AI 資料中心運算與互連 — 供應鏈地圖

“In August 2026, we entered into guarantees to provide credit support on the land, power, and shell buildout to secure approximately 4.25 gigawatts (GW) at SB Energy's PORTS-Pike Technology Campus in Ohio, which will exclusively host NVIDIA infrastructure under 20-year leases to OpenAI, subject to limited exceptions.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“our largest customer individually, Arm China, accounted for approximately 16%, 17% and 21% of our total revenue … We utilize our commercial relationship with Arm Technology (China) Co. Limited (“Arm China”) to access the PRC market.”

— ARM 20-F，申報於 2026-05-26 EDGAR · 查看原始申報文件 ↗

Arm China 是 Arm 的最大客戶，佔其總營收約 16% 至 21%；Arm 利用與 Arm China 的商業關係進入中國市場。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F，申報於 2026-05-26 EDGAR · 查看原始申報文件 ↗

Qualcomm 是 Arm 的主要客戶，在截至 2026 年 3 月 31 日的財年佔 Arm 總營收的 9%。（以原文為準）

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K，申報於 2026-02-17 EDGAR · 查看原始申報文件 ↗

Arista Networks 主要依賴其主要的商用矽供應商 Broadcom 提供交換晶片。（以原文為準）

“we rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“Announced the NVIDIA Vera Rubin platform is ramping into full production with racks running at partners including CoreWeave, Google Cloud, Microsoft Azure, Oracle Cloud Infrastructure and Nebius.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced the NVIDIA Vera Rubin platform is ramping into full production with racks running at partners including CoreWeave, Google Cloud, Microsoft Azure, Oracle Cloud Infrastructure and Nebius.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced the NVIDIA Vera Rubin platform is ramping into full production with racks running at partners including CoreWeave, Google Cloud, Microsoft Azure, Oracle Cloud Infrastructure and Nebius.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced the NVIDIA Vera Rubin platform is ramping into full production with racks running at partners including CoreWeave, Google Cloud, Microsoft Azure, Oracle Cloud Infrastructure and Nebius.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced the NVIDIA Vera Rubin platform is ramping into full production with racks running at partners including CoreWeave, Google Cloud, Microsoft Azure, Oracle Cloud Infrastructure and Nebius.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced that SpaceXAI will deploy NVIDIA Vera CPUs to accelerate its next generation of agentic AI applications.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Revealed that NVIDIA GPUs with Confidential Computing are now used for confidential inference in Apple’s Private Cloud Compute.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“On July 29, 2026, Marvell Technology, Inc. (the “Company”) and Google LLC (“Google”) entered into a commercial agreement relating to the Company’s development of custom semiconductor products to Google (the “Custom Products”).”

— MRVL 8-K，申報於 2026-08-19 EDGAR · 查看原始申報文件 ↗

“During fiscal year 2026, Cisco Systems, Inc., NVIDIA Corporation, Nokia Corporation and Amazon.com, Inc. contributed 19.9%, 16.3%, 10.7% and 10.5%, respectively, of our revenues.”

— FN 10-K，申報於 2026-08-18 EDGAR · 查看原始申報文件 ↗

Fabrinet 於 2026 會計年度有 16.3% 的營收來自 NVIDIA。（以原文為準）

“During fiscal 2026, we announced the expansion of our Sherman, Texas, manufacturing facility, entered into a strategic multi-year supply agreement with NVIDIA for advanced lasers and optical networking products supporting next-generation AI infrastructure, and received a $50 million preliminary memorandum of terms under the CHIPS and Science Act to support the Sherman expansion.”

— COHR 10-K，申報於 2026-08-14 EDGAR · 查看原始申報文件 ↗

Coherent 於 2026 會計年度與 NVIDIA 簽訂多年策略供應協議，由 Coherent 供應先進雷射與光網路產品，支援下一代人工智慧基礎設施。（以原文為準）

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2026-08-07 EDGAR · 查看原始申報文件 ↗

Lam Research 將 Micron 列為其 2024、2025 及 2026 會計年度的最重要客戶之一。（以原文為準）

“Expanded collaboration with Microsoft to deploy AMD Helios racks at scale on Azure to power frontier model inference.”

— AMD 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

AMD 擴大與 Microsoft 的合作，在 Azure 大規模部署 AMD Helios 機架進行前沿模型推論。（以原文為準）

“Anthropic and AMD announced a strategic agreement to deploy up to 2 GW of AMD Instinct MI450 Series GPUs in AMD Helios racks.”

— AMD 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Anthropic 達成策略協議，將部署高達 2 GW 的 AMD Instinct MI450 系列 GPU 於 AMD Helios 機架中。（以原文為準）

“The Company continues to have licensing and servicing arrangements with Ampere for which the Company may earn fees for services provided. … For the three months ended June 30, 2026 and 2025, the Company recognized revenue of $ 5.4 million and $ 0.6 million, respectively, from Ampere.”

— ARM 6-K，申報於 2026-07-29 EDGAR · 查看原始申報文件 ↗

Arm 與 Ampere 有授權及服務安排，並於截至 2026 年及 2025 年 6 月 30 日止三個月分別認列來自 Ampere 的收入 540 萬美元及 60 萬美元。（以原文為準）

“Effective March 2026, the Company entered into a development agreement with Ampere (the “Ampere Development Agreement”), enabling Ampere to provide development services to the Company under one or more statements of work. … For the three months ended June 30, 2026, the Company recognized expenses under the Ampere Development Agreement of $ 5.0 million.”

— ARM 6-K，申報於 2026-07-29 EDGAR · 查看原始申報文件 ↗

Arm 於 2026 年 3 月與 Ampere 簽訂開發協議，由 Ampere 向 Arm 提供開發服務，並於截至 2026 年 6 月 30 日止三個月認列相關費用 500 萬美元。（以原文為準）

“IP revenue grew more than 40% year-over-year, driven by strong demand for Cadence’s Star IP portfolio, highlighted by a significant agreement with Intel and additional wins with leading semiconductor companies”

— CDNS 8-K，申報於 2026-07-27 EDGAR · 查看原始申報文件 ↗

Cadence 表示其 IP 營收成長得益於與 Intel 之重大協議及對其 Star IP 之強勁需求。（以原文為準）

“Vector Core Compute (VC2) unveiled a disaggregated agentic cloud combining Intel® Xeon® processors, SambaNova RDUs and NVIDIA Blackwell GPUs”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 的 Xeon 處理器獲 Vector Core Compute 採用於其雲端方案。（以原文為準）

“Intel expanded its purpose-built silicon business beyond networking and IPUs through a strategic collaboration with Fortinet to develop Fortinet Security Processor 6 using Intel's advanced design, packaging and manufacturing capabilities.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Fortinet 策略合作，使用 Intel 的先進設計、封裝與製造能力開發 Fortinet Security Processor 6。（以原文為準）

“In June 2026, we announced a technology partnership with NVIDIA Corporation (“NVIDIA”) to advance next-generation memory aligned with NVIDIA’s AI infrastructure roadmap, which also includes the supply of memory semiconductors.”

— SKHY F-1/A，申報於 2026-07-06 EDGAR · 查看原始申報文件 ↗

SK Hynix 與 NVIDIA 宣布技術合作夥伴關係，以推進與 NVIDIA 人工智慧基礎設施藍圖相符的次世代記憶體，並包括記憶體半導體之供應。（以原文為準）

“Broadcom Inc. (“Broadcom”) and Apple Inc. (“Apple”) have agreed to expand their long-standing technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply a range of custom ASIC silicon products for use in multiple generations of Apple products.”

— AVGO 8-K，申報於 2026-07-06 EDGAR · 查看原始申報文件 ↗

Apple 與 Broadcom 已同意擴大長期技術合作，Broadcom 將為 Apple 開發及供應客製 ASIC 矽產品。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 EDGAR · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“Announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time, subject to definitive agreements.”

— NVDA 8-K，申報於 2026-08-26 EDGAR · 查看原始申報文件 ↗

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Cisco 及 HUMAIN 成立合資企業，計劃於 2030 年前部署 1 GW 的人工智慧基礎設施。（以原文為準）

“Intel and Google announced a multiyear collaboration for continued deployment of Intel ® Xeon ® processors across Google’s workload-optimized instances, including the latest Intel ® Xeon ® 6 processors powering C4 and N4 instances. … The collaboration also includes co-development of custom ASIC infrastructure processing units (IPUs) designed to improve utilization, reduce complexity, and scale AI workloads more efficiently.”

— INTC 8-K，申報於 2026-04-23 EDGAR · 查看原始申報文件 ↗

Intel 與 Google/Alphabet 宣布多年合作，持續在 Google 的工作負載最佳化實例中部署 Intel Xeon 處理器，並共同開發客製化 ASIC 基礎設施處理單元。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Siemens 列為共同開發產業特定 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Hitachi 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Echo Neurotechnologies 建立策略合作，共同開發由 Intel 處理器及專用晶片驅動的產業特定 AI 與運算解決方案。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Greenstone Biosciences 列為共同開發 AI 與運算解決方案之策略合作夥伴。（以原文為準）

“Intel announced strategic collaborations with Foxconn, Siemens, Hitachi, Echo Neurotechnologies and Greenstone Biosciences to co-develop industry-specific AI and compute solutions powered by Intel processors and purpose-built silicon.”

— INTC 8-K，申報於 2026-07-23 EDGAR · 查看原始申報文件 ↗

Intel 宣布與 Foxconn 建立策略合作關係，共同開發由 Intel 處理器驅動的產業特定人工智慧與運算解決方案。（以原文為準）

“AMD and Tata Consultancy Services (TCS) are co-developing AMD Helios-based rack-scale AI infrastructure to accelerate enterprise AI deployments and sovereign AI initiatives in India.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 與 Tata Consultancy Services 共同開發以 AMD Helios 為基礎的機架級人工智慧基礎架構，以加速印度的企業人工智慧部署與主權人工智慧計畫。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“In May 2025, we announced the M2000 supercomputer. The M2000 is a specialized, AI-accelerated platform co-developed with NVIDIA to dramatically speed up complex simulations in fields like semiconductor design, aerospace and defense, and drug discovery.”

— CDNS 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

Cadence 與 NVIDIA 共同開發了 M2000 超級電腦，這是一款專為加速半導體設計等領域複雜模擬而設計的 AI 加速平台。（以原文為準）

“We are party to two ATMP joint ventures (collectively, the ATMP JVs) with Tongfu Microelectronics Co., Ltd.”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Tongfu 共同參與兩家 ATMP 合資企業。（以原文為準）

“We have equity interests in two joint ventures (collectively, the THATIC JV) with Higon Information Technology Co., Ltd. (THATIC)”

— AMD 10-K，申報於 2026-02-04 EDGAR · 查看原始申報文件 ↗

AMD 與 Higon 共同持有 THATIC 合資企業之權益。（以原文為準）

“AMD, Cisco and HUMAIN announced a joint venture with plans to deploy 1 GW of AI infrastructure by 2030.”

— AMD 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 HUMAIN 及 Cisco 成立合資企業，計劃於 2030 年前部署 1 GW 的人工智慧基礎設施。（以原文為準）

“Announced a collaboration with Intel to jointly develop multiple generations of custom data center and PC products with NVIDIA NVLink.”

— NVDA 8-K，申報於 2025-11-19 EDGAR · 查看原始申報文件 ↗

NVIDIA 宣布與 Intel 合作，共同開發多代客製化資料中心與 PC 產品，並採用 NVIDIA NVLink。（以原文為準）

“Our major competitors in the DRAM market include Samsung Electronics Co., Ltd. (“Samsung Electronics”), Micron Technology, Inc. (“Micron Technology”) and ChangXin Memory Technologies (“CXMT”).”

— SKHY F-1/A，申報於 2026-07-06 EDGAR · 查看原始申報文件 ↗

SK Hynix 將 Micron 列為 DRAM 市場之主要競爭對手。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 的 CSG 和 ACG 業務均與 Broadcom 競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 的直接競爭者包括 Astera Labs。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. (“AMD”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 AMD 列為與其業務直接競爭之公司。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Alchip Technologies (“Alchip”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Alchip Technologies 列為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ayar Labs, Inc. (“Ayar Labs”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Ayar Labs 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. (“Broadcom”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Broadcom 與 Marvell 在業務上直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Cisco Systems, Inc. (“Cisco”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Cisco Systems, Inc.。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Credo 與 Marvell 等公司直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Global Unichip Corporation (“GUC”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 GUC 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Lightmatter, Inc. (“Lightmatter”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 與 Lightmatter 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MACOM Technology Solutions Holdings, Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 與 MACOM 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

MediaTek 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Microchip Technology 列為其業務之直接競爭者。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Montage Technology”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Montage Technology 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Nvidia Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

NVIDIA 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

NXP 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Phison Electronics Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Phison 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated (“Qualcomm”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Qualcomm 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Rambus 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ranovus Inc. (“Ranovus”)”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Ranovus 是與 Marvell 直接競爭的公司之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Realtek Semiconductor Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Realtek Semiconductor Corporation。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Semtech 列為其業務的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Silicon Motion Technology Corporation”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 的直接競爭者包括 Silicon Motion Technology Corporation。（以原文為準）