ASE — 供應鏈與商業關係

“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”

— LSCC 10-K，申報於 2026-02-13 · 查看原始申報文件 ↗

Lattice 的所有封測作業均由 OSAT 執行，主要供應商為 ASE。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

ASE 被列為 Cirrus Logic 的主要封測廠商之一。（以原文為準）

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 將封測服務外包給 ASE 等供應商。（以原文為準）

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 委託 ASE 進行 IC 之組裝、封裝及測試。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用 ASE 等第三方封測廠商進行其大部分組裝與測試作業。（以原文為準）

“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要半導體組裝和測試供應商包括 ASE。（以原文為準）

“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 向 All Ring Tech 等國際主要製造商採購封裝設備。（以原文為準）

“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 向 Marketech Lnternational 等國際主要製造商採購封裝設備。（以原文為準）

“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 向 Grand Process Technology 採購封裝設備。（以原文為準）

“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE向Lam Research等國際大廠採購封裝設備。（以原文為準）

“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 向 Teradyne 採購測試機臺。（以原文為準）

“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 向 Advantest 等主要國際製造商購買測試機台。（以原文為準）

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 與 TSMC 自 1997 年起維持策略聯盟，ASE 為 TSMC 的非獨家首選封測服務供應商。（以原文為準）

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 的封測業務面臨來自 TSMC 的競爭，因為 TSMC 提供了先進封裝技術如 InFO。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Amkor 面臨來自 ASE 等亞洲封測服務提供者的競爭。（以原文為準）