半導體晶圓代工與先進封裝 — 供應鏈地圖

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Samsung在2026及2025兩個會計年度各佔Qorvo總營收的10%。（以原文為準）

“If we are unable to obtain 300mm SOI wafers from Soitec S.A. (“Soitec”), our primary supplier, for any reason, we expect that it would take us an extended period to find a replacement supplier on commercially acceptable terms.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 表示，若無法從其主要供應商 Soitec 取得 300mm SOI 晶圓，預期需較長時間才能找到替代供應商。（以原文為準）

“All of our assembly and test operations are performed by industry-leading outsourced assembly and test suppliers ("OSATs") with our primary supplier being Advanced Semiconductor Engineering, Inc. ("ASE").”

— LSCC 10-K，申報於 2026-02-13 · 查看原始申報文件 ↗

Lattice 的所有封測作業均由 OSAT 執行，主要供應商為 ASE。（以原文為準）

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

SiTime 主要依賴 TSMC 進行其類比電路的製造。（以原文為準）

“We currently rely primarily on Bosch and Teledyne Digital Imaging Inc. ("Teledyne") for our MEMS fabrication, and primarily on TSMC and UMC for our analog circuits fabrication”

— SITM 10-K，申報於 2026-02-11 · 查看原始申報文件 ↗

SiTime 主要依賴 UMC 進行其類比電路製造。（以原文為準）

“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

在2025會計年度，來自Samsung的收入佔Qualcomm合併營收10%以上。（以原文為準）

“Accounts receivable from individual customers representing 10% or more of accounts receivable as of June 27, 2025 and June 28, 2024, respectively, were as follows: … Nokia Corporation (1) 12.0 % 19.3 %”

— FN 10-K，申報於 2025-08-19 · 查看原始申報文件 ↗

截至2025年6月27日，Nokia佔Fabrinet應收帳款的12.0%。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 · 查看原始申報文件 ↗

在截至2025年、2024年及2023年6月30日的會計年度中，TSMC是KLA營收佔比超過10%的客戶之一，主要在半導體製程控制領域。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 · 查看原始申報文件 ↗

在截至 2025、2024 及 2023 年 6 月 30 日的會計年度中，Samsung 是 KLA 佔其營收超過 10% 的客戶之一。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 King Yuan Electronics 進行其 IC 產品的測試。（以原文為準）

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic主要使用GlobalFoundries等晶圓代工廠生產晶圓。（以原文為準）

“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 在晶圓生產中使用多種晶圓代工廠，主要由 GlobalFoundries 和 TSMC 供應。（以原文為準）

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

ASE 被列為 Cirrus Logic 的主要封測廠商之一。（以原文為準）

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 將 Amkor 列為其主要封測廠商之一。（以原文為準）

“The Company’s primary assembly and test houses include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., STATS ChipPAC Pte. Ltd., SFA Semicon Co., Ltd., and Siliconware Precision Industries Co., Ltd.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic的主要封測廠商包括SPIL等公司。（以原文為準）

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Allegro MicroSystems 主要依賴 UMC 等第三方晶圓代工廠製造晶圓。（以原文為準）

“We currently rely on a limited number of third-party wafer fabrication facilities for the fabrication of semiconductor wafers used in the manufacture of our IC products, primarily United Microelectronics Corporation (“UMC”), Polar, Tower Semiconductor Ltd. (“Tower”) and Taiwan Semiconductor Manufacturing Company (“TSMC”)”

— ALGM 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Allegro MicroSystems 主要依賴 TSMC 等第三方晶圓代工廠進行晶圓製造。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Texas Instruments 是 UMC 的主要客戶之一。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 是 UMC 的主要客戶之一，屬於整合元件製造商。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 的主要客戶包括 MediaTek 等領先的無晶圓廠設計公司。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Realtek是UMC的主要客戶之一（以營收計），屬於領先的無晶圓廠設計公司。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Novatek 是 UMC 的主要客戶之一（一家領先的無晶圓廠設計公司）。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 向 Shin-Etsu 等公司採購大部分矽晶圓。（以原文為準）

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Globalwafers 是 UMC 的主要矽晶圓供應商之一。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“In addition, we partnered with Avalanche in 2018 for the joint development and production of MRAM, providing an alternative to embedded flash for 22nm technologies.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 Avalanche 在 2018 年合作，共同開發及生產 MRAM，為 22 奈米技術提供嵌入式快閃記憶體以外的替代方案。（以原文為準）

“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”

— NVTS 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Navitas 與 GlobalFoundries 宣布建立長期策略合作夥伴關係，共同開發先進 GaN 解決方案。（以原文為準）

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 與 TSMC 共同持有合資公司 SSMC。（以原文為準）

“In May 2026, SSS and Taiwan Semiconductor Manufacturing Company Limited (“TSMC”) entered into a non-binding memorandum of understanding to pursue a strategic partnership for the development and manufacturing of next-generation image sensors.”

— SONY 20-F，申報於 2026-06-18 · 查看原始申報文件 ↗

Sony 與 TSMC 於 2026 年 5 月簽署了一份非約束性備忘錄，以尋求在下一代影像感測器的開發與製造上建立策略合作關係。（以原文為準）

“we currently have patent cross-licensing agreements with several companies, including International Business Machines Corporation, or IBM.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 與 IBM 有專利交叉授權協議。（以原文為準）

“In December 2025, we signed a MOU with Polar Semiconductor, LLC to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace and defense.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Polar Semiconductor 與 UMC 於 2025 年 12 月簽署備忘錄，探討合作以提供美國本土 8 吋晶圓生產。（以原文為準）

“We and Cadence Design Systems collaborate on certification of analog/mixed-signal flow for 28HPC+ process.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Cadence 和 UMC 合作認證 28HPC+ 製程的類比/混合訊號流程。（以原文為準）

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC與Broadcom簽訂了專利交叉授權協議。（以原文為準）

“Since 1997, we have maintained a strategic alliance with TSMC, which designates us as their non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 與 TSMC 自 1997 年起維持策略聯盟，ASE 為 TSMC 的非獨家首選封測服務供應商。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 AMD 有專利交叉授權。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 簽訂了專利交叉授權協議。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 TSMC 等公司簽訂了專利交叉授權協議。（以原文為準）

“the joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

GlobalFoundries 與 STMicroelectronics 在法國 Crolles 共同經營一座 300mm 半導體製造設施。（以原文為準）

“Our packaging and testing business also faces actual and potential competition from companies at other levels of the supply chain, which have the financial resources and technical capabilities to enter into and effectively compete within the industry. For example, TSMC has offered advanced packaging technologies such as integrated fan-out (the “InFO”) technology.”

— ASX 20-F，申報於 2026-04-01 · 查看原始申報文件 ↗

ASE 的封測業務面臨來自 TSMC 的競爭，因為 TSMC 提供了先進封裝技術如 InFO。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 的主要競爭對手包括 TSMC。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries和UMC都是主要的競爭對手。（以原文為準）

“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 將 SMIC 列為主要競爭對手之一。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 也與 Texas Instruments 等 IDM 的晶圓代工服務競爭。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 等 IDM 的晶圓代工服務競爭。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 亦與部分 IDM 的晶圓代工服務競爭，例如 Intel 及 Samsung 等公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 將 Intel 列為當前競爭對手之一。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 將 Samsung 列為其 SoC 產品領域的現有競爭者之一。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Amkor 面臨來自 ASE 等亞洲封測服務提供者的競爭。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Jcet 是 Amkor 在封測服務領域的競爭者之一。（以原文為準）

“We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Amkor 面臨來自 Powertech Technology 等封測服務提供者的競爭。（以原文為準）

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K，申報於 2026-02-09 · 查看原始申報文件 ↗

Samsung是onsemi部分產品與解決方案的競爭對手之一。（以原文為準）

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Intel 是 AMD 在 CPU 和 APU 供應上的主要競爭者。（以原文為準）

“including at one of our key foundry competitors, TSMC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

TSMC 是 Intel 的關鍵晶圓代工競爭對手之一。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 面臨來自採用 ARM 架構設計處理器之公司的競爭，例如 Apple 及其 M 系列產品。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 面臨來自 Qualcomm 等公司基於 ARM 架構處理器的競爭。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel面臨來自MediaTek（以其Kompanio產品）的顯著競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Amazon 等多家超大規模業者正在開發自有客製化晶片，與 Intel 形成競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 指出許多超大規模資料中心業者如 META 正在開發自有客製化晶片。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel與Microsoft在客製化晶片開發方面是競爭對手。（以原文為準）

“We also compete with Broadcom in the custom ASICs development market”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 在客製化 ASIC 開發市場與 Broadcom 競爭。（以原文為準）

“one of three companies (the others being TSMC and Samsung) investing in 2nm lithography”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 和 Samsung 是投資 2 奈米製程的三家公司中的兩家。（以原文為準）

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel Foundry 的其他競爭者包括 UMC。（以原文為準）