EveryTie.

AI 伺服器產業鏈

AI 伺服器供應鏈由上游到下游共十七段。下方每一家公司的位置,都由 SEC 申報文件裡的一句逐字原文決定——有申報文件的公司用它自己的話;標示為對手方描述的非申報公司,則用指名它的對手方原文。點擊圖中任一段可預覽該段成員,或直接往下捲動閱讀完整目錄。

這張互動鏈圖需要 JavaScript。完整的鏈——每一段、每一家公司、以及每一句申報文件逐字引文——都列在下方。

跳至完整目錄 ↓

實線箭頭順著鏈往下游走,虛線箭頭是側邊供給。點擊任一段可讀到該段有哪些公司。下方每個位置都有申報文件逐字引文為據——如何閱讀這些資料

1 · 材料 · 3 家公司

供製程/基板用的先進材料與化學品。

材料公司供應製造與加工晶圓所需的超高純度化學品、氣體與基板。它們位在整條鏈的最上游:每座晶圓廠都隨著一片片晶圓持續消耗這些工程材料。需求規模取決於晶圓產量與製程複雜度——製程每多一道步驟,就多一種被消耗的材料。

CoherentCOHR · NYSE

“We are a global leader in SiC substrates for power electronics that improve the energy efficiency of electric and hybrid-electric vehicles.”

完整引文與出處
“We are a global leader in SiC substrates for power electronics that improve the energy efficiency of electric and hybrid-electric vehicles.”
— Coherent 10-K,申報於 2025-08-15 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
EntegrisENTG · NASDAQ

“The Company is a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology indus…”

完整引文與出處
“The Company is a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries.”
— Entegris 10-K,申報於 2026-02-11 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
UMC 在其 20-F 中描述——出自對手方申報文件,非公司自述:

“The principal makers for our wafers are Shin-Etsu, GlobalWafers, Sumco Group and Soitec.”

完整引文與出處
“The principal makers for our wafers are Shin-Etsu, GlobalWafers, Sumco Group and Soitec.”
— UMC 20-F,申報於 2026-04-30 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

2 · 設備 · 9 家公司

製造/檢測/測試半導體用的機台與系統。

設備商製造用來曝光、沉積、蝕刻、檢測與測試晶片的機台,包括把電路圖案印上晶圓的微影系統。晶圓廠本質上就是這些機台的集合;蓋一座新廠,很大一部分就是在下設備訂單。需求跟著建廠與製程世代轉換走——每一代新製程都需要新一代的機台。

Applied Materials 在其 8-K 中描述——出自對手方申報文件,非公司自述:

“Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to streng…”

完整引文與出處
“Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.”
— Applied Materials 8-K,申報於 2026-05-14 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Applied MaterialsAMAT · NASDAQ

“Applied Materials, Inc. is the leader in the materials engineering solutions used to produce virtually every semiconductor in the world.”

完整引文與出處
“Applied Materials, Inc. is the leader in the materials engineering solutions used to produce virtually every semiconductor in the world.”
— Applied Materials 10-K,申報於 2025-12-12 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
ASMLASML · Euronext Amsterdam

“ASML is currently the world’s only manufacturer of EUV lithography systems.”

完整引文與出處
“ASML is currently the world’s only manufacturer of EUV lithography systems.”
— ASML 20-F,申報於 2026-02-25 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
FormFactorFORM · NASDAQ

“FormFactor, Inc. is a leading provider of electrical and optical test and measurement technologies along the full semiconductor product life…”

完整引文與出處
“FormFactor, Inc. is a leading provider of electrical and optical test and measurement technologies along the full semiconductor product lifecycle - from characterization, modeling, reliability, and design de-bug, to qualification and production test.”
— FormFactor 10-K,申報於 2026-02-20 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
KLAKLAC · NASDAQ

“We are a leading supplier of process control and yield management solutions and services for the semiconductor and related electronics indus…”

完整引文與出處
“We are a leading supplier of process control and yield management solutions and services for the semiconductor and related electronics industries.”
— KLA 10-K,申報於 2025-08-08 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Lam ResearchLRCX · NASDAQ

“We are a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry.”

完整引文與出處
“We are a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry.”
— Lam Research 10-K,申報於 2025-08-11 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
TechnoprobeTPRO · Euronext Milan對手方文件描述
FormFactor 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“Probe card vendors such as Japan Electronic Materials Corporation, Micronics Japan Co., and Technoprobe offer probe cards built using simila…”

完整引文與出處
“Probe card vendors such as Japan Electronic Materials Corporation, Micronics Japan Co., and Technoprobe offer probe cards built using similar types of MEMS technology as we do.”
— FormFactor 10-K,申報於 2026-02-20 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
TeradyneTER · NASDAQ

“We are a leading global provider of automated test equipment and robotics products.”

完整引文與出處
“We are a leading global provider of automated test equipment and robotics products.”
— Teradyne 10-K,申報於 2026-02-19 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Lam Research 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“In the etch market, our primary competitors are Applied Materials, Inc.; Hitachi, Ltd.; and Tokyo Electron, Ltd., and our primary competitor…”

完整引文與出處
“In the etch market, our primary competitors are Applied Materials, Inc.; Hitachi, Ltd.; and Tokyo Electron, Ltd., and our primary competitors in the wet clean market are Screen Holding Co., Ltd.; Semes Co., Ltd.; and Tokyo Electron, Ltd.”
— Lam Research 10-K,申報於 2025-08-11 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

3 · EDA 與矽智財 · 3 家公司

晶片設計軟體與可授權設計 IP。

EDA 與矽智財公司販售設計晶片用的軟體,以及可授權使用的現成電路區塊,讓晶片商不必從零重造。這條鏈上的每一顆晶片,在任何晶圓開始製造之前都先經過設計工具——這一段位在設計環節的更上游。晶片越複雜,它們的角色越重:一顆設計整合的電晶體與功能越多,就越依賴自動化工具與經過驗證的授權區塊。

ArmARM · NASDAQ

“We believe that our compute platform, including our architecture, CPU designs, and accelerator and related IP, is the leading independent pr…”

完整引文與出處
“We believe that our compute platform, including our architecture, CPU designs, and accelerator and related IP, is the leading independent processor technology licensable to other companies.”
— Arm 20-F,申報於 2026-05-26 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
CadenceCDNS · NASDAQ

“Cadence® is a global technology leader that develops computational, AI-driven software, accelerated hardware, and silicon intellectual prope…”

完整引文與出處
“Cadence® is a global technology leader that develops computational, AI-driven software, accelerated hardware, and silicon intellectual property (“IP”) products and solutions.”
— Cadence 10-K,申報於 2026-02-19 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
SynopsysSNPS · NASDAQ

“We are a leading provider of high-quality, silicon-proven IP solutions for system-on-chips (SoCs).”

完整引文與出處
“We are a leading provider of high-quality, silicon-proven IP solutions for system-on-chips (SoCs).”
— Synopsys 10-K,申報於 2025-12-22 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

4 · 晶片設計(fabless) · 12 家公司

設計晶片、製造外包。

Fabless 公司負責設計晶片,把製造交給外部的晶圓代工廠。它們是整條鏈的產品定義者:晶圓廠印什麼、封測廠封什麼、伺服器裝什麼,多半始於一份 fabless 設計。這個模式的存在,是因為先進晶圓廠的建造成本極高——設計與製造分離,讓設計團隊不必自己擁有工廠也能競爭。

Astera Labs 在其 8-K 中描述——出自對手方申報文件,非公司自述:

“Announced partnership with high-performance ASIC leader, Alchip Technologies, to advance the silicon ecosystem for AI rack-scale infrastruct…”

完整引文與出處
“Announced partnership with high-performance ASIC leader, Alchip Technologies, to advance the silicon ecosystem for AI rack-scale infrastructure through the seamless integration of purpose-built compute and connectivity solutions.”
— Astera Labs 8-K,申報於 2025-08-05 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Alpha & OmegaAOSL · NASDAQ

“We are a designer, developer and global supplier of a broad portfolio of power semiconductors.”

完整引文與出處
“We are a designer, developer and global supplier of a broad portfolio of power semiconductors.”
— Alpha & Omega 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
AMDAMD · NASDAQ

“We utilize third-party wafer foundries to fabricate the silicon wafers for all of our products.”

完整引文與出處
“We utilize third-party wafer foundries to fabricate the silicon wafers for all of our products.”
— AMD 10-K,申報於 2026-02-04 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Astera LabsALAB · NASDAQ

“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”

完整引文與出處
“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”
— Astera Labs 10-K,申報於 2026-02-20 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
BroadcomAVGO · NASDAQ

“We are a global technology leader that designs, develops and supplies a broad range of semiconductor and semiconductor-based solutions and i…”

完整引文與出處
“We are a global technology leader that designs, develops and supplies a broad range of semiconductor and semiconductor-based solutions and infrastructure software solutions.”
— Broadcom 10-K,申報於 2025-12-18 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
CredoCRDO · NASDAQ

“We utilize a fabless business model, working with a network of third parties to manufacture, assemble and test our connectivity products.”

完整引文與出處
“We utilize a fabless business model, working with a network of third parties to manufacture, assemble and test our connectivity products.”
— Credo 10-K,申報於 2026-06-15 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
TSMC 在其 20-F 中描述——出自對手方申報文件,非公司自述:

“In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation servi…”

完整引文與出處
“In January 2003, we acquired a 52.0% equity interest in GUC, a SoC design service company that provides large scale SoC implementation services.”
— TSMC 20-F,申報於 2026-04-16 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
MarvellMRVL · NASDAQ

“We are a fabless supplier of high-performance semiconductor products with core strengths in developing and scaling complex System-on-a-Chip…”

完整引文與出處
“We are a fabless supplier of high-performance semiconductor products with core strengths in developing and scaling complex System-on-a-Chip architectures, integrating analog, mixed-signal and digital signal processing functionality.”
— Marvell 10-K,申報於 2026-03-11 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Monolithic PowerMPWR · NASDAQ

“Monolithic Power Systems, Inc. is a fabless global company that provides high-performance, semiconductor-based power electronics solutions.”

完整引文與出處
“Monolithic Power Systems, Inc. is a fabless global company that provides high-performance, semiconductor-based power electronics solutions.”
— Monolithic Power 10-K,申報於 2026-02-27 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
NavitasNVTS · NASDAQ

“Navitas is one of the very few suppliers offering a full spectrum of GaN and high-voltage SiC products and solutions to support impending sh…”

完整引文與出處
“Navitas is one of the very few suppliers offering a full spectrum of GaN and high-voltage SiC products and solutions to support impending shifts in power architecture driven by AI computing and grid modernization.”
— Navitas 10-K,申報於 2026-02-27 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
NVIDIANVDA · NASDAQ

“We utilize a fabless and contracting manufacturing strategy, whereby we employ and partner with key suppliers for all phases of the manufact…”

完整引文與出處
“We utilize a fabless and contracting manufacturing strategy, whereby we employ and partner with key suppliers for all phases of the manufacturing process, including wafer fabrication, assembly, testing, and packaging.”
— NVIDIA 10-K,申報於 2026-02-25 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Phison8299 · TPEx
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“We are the leader in the development of controllers for flash memory and provide comprehensive technology solutions.”

完整引文與出處
“We are the leader in the development of controllers for flash memory and provide comprehensive technology solutions.”
— Phison 臺灣證交所股東會年報,申報於 2026-05-27 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

5 · 整合元件製造 · 1 家公司

自己設計也自己製造的晶片公司。

IDM 自己設計晶片,也在自有晶圓廠生產。它一家公司橫跨鏈上好幾段——設計、製造,往往連封裝測試都在同一個屋簷下。這種整合模式能延續,是因為在某些領域,掌握製程本身就是優勢:產品與製造可以一起調校,不必隔著公司界線協商。

IntelINTC · NASDAQ

“We are a global designer and manufacturer of semiconductor products.”

完整引文與出處
“We are a global designer and manufacturer of semiconductor products.”
— Intel 10-K,申報於 2026-01-23 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

6 · 晶圓代工 · 5 家公司

替別人製造晶圓的專業代工。

晶圓代工廠替其他公司製造晶圓,不賣自有品牌的晶片。它是整條鏈共用的工廠:fabless 設計公司、甚至部分 IDM,都把設計交到這裡製造。集中化是結構性的——每往前一個製程世代,開發與建廠成本就更高,能供應最先進製程的公司因此越來越少。

GlobalFoundriesGFS · NASDAQ

“We are the only scaled foundry with a global manufacturing footprint spanning the United States, Europe, and Asia operating for more than a…”

完整引文與出處
“We are the only scaled foundry with a global manufacturing footprint spanning the United States, Europe, and Asia operating for more than a decade.”
— GlobalFoundries 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Navitas 在其 8-K 中描述——出自對手方申報文件,非公司自述:

“Announced partnership with Powerchip for manufacturing best-in-class 200mm (8”) 180nm GaN to support plans for higher levels of integration,…”

完整引文與出處
“Announced partnership with Powerchip for manufacturing best-in-class 200mm (8”) 180nm GaN to support plans for higher levels of integration, with expected lower costs and greater capacity, including to support our roadmap and growth goals for AI data centers.”
— Navitas 8-K,申報於 2025-08-04 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
NVIDIA 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to…”

完整引文與出處
“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”
— NVIDIA 10-K,申報於 2026-02-25 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
TSMC2330 · TWSE

“TSMC is a dedicated foundry in the semiconductor industry which engages mainly in the manufacturing, sales, packaging, testing and computer-…”

完整引文與出處
“TSMC is a dedicated foundry in the semiconductor industry which engages mainly in the manufacturing, sales, packaging, testing and computer-aided design of integrated circuits and other semiconductor devices and the manufacturing of masks.”
— TSMC 20-F,申報於 2026-04-16 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
UMC2303 · TWSE

“We are one of the world’s largest independent semiconductor foundries and a leader in semiconductor manufacturing process technologies.”

完整引文與出處
“We are one of the world’s largest independent semiconductor foundries and a leader in semiconductor manufacturing process technologies.”
— UMC 20-F,申報於 2026-04-30 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

7 · 記憶體與儲存 · 5 家公司

記憶體/儲存元件與裝置製造商。

記憶體與儲存公司製造存放資料的晶片與裝置——DRAM、NAND 快閃記憶體,以及由它們組成的儲存設備。它們擁有自己的晶圓廠,並與邏輯晶片並肩存在於每一套系統:處理器負責運算,記憶體負責餵資料。結構性驅動力是資料本身:運算越多,需要存放與搬動的資料就越多;高頻寬記憶體也被封裝得離處理器越來越近。

MicronMU · NASDAQ

“We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all”

完整引文與出處
“We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all”
— Micron 10-K,申報於 2025-10-03 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Nanya2408 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“There are diversified applications and many product specs in the DRAM market, and our company is identified as a key supplier in the global…”

完整引文與出處
“There are diversified applications and many product specs in the DRAM market, and our company is identified as a key supplier in the global memory market.”
— Nanya 臺灣證交所股東會年報,申報於 2026-05-21 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
NVIDIA 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

完整引文與出處
“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”
— NVIDIA 10-K,申報於 2026-02-25 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
NVIDIA 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”

完整引文與出處
“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”
— NVIDIA 10-K,申報於 2026-02-25 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Winbond2344 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“In our memory business, our world-leading NOR Flash business has expanded its product lineup with 45nm process technology, and our 24nm SLC…”

完整引文與出處
“In our memory business, our world-leading NOR Flash business has expanded its product lineup with 45nm process technology, and our 24nm SLC NAND Flash products have entered mass production.”
— Winbond 臺灣證交所股東會年報,申報於 2026-05-29 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

8 · 封裝測試 · 4 家公司

委外封裝與測試服務。

封測廠以委外服務的形式,把裸晶封裝成成品晶片並加以測試。它們是鏈的後段:晶圓代工廠做好晶圓之後,由封測廠切割、連接、封裝、驗證。把多顆裸晶合封在同一個先進封裝內,是晶片取得效能的重要途徑之一,也讓越來越多工程集中在這一段。

AmkorAMKR · NASDAQ

“Amkor is the world’s largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader…”

完整引文與出處
“Amkor is the world’s largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services.”
— Amkor 10-K,申報於 2026-02-20 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
ASE3711 · TWSE

“ASEH is a leading provider of semiconductor manufacturing services in assembly and testing.”

完整引文與出處
“ASEH is a leading provider of semiconductor manufacturing services in assembly and testing.”
— ASE 20-F,申報於 2026-04-01 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
AMD 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”

完整引文與出處
“The ATMP JVs, Siliconware Precision Industries Ltd. (SPIL) and King Yuan Electronics Company (KYEC) provide ATMP services for our products.”
— AMD 10-K,申報於 2026-02-04 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
UMC 在其 20-F 中描述——出自對手方申報文件,非公司自述:

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd.…”

完整引文與出處
“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”
— UMC 20-F,申報於 2026-04-30 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

9 · 零組件與模組 · 4 家公司

分離式元件、被動元件、光學/電源模組。

零組件公司供應圍繞在主晶片周邊的分離式半導體、被動元件,以及光學與電源模組。一套系統不是只有最大顆的晶片:電要轉換與輸送、訊號要濾波、光要傳輸——這些零件都來自這一段。零組件數量隨系統複雜度上升;一張伺服器主機板上就有數千顆。

CoherentCOHR · NYSE

“We are a global technology leader in optical communications, providing materials, subcomponents, components, modules, subsystems, and system…”

完整引文與出處
“We are a global technology leader in optical communications, providing materials, subcomponents, components, modules, subsystems, and systems to optical component and module manufacturers, networking equipment manufacturers, datacenter operators, enterprises, and telecom service providers.”
— Coherent 10-K,申報於 2025-08-15 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
LumentumLITE · NASDAQ

“We are a leading provider of optical and photonic products and are recognized as an industry leader based on revenue and market share.”

完整引文與出處
“We are a leading provider of optical and photonic products and are recognized as an industry leader based on revenue and market share.”
— Lumentum 10-K,申報於 2025-08-19 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
onsemiON · NASDAQ

“These wide bandgap technologies are designed and manufactured by onsemi and supplied to customers in multiple forms, including bare die, pac…”

完整引文與出處
“These wide bandgap technologies are designed and manufactured by onsemi and supplied to customers in multiple forms, including bare die, packaged discrete products, and complete power modules.”
— onsemi 10-K,申報於 2026-02-09 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
VishayVSH · NYSE

“Vishay Intertechnology, Inc. (“Vishay,” the “Company,” “we,” “us,” or “our”) manufactures one of the world’s largest portfolios of discrete…”

完整引文與出處
“Vishay Intertechnology, Inc. (“Vishay,” the “Company,” “we,” “us,” or “our”) manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that support innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and healthcare markets.”
— Vishay 10-K,申報於 2026-02-13 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

10 · 載板與電路板 · 3 家公司

IC 載板、印刷電路板與導線架;ABF 載板同時供給封裝測試段——鏈是目錄,不是嚴格的直線。

載板與電路板公司製造晶片安身與走線的基底:封裝內承載裸晶的 IC 載板、系統內承載成品晶片的印刷電路板,以及導線架。它們在鏈上的位置是雙重的:ABF 這類封裝載板供給封裝測試段,電路板則供給系統組裝——這一段是鏈後段的鄰居,不是嚴格排在其後。晶片封裝每一代都更大更密,對載板的要求就更高——更多佈線層要放進更小的空間,先進載板因此是少數供應商才做得出的工程產品。

Kinsus3189 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“Our company is positioned in the sector of “Circuit board”. Upstream suppliers include Epoxy CCL (Copper Clad Laminate), copper foil, and va…”

完整引文與出處
“Our company is positioned in the sector of “Circuit board”. Upstream suppliers include Epoxy CCL (Copper Clad Laminate), copper foil, and various specialty chemicals suppliers. Downstream clients include IC packaging industry, and electronic product assembly EMS companies.”
— Kinsus 臺灣證交所股東會年報,申報於 2026-05-27 · 查看原始申報文件 ↗
Nan Ya PCB8046 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“The Company focused on the high-end IC substrate market, collaborating closely with customers to launch next-generation high-value products,…”

完整引文與出處
“The Company focused on the high-end IC substrate market, collaborating closely with customers to launch next-generation high-value products, such as substrates for advanced servers, 800G switches, and AI PC central processing units (CPUs), further optimizing the product mix.”
— Nan Ya PCB 臺灣證交所股東會年報,申報於 2026-05-14 · 查看原始申報文件 ↗
ASE 在其 20-F 中描述——出自對手方申報文件,非公司自述:

“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such a…”

完整引文與出處
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”
— ASE 20-F,申報於 2026-04-01 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

11 · 散熱與冷卻 · 4 家公司

晶片與系統的熱管理硬體——散熱片、風扇、熱管、均熱板、水冷板與液冷模組及系統。

散熱與冷卻公司製造把熱量帶離晶片與系統的硬體——散熱片、風扇、熱管、均熱板、水冷板,以至完整的液冷迴路。它們是系統組裝段的鄰居:每一台出貨的伺服器,都帶著一套依內部晶片配置的散熱方案。機櫃裡的運算越密,要帶走的熱就越多——高功耗處理器把散熱從氣冷推向液冷,熱設計因此成為系統本身的一部分。

Asia Vital Components3017 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“AVC is one of the few thermal solution providers with integrated capabilities in thermal solutions, system integration, and chassis/cabinet…”

完整引文與出處
“AVC is one of the few thermal solution providers with integrated capabilities in thermal solutions, system integration, and chassis/cabinet manufacturing.”
— Asia Vital Components 臺灣證交所股東會年報,申報於 2026-06-02 · 查看原始申報文件 ↗
Auras Technology3324 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“In the liquid cooling market, the Company serves as a system solution provider, while in the air cooling market, it operates as a thermal mo…”

完整引文與出處
“In the liquid cooling market, the Company serves as a system solution provider, while in the air cooling market, it operates as a thermal module manufacturer, and is classified within the electronic components industry.”
— Auras Technology 臺灣證交所股東會年報,申報於 2026-05-21 · 查看原始申報文件 ↗
Jentech Precision3653 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“The Company’s Thermal Heat Spreader products feature excellent thermal conductivity and heat dissipation performance, effectively meeting th…”

完整引文與出處
“The Company’s Thermal Heat Spreader products feature excellent thermal conductivity and heat dissipation performance, effectively meeting the cooling requirements of high-power applications such as data centers, supercomputers, and big data computing.”
— Jentech Precision 臺灣證交所股東會年報,申報於 2026-05-29 · 查看原始申報文件 ↗
Sunonwealth2421 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“As a global leading thermal solution provider, Sunonwealth provides diversified and professional thermal products and services.”

完整引文與出處
“As a global leading thermal solution provider, Sunonwealth provides diversified and professional thermal products and services.”
— Sunonwealth 臺灣證交所股東會年報,申報於 2026-05-25 · 查看原始申報文件 ↗

12 · 伺服器電源 · 2 家公司

伺服器與資料中心的電源供應與電源管理——電源供應器、電源櫃層與電源模組。

伺服器電源公司製造電源供應器、電源櫃層與電源模組,把輸入的電力轉換成板卡與晶片可用的穩定電壓。它們是系統組裝段的鄰居:每一台伺服器、每一座機櫃,都帶著一套依內部硬體配置的電力鏈。結構性驅動力是功率密度——機櫃裡塞進越多運算,就有越多電力要在同樣的空間內完成轉換、輸送與管理。

Delta Electronics2308 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“A key offering is the 19-inch 90kW DC/DC server power shelf, which steps down 800VDC supplied from copper busbars to 50VDC or 48VDC.”

完整引文與出處
“A key offering is the 19-inch 90kW DC/DC server power shelf, which steps down 800VDC supplied from copper busbars to 50VDC or 48VDC.”
— Delta Electronics 臺灣證交所股東會年報,申報於 2026-05-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Lite-On Technology2301 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“LITEON provides high-end server power management systems for large data center clients.”

完整引文與出處
“LITEON provides high-end server power management systems for large data center clients.”
— Lite-On Technology 臺灣證交所股東會年報,申報於 2026-05-20 · 查看原始申報文件 ↗

13 · 連接器與線束 · 2 家公司

電子連接器、線束、纜線與互連模組。

連接器與線束公司製造連接器、線束與纜線,在板卡、模組與機器之間傳送電力與訊號。它們是整條鏈的關節:每一段板對板的連接、每一條機櫃之間的線路,都經過這一段製造的互連元件。互連數量隨系統複雜度上升——訊號越快、系統越密,需要的連接就越多、也越精密。

Lotes3533 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“The Company is mainly engaged in the research and development, production and sales of electronic connectors.”

完整引文與出處
“The Company is mainly engaged in the research and development, production and sales of electronic connectors.”
— Lotes 臺灣證交所股東會年報,申報於 2026-06-12 · 查看原始申報文件 ↗

14 · 機殼與滑軌 · 2 家公司

伺服器機殼、機櫃機構件與滑軌套件。

機殼與滑軌公司製造伺服器安身的機殼、機櫃機構件與滑軌套件。它們給整條鏈一個實體骨架:板卡需要機殼,機殼需要滑軌才能推進機櫃。需求跟著伺服器出貨量與機構形態變化走——機櫃越密、機器越重,對機構設計的要求就越高。

Chenbro Micom8210 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“Chenbro is committed to providing highly compatible and deeply customized mechanical solutions, including server chassis and customized rack…”

完整引文與出處
“Chenbro is committed to providing highly compatible and deeply customized mechanical solutions, including server chassis and customized rack components.”
— Chenbro Micom 臺灣證交所股東會年報,申報於 2026-05-29 · 查看原始申報文件 ↗
King Slide2059 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“(1) Research, design, manufacture and distribute Rail Kits and server Rail Kits”

完整引文與出處
“(1) Research, design, manufacture and distribute Rail Kits and server Rail Kits”
— King Slide 臺灣證交所股東會年報,申報於 2026-06-30 · 查看原始申報文件 ↗

15 · 電子代工製造 · 7 家公司

替品牌商代工整機/模組的製造服務。

EMS 與 ODM 公司替品牌客戶代工製造整機與模組。它們把鏈上的零組件變成完成品——組裝主機板、組建機櫃、量產交付。這個模式讓製造規模集中:品牌商負責設計與銷售,少數幾家代工廠同時替多個品牌生產。

Alpha & Omega 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

完整引文與出處
“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”
— Alpha & Omega 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
FabrinetFN · NYSE

“We provide advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment…”

完整引文與出處
“We provide advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers (“OEMs”) of complex products such as optical communication components, modules and sub-systems, industrial lasers, automotive components, medical devices and sensors.”
— Fabrinet 10-K,申報於 2025-08-19 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Alpha & Omega 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

完整引文與出處
“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”
— Alpha & Omega 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Inventec2356 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“The main businesses of Inventec are the research and development, manufacturing, and sales of notebook computers, servers, and communication…”

完整引文與出處
“The main businesses of Inventec are the research and development, manufacturing, and sales of notebook computers, servers, and communication products.”
— Inventec 臺灣證交所股東會年報,申報於 2026-05-27 · 查看原始申報文件 ↗
Alpha & Omega 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

完整引文與出處
“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”
— Alpha & Omega 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Alpha & Omega 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

完整引文與出處
“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”
— Alpha & Omega 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Supermicro 在其 10-K 中描述——出自對手方申報文件,非公司自述:

“We believe our principal competitors include: • global technology vendors, such as Cisco, Dell, Hewlett-Packard Enterprise, and Lenovo; and…”

完整引文與出處
“We believe our principal competitors include: • global technology vendors, such as Cisco, Dell, Hewlett-Packard Enterprise, and Lenovo; and • ODMs, such as Foxconn, Quanta Computer, and Wiwynn Corporation.”
— Supermicro 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

16 · 通路 · 0 家公司

電子元件與方案的授權經銷。

通路商是獲授權的中間層,備妥庫存並轉售零組件給電子製造商。它們做的是匯集:成千上萬的買家不可能每一家都與每個晶片商直接往來,通路商就在中間承擔庫存、資金與物流。越是分散,這個結構性角色越重要——零組件與客戶的長尾越長,鏈就越需要一個匯集層。

此試點鏈目前尚無此段成員。 只有當申報文件引文明確述及位置時,公司才會列入此段——在此之前,此段誠實留空。

17 · 系統與雲端基礎設施 · 4 家公司

品牌整機、網通設備、雲/AI 基礎設施。

系統與雲端基礎設施公司賣的是成品層:品牌伺服器、網通設備,以及由上游一切組成的資料中心基礎設施。這裡是整條鏈與買方相會的地方——上面每一段的產出,最終都裝在這一層賣出的系統裡。結構性拉力由下游往上游傳導:當運算需求成長,這一層下的訂單會一路傳導到鏈的每一段。

Arista NetworksANET · NYSE

“is an industry leader in data-driven, client-to-cloud networking for large AI, data center, campus and routing environments.”

完整引文與出處
“is an industry leader in data-driven, client-to-cloud networking for large AI, data center, campus and routing environments.”
— Arista Networks 10-K,申報於 2026-02-17 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
DellDELL · NYSE

“Dell Technologies is a leader in the global technology industry focused on providing broad and innovative technology solutions for the data…”

完整引文與出處
“Dell Technologies is a leader in the global technology industry focused on providing broad and innovative technology solutions for the data and artificial intelligence (“AI”) era.”
— Dell 10-K,申報於 2026-03-16 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →
Gigabyte Technology2376 · TWSE
出自公司自己的臺灣證交所英文年報——中文正本之英文譯本:

“GIGABYTE has secured a leading position in AI servers and fully integrated AI rack solutions.”

完整引文與出處
“GIGABYTE has secured a leading position in AI servers and fully integrated AI rack solutions.”
— Gigabyte Technology 臺灣證交所股東會年報,申報於 2026-06-09 · 查看原始申報文件 ↗
SupermicroSMCI · NASDAQ

“We are a Silicon Valley-based provider of total IT solutions which address demanding workloads from the enterprise and cloud to the intellig…”

完整引文與出處
“We are a Silicon Valley-based provider of total IT solutions which address demanding workloads from the enterprise and cloud to the intelligent edge.”
— Supermicro 10-K,申報於 2025-08-28 · 查看原始申報文件 ↗ · 全部關係 → · 地圖檢視 →

未掛鏈段標籤的成員

Amazon、Imec、OpenAI 是此試點鏈的成員,但不掛任何鏈段標籤:它們位於鏈的需求端或研究端,語料中沒有申報文件句子述及其供給段位置。沒有引文,就沒有標籤。

這些標籤怎麼來的

  • 自述標籤——多數標籤引用公司自己的年報:它自述鏈上位置的那一句,逐字呈現、永不翻譯。
  • 對手方文件描述——不向 SEC 申報的公司,只有在別家公司的申報文件指名描述時才能掛標籤。卡片會明確標示出自哪一份文件。
  • 沒有引文,就沒有標籤——沒有合格成員的段落寧可留空,也不由我們的意見填補。
  • 不排序——段內公司一律按字母序排列;順序不帶任何意義。