Qualcomm — 供應鏈與商業關係

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

在2025會計年度，來自Samsung的收入佔Qualcomm合併營收10%以上。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Xiaomi在2025會計年度佔Qualcomm合併營收的10%或以上。（以原文為準）

“Apple purchases our MDM (or thin modem) products”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Apple 向 Qualcomm 購買 MDM（或精簡數據機）產品。（以原文為準）

“During the second quarter of fiscal 2025, we executed final agreements for new long-term licenses with two key Chinese OEMs (for which the initial terms had expired) and entered into comprehensive 4G and 5G license agreements with Transsion (a growing, China-headquartered OEM).”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 與 Transsion 簽訂了全面的 4G 和 5G 授權協議。（以原文為準）

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Qualcomm 是 Arm 的主要客戶，在截至 2026 年 3 月 31 日的財年佔 Arm 總營收的 9%。（以原文為準）

“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

截至 2025 年 12 月 31 日止年度，Amkor 對 Qualcomm 的直接銷售佔其淨銷售額的 11.1%。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Qualcomm 已取得 Rambus 的專利授權。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要晶圓代工供應商包括 TSMC。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 之主要晶圓代工供應商包括 Samsung。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

GlobalFoundries 是 Qualcomm 的晶圓代工供應商之一。（以原文為準）

“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要半導體組裝和測試供應商包括 ASE。（以原文為準）

“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要半導體封測供應商包括 SPIL。（以原文為準）

“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 將 Advanced Semiconductor Engineering、Amkor Technology、Siliconware Precision Industries 及 STATS ChipPAC 列為其主要半導體封裝與測試供應商。（以原文為準）

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

Qualcomm與STMicroelectronics於2024年宣布合作推出首款產品，旨在簡化搭載STM32 MCU的系統中無線連接的實現。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 的主要競爭對手包括 Qualcomm。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo的CSG與ACG業務均與Qualcomm競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated ("Qualcomm")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Qualcomm 列為直接競爭對手之一。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA的競爭對手包括Qualcomm等公司。（以原文為準）

“Our primary key public competitors in alphabetical order include, but are not limited to, Analog Devices Inc., Broadcom Inc., Infineon Technologies AG, Microchip Technology Inc., Qualcomm Inc., Renesas Electronics Corp., STMicroelectronics NV and Texas Instruments Inc.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的主要公開競爭對手包括 Qualcomm。（以原文為準）

“We compete with Espressif, Infineon, MediaTek, Microchip, Nordic Semiconductor, NXP, Qualcomm, Renesas, STMicroelectronics, Synaptics, Telink, Texas Instruments and others.”

— SLAB 10-K，申報於 2026-02-10 · 查看原始申報文件 ↗

Silicon Labs 與 Qualcomm 互為競爭者。（以原文為準）

“We expect continued competition from our primary FPGA competitors such as Altera, Lattice Semiconductor Corporation and Microsemi Corporation, and from ASSP vendors such as Broadcom Corporation, Marvell Technology Group, Ltd., Analog Devices, Texas Instruments Incorporated, NXP Semiconductors N.V., Qualcomm Incorporated and NVIDIA.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD預期與Qualcomm在ASSP領域持續競爭。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 面臨來自 Qualcomm 等公司基於 ARM 架構處理器的競爭。（以原文為準）

“Our competitors include … Qualcomm,”

— SWKS 10-K，申報於 2025-11-07 · 查看原始申報文件 ↗

Qualcomm 是 Skyworks 的競爭對手之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Broadcom與Qualcomm在提供裝置端AI、高效能低功耗運算及無線連接IC產品/軟體方面是競爭對手或潛在競爭對手。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

HiSilicon 是 Qualcomm 在提供裝置端 AI、高效能低功耗運算及無線連接積體電路產品領域的競爭對手或潛在競爭對手之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

MediaTek 是 Qualcomm 在裝置端 AI 與高效能運算晶片領域的競爭者之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Mobileye 與 Qualcomm 在裝置端 AI 等領域是競爭者或潛在競爭者。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 將 Samsung 列為其競爭對手或潛在競爭對手之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 將 Texas Instruments 列為其競爭者或潛在競爭者之一。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 將 Unisoc 列為其競爭對手或潛在競爭對手之一。（以原文為準）