-18 · 256 天前
“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
— AVGO 10-K,申報於 2025-12-18 EDGAR · 查看原始申報文件 ↗
Broadcom 使用第三方代工廠進行大部分組裝與測試作業,其中包括 Amkor。(以原文為準)

供應商(供應其產品或服務的公司)

供應來自 ← Besi
最近確認於 2024-12-31 · 608 天前 · 經 2 份申報文件佐證
“Our customers are primarily leading multinational chip manufacturers, foundries, assembly subcontractors and electronics and industrial companies and include Amkor, ASE, Foxconn, Infineon, InnoLight, Intel, LG Innotek, Micron, Nvidia, NXP, STMicroelectronics, Texas Instruments and TSMC.”
— BE Semiconductor Industries N.V. Annual report (ESEF),申報於 2024-12-31 ESEF · 查看原始申報文件 ↗
Besi 將 Amkor 列為其客戶。(以原文為準)

合作夥伴與協作

合作夥伴 ↔ Alphawave
申報於 2024-12-31 · 608 天前
“Additionally, highly strategic partnerships include major advanced node foundries – TSMC and Samsung and major OSATs – ASE, Amkor, Kyocera, JCET and SPIL.”
— Alphawave IP Group plc Annual report (ESEF),申報於 2024-12-31 UKSEF · 查看原始申報文件 ↗
Alphawave 將 Amkor 列為高度策略合作夥伴中的主要封測廠商。(以原文為準)

競爭對手

相互競爭 ↔ ASE
申報於 2026-02-20 · 192 天前
“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
Amkor 面臨來自 ASE 等亞洲封測服務提供者的競爭。(以原文為準)
相互競爭 ↔ JCET
申報於 2026-02-20 · 192 天前
“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
Amkor 在申報文件中指出 JCET 為其封測競爭對手。(以原文為準)
相互競爭 ↔ Powertech Technology
申報於 2026-02-20 · 192 天前
“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
— AMKR 10-K,申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗
Amkor 面臨來自 Powertech Technology 等封測服務提供者的競爭。(以原文為準)

公司公告

Amkor 自身的申報/公告,取自本站檔案:美國 SEC 財報申報(8-K Item 2.02 與 6-K 業績報告)自 2025-07-22 起,另含涵蓋範圍內的台灣證券交易所重大訊息。並非完整申報歷史;主旨一律以原文原樣呈現。

2026-07-27財報發布Amkor Technology Reports Financial Results for the Second Quarter
2026 TEMPE, Ariz. -- July 27, 2026 -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the second quarter ended June 30, 2026. Record Second Quarter 2026 Highlights • Net sales $1.90 billion, up 26% year-on-year • Gross profit $319 million, operating income $200 million
顯示更多原文
• Net in come $174 million, earnings per diluted share $0.70 • EBITDA $400 million “Amkor delivered record second quarter revenue and strong profitability, with record revenue in our Computing and Automotive & Industrial end markets," said Kevin Engel, president and chief executive officer. "During the first half of 2026, we expanded strategic partnerships across the semiconductor ecosystem, advanced key customer programs in AI and HPC, and continued the expansion of our Advanced packaging and test capacity.
(申報原文節錄,以原文為準)
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
2026-04-27財報發布Amkor Technology Reports Financial Results for the First Quarter
2026 TEMPE, Ariz. -- April 27, 2026 -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the first quarter ended March 31, 2026. First Quarter 2026 Highlights • Record first quarter net sales $1.68 billion, up 27% year-on-year • Gross profit $239 million, operating income $100 million
顯示更多原文
• Net in come $83 million, earnings per diluted share $0.33 • EBITDA $285 million “Amkor delivered a strong start to 2026 with record first quarter revenue driven by broad-based end market demand,” said Kevin Engel, Amkor’s president and chief executive officer.
(申報原文節錄,以原文為準)
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
2026-02-09財報發布Amkor Technology Reports Financial Results for the Fourth Quarter
and Full Year 2025 TEMPE, Ariz. -- February 9, 2026 -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the fourth quarter and full year ended December 31, 2025. Fourth Quarter 2025 Highlights: • Fourth quarter net sales $1.89 billion, up 16% year-on-year
顯示更多原文
• Net income $172 million, earnings per diluted share $0.69 Full Year 2025 Highlights: • Net sales $6.71 billion, up 6% year-on-year • Gross profit $939 million, operating income $467 million • Net income $374 million, earnings per diluted share $1.50 • EBITDA $1.16 billion • Net cash from operations $1.10 billion, free cash flow $308 million “2025 was a pivotal year for Amkor. We delivered strong results with record Advanced packaging and Computing revenue, executed on our strategic initiatives, and strengthened our position in the fastest growing areas of the semiconductor industry,” said Kevin Engel, Amkor’s president and chief executive officer.
(申報原文節錄,以原文為準)
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
2025-10-27財報發布Amkor Technology Reports Financial Results for the Third Quarter
2025 and Announces CEO Succession Plan TEMPE, Ariz. -- October 27, 2025 -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the third quarter ended September 30, 2025 and a chief executive officer succession plan. Third Quarter 2025 Highlights • Net sales $1.99 billion
顯示更多原文
• Gross profit $284 million, operating income $159 million • Net in come $127 million, earnings per diluted share $0.51 • EBITDA $340 million “Amkor delivered third quarter revenue of $1.99 billion, a 31% sequential increase, fueled by demand for Advanced packaging, which set a new revenue record,” said Giel Rutten, Amkor’s president and chief executive officer. “This quarter, we executed steep production ramps, achieved record revenue in our Communications and Computing end markets, and broke ground on our new Advanced packaging and test campus in Arizona, reinforcing our commitment to enable our customers’ technology roadmaps and strengthen U.S. semiconductor manufacturing.” The company also announced that Mr.
(申報原文節錄,以原文為準)
— Form 8-K · 項目 2.02, 5.02, 7.01, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗
2025-07-28財報發布Amkor Technology Reports Financial Results for the Second Quarter
2025 TEMPE, Ariz. -- July 28, 2025 -- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced financial results for the second quarter ended June 30, 2025. Second Quarter 2025 Highlights • Net sales $1.51 billion • Gross profit $182 million, operating income $92 million • Net in come $54 million, earnings per diluted share $0.22
顯示更多原文
• EBITDA $259 million “We delivered second quarter revenue of $1.51 billion, up 14% sequentially and above the high end of guidance, with double-digit growth across all end markets,” said Giel Rutten, Amkor’s president and chief executive officer. “Amkor is strengthening its strategic presence in AI, HPC, and other technologies reshaping the industry.
(申報原文節錄,以原文為準)
— Form 8-K · 項目 2.02, 9.01 · 美國 SEC EDGAR · 查看原始申報文件 ↗