GlobalFoundries — 供應鏈與商業關係
下方的每一段關係都源自公開公司申報文件中的逐字引用,點名了交易對手,並附有一鍵連結至原始文件。
點擊公司開啟其地圖 · 拖曳探索 · 游標懸停連線可閱讀來源引文。綠=供應 · 橘虛線=競爭 · 藍=合作 · 紫=持股 · 灰虛線=暫停 · 如何閱讀這些資料。
1 家供應商4 家客戶5 家合作夥伴6 家競爭對手1 條持股關係7 份來源申報文件
收錄於供應鏈主題地圖:半導體晶圓代工與先進封裝
客戶(其供應的公司)
申報於 2026-02-04 · 157 天前
“We rely primarily on GLOBALFOUNDRIES Inc. (GF) for wafers for microprocessor and GPU products manufactured at process nodes larger than 7 nm.”— AMD 10-K,申報於 2026-02-04 · 查看原始申報文件 ↗AMD 主要依賴 GlobalFoundries 供應大於 7nm 製程的微處理器與 GPU 晶圓。(以原文為準)
供應給 →
Cirrus Logic
申報於 2026-05-21 · 51 天前
“We use a variety of foundries in the production of wafers, primarily supplied by GLOBALFOUNDRIES Inc., ("GlobalFoundries") and Taiwan Semiconductor Manufacturing Company, Limited ("TSMC").”— CRUS 10-K,申報於 2026-05-21 · 查看原始申報文件 ↗Cirrus Logic主要使用GlobalFoundries等晶圓代工廠生產晶圓。(以原文為準)
供應給 →
Navitas
申報於 2026-02-27 · 134 天前
“Our US based GaN fabrication partner is GlobalFoundries.”— NVTS 10-K,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 是 Navitas 在美國的 GaN 晶圓代工合作夥伴。(以原文為準)
供應給 →
Qualcomm
申報於 2025-11-05 · 248 天前
“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”— QCOM 10-K,申報於 2025-11-05 · 查看原始申報文件 ↗GlobalFoundries 是 Qualcomm 的晶圓代工供應商之一。(以原文為準)
供應商(供應其產品或服務的公司)
申報於 2026-02-27 · 134 天前
“If we are unable to obtain 300mm SOI wafers from Soitec S.A. (“Soitec”), our primary supplier, for any reason, we expect that it would take us an extended period to find a replacement supplier on commercially acceptable terms.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 表示,若無法從其主要供應商 Soitec 取得 300mm SOI 晶圓,預期需較長時間才能找到替代供應商。(以原文為準)
合作夥伴與協作
申報於 2026-02-27 · 134 天前
“in November 2025, we announced a long-term strategic partnership with GlobalFoundries to develop and deliver advanced GaN solutions for critical applications in high power markets”— NVTS 10-K,申報於 2026-02-27 · 查看原始申報文件 ↗Navitas 與 GlobalFoundries 宣布建立長期策略合作夥伴關係,共同開發先進 GaN 解決方案。(以原文為準)
合作夥伴 ↔
AMD
申報於 2026-02-27 · 134 天前
“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 與 AMD 有專利交叉授權。(以原文為準)
合作夥伴 ↔
Samsung
申報於 2026-02-27 · 134 天前
“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 與 Samsung 簽訂了專利交叉授權協議。(以原文為準)
合作夥伴 ↔
TSMC
申報於 2026-02-27 · 134 天前
“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 與 TSMC 等公司簽訂了專利交叉授權協議。(以原文為準)
合作夥伴 ↔
STMicroelectronics
申報於 2026-02-26 · 135 天前
“the joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”— STM 20-F,申報於 2026-02-26 · 查看原始申報文件 ↗GlobalFoundries 與 STMicroelectronics 在法國 Crolles 共同經營一座 300mm 半導體製造設施。(以原文為準)
競爭對手
相互競爭 ↔
TSMC
申報於 2026-02-27 · 134 天前
“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 的主要競爭對手包括 TSMC。(以原文為準)
相互競爭 ↔
UMC
申報於 2026-02-27 · 134 天前
“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries和UMC都是主要的競爭對手。(以原文為準)
相互競爭 ↔
SMIC
申報於 2026-02-27 · 134 天前
“Key competitors include Taiwan Semiconductor Manufacturing Company, Limited (“TSMC”), United Microelectronics Corporation (“UMC”) and Semiconductor Manufacturing International Corporation.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 將 SMIC 列為主要競爭對手之一。(以原文為準)
相互競爭 ↔
Texas Instruments
申報於 2026-02-27 · 134 天前
“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 也與 Texas Instruments 等 IDM 的晶圓代工服務競爭。(以原文為準)
相互競爭 ↔
Samsung
申報於 2026-02-27 · 134 天前
“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 與 Samsung 等 IDM 的晶圓代工服務競爭。(以原文為準)
相互競爭 ↔
Intel
最近確認於 2026-02-27 · 134 天前 · 經 2 份申報文件佐證
“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries 亦與部分 IDM 的晶圓代工服務競爭,例如 Intel 及 Samsung 等公司。(以原文為準)
所有權與投資
申報於 2026-02-27 · 134 天前
“GlobalFoundries is a majority owned subsidiary of Mubadala Technology Investments LLC”— GFS 20-F,申報於 2026-02-27 · 查看原始申報文件 ↗GlobalFoundries是Mubadala持有多數股權的子公司。(以原文為準)