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“In fiscal year 2026, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 在 2026 會計年度獨家使用 TSMC 進行晶圓生產。（以原文為準）

“Qualcomm, which is currently a major customer of ours and accounted for 9% of our total revenue for the fiscal year ended March 31, 2026”

— ARM 20-F，申報於 2026-05-26 · 查看原始申報文件 ↗

Qualcomm 是 Arm 的主要客戶，在截至 2026 年 3 月 31 日的財年佔 Arm 總營收的 9%。（以原文為準）

“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Arista Networks 主要依賴其主要的商用矽供應商 Broadcom 提供交換晶片。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

在2025會計年度，來自Samsung的收入佔Qualcomm合併營收10%以上。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Xiaomi在2025會計年度佔Qualcomm合併營收的10%或以上。（以原文為準）

“Broadcom Inc. (“Broadcom”) and Apple Inc. (“Apple”) have agreed to expand their long-standing technology collaboration through 2031 by entering into new multi-year long-term agreements for Broadcom to develop and supply a range of custom ASIC silicon products for use in multiple generations of Apple products.”

— AVGO 8-K，申報於 2026-07-06 · 查看原始申報文件 ↗

Apple 與 Broadcom 已同意擴大長期技術合作，Broadcom 將為 Apple 開發及供應客製 ASIC 矽產品。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Amkor 等第三方承包商進行 IC 產品的封裝、組裝和測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 ASE 進行其 IC 產品的封裝。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 King Yuan Electronics 進行其 IC 產品的測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 委託 Sigurd Microelectronics 進行 IC 產品測試。（以原文為準）

“we use third-party contractors for packaging, assembly and testing, including Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products, King Yuan Electronics Company (KYEC) and Sigurd Microelectronics Corp. (Sigurd) for testing our IC products and BizLink Technology, Inc. (BizLink) for manufacturing our AEC products”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 使用 Bizlink Technology 作為其 AEC 產品的製造承包商。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC 的主要客戶包括 MediaTek 等領先的無晶圓廠設計公司。（以原文為準）

“Such regulatory changes include the addition by BIS of China-based Huawei Technologies Co., Ltd. (“Huawei”), Semiconductor Manufacturing International Corporation (“SMIC”), Yangtze Memory Technologies Corp (“YMTC”), NAURA Technology Group, Piotech, Inc. and many of their respective affiliates onto its Entity List. … Accordingly, we have implemented additional monitoring processes and suspended orders from these companies as well as other designated Chinese-based customers, where those orders are subject to U.S. jurisdiction.”

— MKSI 10-K，申報於 2026-02-24 · 查看原始申報文件 ↗

MKSI 已暫停對 Huawei 等公司的訂單，因其被列入 BIS 實體清單。（以原文為準）

“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”

— AMKR 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

截至 2025 年 12 月 31 日止年度，Amkor 對 Qualcomm 的直接銷售佔其淨銷售額的 11.1%。（以原文為準）

“In 2020, due to regulations imposed by the U.S. government, we ceased shipments of our products to Huawei pending approval of export licenses.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 在 2020 年因美國政府法規，在取得出口許可前停止向 Huawei 出貨。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Broadcom 等公司已取得 Rambus 的專利授權。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Rambus 指出 Marvell 等公司已取得其專利授權。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

MediaTek 是 Rambus 的專利授權客戶之一。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Qualcomm 已取得 Rambus 的專利授權。（以原文為準）

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Jabil 是 Arista Networks 的主要製造合作夥伴之一。（以原文為準）

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Arista Networks 將 Sanmina 列為主要製造合作夥伴之一。（以原文為準）

“Our primary manufacturing partners are Jabil Inc., Sanmina Corporation and Foxconn Hon Hai.”

— ANET 10-K，申報於 2026-02-17 · 查看原始申報文件 ↗

Arista Networks 的主要製造合作夥伴包括 Foxconn。（以原文為準）

“The majority of our front-end wafer manufacturing operations is outsourced to external foundries, including Taiwan Semiconductor Manufacturing Company Limited (“TSMC”). … During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 的前端晶圓製造多數外包給外部晶圓代工廠，其中 TSMC 在 2025 會計年度生產了約 95% 的晶圓。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用 ASE 等第三方封測廠商進行其大部分組裝與測試作業。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用 Foxconn 等第三方代工廠進行組裝和測試。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom 使用第三方代工廠進行大部分組裝與測試作業，其中包括 Amkor。（以原文為準）

“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”

— AVGO 10-K，申報於 2025-12-18 · 查看原始申報文件 ↗

Broadcom將大部分封測業務委外給SPIL等第三方代工廠。（以原文為準）

“Our key customers include … Cisco,”

— SWKS 10-K，申報於 2025-11-07 · 查看原始申報文件 ↗

Cisco 被列為 Skyworks 的主要客戶之一。（以原文為準）

“Apple purchases our MDM (or thin modem) products”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Apple 向 Qualcomm 購買 MDM（或精簡數據機）產品。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 的主要晶圓代工供應商包括 TSMC。（以原文為準）

“We partnered with Oracle to develop our ZeroFlap Optics”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Oracle 合作開發 ZeroFlap Optics。（以原文為準）

“Created switch cable and open-sourced implementation with Microsoft to realize their vision for a highly reliable network-managed dual-ToR architecture”

— CRDO 10-K，申報於 2026-06-15 · 查看原始申報文件 ↗

Credo 與 Microsoft 共同開發了交換機電纜並開源實現。（以原文為準）

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and Broadcom Inc.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

UMC與Broadcom簽訂了專利交叉授權協議。（以原文為準）

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

Qualcomm與STMicroelectronics於2024年宣布合作推出首款產品，旨在簡化搭載STM32 MCU的系統中無線連接的實現。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 的主要競爭對手包括 Qualcomm。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo的CSG與ACG業務均與Qualcomm競爭。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd. … ACG competes primarily with Broadcom Inc.; Maxscend Microelectronics Co., Ltd.; Murata Manufacturing Co., Ltd.; Qualcomm Technologies, Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 CSG 和 ACG 業務均與 Broadcom 競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Astera Labs, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭者包括 Astera Labs。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Advanced Micro Devices, Inc. ("AMD")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 AMD 列為與其業務直接競爭之公司。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Alchip Technologies ("Alchip")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Alchip Technologies Alchip 是與 Marvell 直接競爭的公司之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ayar Labs, Inc. ("Ayar Labs")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Ayar Labs 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Broadcom Inc. ("Broadcom")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Broadcom 與 Marvell 在業務上直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Cisco Systems, Inc. ("Cisco")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Cisco Systems, Inc.。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Credo Technology Group Holding Ltd”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Credo 與 Marvell 等公司直接競爭。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Global Unichip Corporation ("GUC")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 GUC 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Lightmatter, Inc. ("Lightmatter")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 與 Lightmatter 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MACOM Technology Solutions Holdings, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 與 MACOM 為直接競爭對手。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … MediaTek Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

MediaTek 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Microchip Technology 列為其業務之直接競爭者。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Montage Technology”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Montage Technology 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Nvidia Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

NVIDIA 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

NXP是Marvell的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Phison Electronics Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Phison 是 Marvell 的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Qualcomm Incorporated ("Qualcomm")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Qualcomm 列為直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Rambus, Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Rambus 是 Marvell 的直接競爭者之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Ranovus Inc. ("Ranovus")”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Ranovus 是與 Marvell 直接競爭的公司之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Realtek Semiconductor Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 的直接競爭對手包括 Realtek Semiconductor Corporation。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Semtech 列為其業務的直接競爭者之一。（以原文為準）