AI 資料中心運算與互連 — 供應鏈地圖

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“our largest customer individually, Arm China, accounted for approximately 16%, 17% and 21% of our total revenue … We utilize our commercial relationship with Arm Technology (China) Co. Limited ("Arm China") to access the PRC market.”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm China 是 Arm 的最大客戶，佔其總營收約 16% 至 21%；Arm 利用與 Arm China 的商業關係進入中國市場。（以原文為準）

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Qualcomm 是 Arm 的主要客戶，在截至 2026 年 3 月 31 日的財年佔 Arm 總營收的 9%。（以原文為準）

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Arista Networks 主要依賴其主要的商用矽供應商 Broadcom 提供交換晶片。（以原文為準）

“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“Broadcom Inc. (“Broadcom”) and Apple Inc. (“Apple”) have agreed to expand their long-standing technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply a range of custom ASIC silicon products for use in multiple generations of Apple products.”

— AVGO 8-K，申報於 2026-07-06 · 查看原始申報文件 ↗

Apple 與 Broadcom 已同意擴大長期技術合作，Broadcom 將為 Apple 開發及供應客製 ASIC 矽產品。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 King Yuan Electronics 進行其 IC 產品的測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 委託 Sigurd Microelectronics 進行 IC 產品測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Bizlink Technology 作為其 AEC 產品的製造承包商。（以原文為準）

“Nuvia’s Architecture License Agreement (the “Nuvia ALA”) with us”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm 與 Nuvia 之間存在 Nuvia 架構授權協議。（以原文為準）

“recognized expenses under a service share arrangement with Arm China of $63.3 million, $59.4 million, and $74.1 million, respectively”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm 與 Arm China 之間存在服務共享安排，並據此確認了費用。（以原文為準）

“The Company continues to have licensing and servicing arrangements with Ampere for which the Company may earn fees for services provided.”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm 與 Ampere 持續有授權和服務安排，Arm 可因提供服務而收取費用。（以原文為準）

“For the fiscal years ended March 31, 2026, 2025 and 2024, prior to resignation, the Company incurred subscription and other costs of $6.1 million, $10.4 million and $10.6 million, respectively, from Linaro.”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm 在截至 2026、2025 及 2024 年 3 月 31 日的會計年度中，向 Linaro 支付了訂閱及其他費用。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 是 UMC 的主要客戶之一，屬於整合元件製造商。（以原文為準）

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 委託 Fabrinet 進行組裝、測試和封裝。（以原文為準）

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 利用 TSMC 等晶圓代工廠生產其半導體晶圓。（以原文為準）

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 利用 Samsung 等晶圓代工廠生產其半導體晶圓。（以原文為準）

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 向 SK Hynix 採購記憶體。（以原文為準）

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA向Micron採購記憶體。（以原文為準）

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 委託 Foxconn 進行最終產品的組裝、測試和封裝。（以原文為準）

“We engage with independent subcontractors and contract manufacturers such as Hon Hai Precision Industry Co., Ltd., Wistron Corporation, and Fabrinet to perform assembly, testing and packaging of our final products.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 委託 Wistron 等合約製造商進行最終產品的組裝、測試與封裝。（以原文為準）

“On February 23, 2026, in connection with a strategic arrangement between Advanced Micro Devices, Inc. (“AMD”) and Meta Platforms, Inc. (“Meta”) governing the purchase of AMD Instinct™ GPU products by Meta, AMD issued to Meta a performance-based warrant”

— AMD 8-K，申報於 2026-02-24 · 查看原始申報文件 ↗

AMD 因與 Meta 的策略安排，向 Meta 發行了一份績效型認股權證。（以原文為準）

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 採用無晶圓廠模式，與 TSMC 合作製造其所有 IC。（以原文為準）

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 委託 ASE 進行 IC 之組裝、封裝及測試。（以原文為準）

“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”

— ALAB 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Astera Labs 使用 Amkor 進行 IC 的組裝、封裝和測試。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Intel Corporation * * 12.4 % 12.0 % * 17.1 % 16.7 % 15.7 %”

— FORM 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Intel 在特定季度佔 FormFactor 季度營收 10% 以上，如原文表格所示。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“In May 2025, we announced the M2000 supercomputer. The M2000 is a specialized, AI-accelerated platform co-developed with NVIDIA to dramatically speed up complex simulations in fields like semiconductor design, aerospace and defense, and drug discovery.”

— CDNS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Cadence 與 NVIDIA 共同開發了 M2000 超級電腦，這是一款專為加速半導體設計等領域複雜模擬而設計的 AI 加速平台。（以原文為準）

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 Tongfu 共同參與兩家 ATMP 合資企業。（以原文為準）

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 與 Higon 共同持有 THATIC 合資企業之權益。（以原文為準）

“We partnered with Oracle to develop our ZeroFlap Optics”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Oracle 合作開發 ZeroFlap Optics。（以原文為準）

“Created switch cable and open-sourced implementation with Microsoft to realize their vision for a highly reliable network-managed dual-ToR architecture”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Microsoft 共同開發了交換機電纜並開源實現。（以原文為準）

“we recently entered into a strategic partnership with Danantara Indonesia, the sovereign investment institution of the Republic of Indonesia”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Arm 近期與 Danantara Indonesia 建立策略夥伴關係。（以原文為準）

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC與Broadcom簽訂了專利交叉授權協議。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 AMD 有專利交叉授權。（以原文為準）

“Sanmina will also be our preferred partner for manufacturing capabilities in building complex AI solutions.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

AMD 將 Sanmina 指定為其建構複雜 AI 解決方案製造能力的首選合作夥伴。（以原文為準）

“We and Ablecom jointly established Super Micro Asia Science and Technology Park, Inc. (the "Management Company") in Taiwan to manage the common areas shared by us and Ablecom for its separately constructed manufacturing facilities.”

— SMCI 10-K，申報於 2025-08-28 · 查看原始申報文件 ↗

Supermicro 與 Ablecom 共同在台灣設立了 Super Micro Asia Science and Technology Park, Inc. 來管理雙方共用的公共區域。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 CSG 和 ACG 業務均與 Broadcom 競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭者包括 Astera Labs。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. ("AMD")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 AMD 列為與其業務直接競爭之公司。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Alchip Technologies ("Alchip")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Alchip Technologies Alchip 是與 Marvell 直接競爭的公司之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ayar Labs, Inc. ("Ayar Labs")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Ayar Labs 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. ("Broadcom")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Broadcom 與 Marvell 在業務上直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Cisco Systems, Inc. ("Cisco")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Cisco Systems, Inc.。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Credo 與 Marvell 等公司直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Global Unichip Corporation ("GUC")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 GUC 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Lightmatter, Inc. ("Lightmatter")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 與 Lightmatter 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MACOM Technology Solutions Holdings, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 與 MACOM 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

MediaTek 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Microchip Technology 列為其業務之直接競爭者。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Montage Technology”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Montage Technology 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Nvidia Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

NVIDIA 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

NXP是Marvell的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Phison Electronics Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Phison 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated ("Qualcomm")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Qualcomm 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Rambus 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ranovus Inc. ("Ranovus")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Ranovus 是與 Marvell 直接競爭的公司之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Realtek Semiconductor Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Realtek Semiconductor Corporation。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Semtech 列為其業務的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Silicon Motion Technology Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭者包括 Silicon Motion Technology Corporation。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Socionext Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Socionext 是 Marvell 的直接競爭者之一。（以原文為準）