Broadcom — 供應鏈與商業關係

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Arista Networks 主要依賴其主要的商用矽供應商 Broadcom 提供交換晶片。（以原文為準）

“Broadcom Inc. (“Broadcom”) and Apple Inc. (“Apple”) have agreed to expand their long-standing technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply a range of custom ASIC silicon products for use in multiple generations of Apple products.”

— AVGO 8-K，申報於 2026-07-06 · 查看原始申報文件 ↗

Apple 與 Broadcom 已同意擴大長期技術合作，Broadcom 將為 Apple 開發及供應客製 ASIC 矽產品。（以原文為準）

“In January 2025, we acquired certain assets and obtained non-exclusive licenses relating to Broadcom Inc.’s (“Broadcom”) Wi-Fi technology.”

— SYNA 10-K，申報於 2025-08-21 · 查看原始申報文件 ↗

Synaptics於2025年1月收購了Broadcom的Wi-Fi技術相關特定資產，並取得非獨家授權。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Broadcom 等公司已取得 Rambus 的專利授權。（以原文為準）

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 的前端晶圓製造多數外包給外部晶圓代工廠，其中 TSMC 在 2025 會計年度生產了約 95% 的晶圓。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用 ASE 等第三方封測廠商進行其大部分組裝與測試作業。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用 Foxconn 等第三方代工廠進行組裝和測試。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用第三方代工廠進行大部分組裝與測試作業，其中包括 Amkor。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom將大部分封測業務委外給SPIL等第三方代工廠。（以原文為準）

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC與Broadcom簽訂了專利交叉授權協議。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 CSG 和 ACG 業務均與 Broadcom 競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. ("Broadcom")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Broadcom 與 Marvell 在業務上直接競爭。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 將 Broadcom 列為其 SoC 產品領域的競爭對手之一。（以原文為準）

“Our principal competitors include Broadcom, Inc., Credo Technology Group Holding Ltd., Marvell Technology, Inc., Microchip Technology Inc., Montage Technology, Parade Technologies, Ltd., and Rambus Inc.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 的主要競爭對手包括 Broadcom。（以原文為準）

“Our primary key public competitors in alphabetical order include, but are not limited to, Analog Devices Inc., Broadcom Inc., Infineon Technologies AG, Microchip Technology Inc., Qualcomm Inc., Renesas Electronics Corp., STMicroelectronics NV and Texas Instruments Inc.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 將 Broadcom 列為其主要公開競爭對手之一。（以原文為準）

“• Optoelectronic Components: Broadcom, ON Semiconductor, Renesas, Toshiba.”

— VSH 10-K，申報於 2026-02-13 · 查看原始申報文件 ↗

Vishay 將 Broadcom 列為光電元件領域之競爭對手。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Broadcom 列為其 ASSP 供應商領域的競爭對手之一。（以原文為準）

“We also compete with Broadcom in the custom ASICs development market”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 在客製化 ASIC 開發市場與 Broadcom 競爭。（以原文為準）

“Our significant competitors include, among others , ADI, Broadcom, Credo, Marvell, MaxLinear, Microchip, NXP, Qorvo, Semtech, Skyworks and Sumitomo”

— MTSI 10-K，申報於 2025-11-14 · 查看原始申報文件 ↗

Broadcom是MACOM的重要競爭對手之一。（以原文為準）

“Our competitors include … Broadcom,”

— SWKS 10-K，申報於 2025-11-07 · 查看原始申報文件 ↗

Broadcom 是 Skyworks 的競爭者之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Broadcom與Qualcomm在提供裝置端AI、高效能低功耗運算及無線連接IC產品/軟體方面是競爭對手或潛在競爭對手。（以原文為準）

“Our competitors (in each case relative to only some of our products or services) include: Amazon Web Services LLC; Arista Networks, Inc.; Broadcom Inc.; Ciena Corporation; CrowdStrike Holdings, Inc.; Datadog Inc.; Dell Technologies Inc.; Dynatrace Inc.; Fortinet, Inc.; Hewlett-Packard Enterprise Company; Huawei Technologies Co., Ltd.; Microsoft Corporation; New Relic, Inc.; Nokia Corporation; Nvidia Corporation; Palo Alto Networks, Inc.; RingCentral, Inc.; Zoom Video Communications, Inc.; and Zscaler, Inc.; among others.”

— CSCO 10-K，申報於 2025-09-03 · 查看原始申報文件 ↗

Cisco 將 Broadcom 列為其部分產品或服務的競爭對手之一。（以原文為準）