Credo — 供應鏈與商業關係

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 King Yuan Electronics 進行其 IC 產品的測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 委託 Sigurd Microelectronics 進行 IC 產品測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Bizlink Technology 作為其 AEC 產品的製造承包商。（以原文為準）

“We partnered with Oracle to develop our ZeroFlap Optics”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Oracle 合作開發 ZeroFlap Optics。（以原文為準）

“Created switch cable and open-sourced implementation with Microsoft to realize their vision for a highly reliable network-managed dual-ToR architecture”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Microsoft 共同開發了交換機電纜並開源實現。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Credo 與 Marvell 等公司直接競爭。（以原文為準）

“Our principal competitors include Broadcom, Inc., Credo Technology Group Holding Ltd., Marvell Technology, Inc., Microchip Technology Inc., Montage Technology, Parade Technologies, Ltd., and Rambus Inc.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 的主要競爭對手包括 Broadcom, Inc.、Credo Technology Group Holding Ltd. 等公司。（以原文為準）

“Our significant competitors include, among others , ADI, Broadcom, Credo, Marvell, MaxLinear, Microchip, NXP, Qorvo, Semtech, Skyworks and Sumitomo”

— MTSI 10-K，申報於 2025-11-14 · 查看原始申報文件 ↗

MACOM 的重要競爭者包括 Credo。（以原文為準）

“During fiscal year 2022, the Company issued a warrant to Amazon.com NV Investment Holdings LLC (Holder) to purchase an aggregate of up to 4.1 million of our ordinary shares at an exercise price of $10.74 per share (the Customer Warrant).”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 向 Amazon 發行了一張認股權證，可購買最多 410 萬股普通股，行使價為每股 $10.74。（以原文為準）