Intel — 供應鏈與商業關係

“We provide semiconductor wafer manufacturing services to Altera, a related party, in accordance with a wafer manufacturing and sale agreement.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 根據晶圓製造與銷售協議，向關聯方 Altera 提供半導體晶圓製造服務。（以原文為準）

“Some of our most advanced current and future products are or will be either exclusively manufactured by TSMC or reliant upon critical components, including various compute die, manufactured by TSMC.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 部分最先進的現有及未來產品將由 TSMC 獨家製造或依賴其關鍵元件。（以原文為準）

“we are reliant upon sole-source providers, such as with the EUV lithography tools manufactured by ASML”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 依賴 ASML 作為 EUV 微影設備之獨家供應商。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 是 UMC 的主要客戶之一，屬於整合元件製造商。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Intel Corporation * * 12.4 % 12.0 % * 17.1 % 16.7 % 15.7 %”

— FORM 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Intel 在特定季度佔 FormFactor 季度營收 10% 以上，如原文表格所示。（以原文為準）

“In January 2024, we entered into a collaboration with Intel Corporation to jointly develop a new 12nm semiconductor process platform that combines Intel’s at-scale U.S. manufacturing capacity and our extensive foundry experience on mature nodes, with U.S.-based 12nm production expected to begin in 2027.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Intel 與 UMC 合作，共同開發新的 12nm 半導體製程平台。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Intel Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Intel 是 Marvell 的直接競爭對手之一。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 亦與部分 IDM 的晶圓代工服務競爭，例如 Intel 及 Samsung 等公司。（以原文為準）

“Our current competitors include: … • suppliers and licensors of hardware and software for discrete and integrated GPUs, custom chips and other accelerated computing solutions, including solutions offered for AI, such as Advanced Micro Devices, Inc., or AMD, Huawei Technologies Co. Ltd., or Huawei, and Intel Corporation, or Intel;”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 將 Intel 列為當前競爭對手之一。（以原文為準）

“Our primary competitor in the supply of CPUs and APUs is Intel.”

— AMD 10-K，申報於 2026-02-04 · 查看原始申報文件 ↗

Intel 是 AMD 在 CPU 和 APU 供應上的主要競爭者。（以原文為準）

“including at one of our key foundry competitors, TSMC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

TSMC 是 Intel 的關鍵晶圓代工競爭對手之一。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 面臨來自採用 ARM 架構設計處理器之公司的競爭，例如 Apple 及其 M 系列產品。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 面臨來自 Qualcomm 等公司基於 ARM 架構處理器的競爭。（以原文為準）

“We also face significant competition from companies that design processors based on the ARM architecture, such as Apple with its M series products, Qualcomm with its Snapdragon products and MediaTek with its Kompanio products.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel面臨來自MediaTek（以其Kompanio產品）的顯著競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Amazon 等多家超大規模業者正在開發自有客製化晶片，與 Intel 形成競爭。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 指出許多超大規模資料中心業者如 META 正在開發自有客製化晶片。（以原文為準）

“companies developing their own custom silicon, including many hyperscalers such as Amazon, Google, Meta and Microsoft”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel與Microsoft在客製化晶片開發方面是競爭對手。（以原文為準）

“We also compete with Broadcom in the custom ASICs development market”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 在客製化 ASIC 開發市場與 Broadcom 競爭。（以原文為準）

“one of three companies (the others being TSMC and Samsung) investing in 2nm lithography”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 和 Samsung 是投資 2 奈米製程的三家公司中的兩家。（以原文為準）

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel Foundry 的其他競爭者包括 UMC。（以原文為準）

“Other Intel Foundry competitors include GlobalFoundries, UMC and SMIC”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 在晶圓代工領域的競爭對手包括 SMIC。（以原文為準）

“we entered into an agreement with NVIDIA to issue and sell to NVIDIA 215 million shares of our common stock at $23.28 per share for an aggregate cash purchase price of $5.0 billion.”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 與 NVIDIA 簽訂協議，Intel 將向 NVIDIA 發行並出售 2.15 億股普通股，每股價格 23.28 美元，總現金購買價為 50 億美元。（以原文為準）

“we entered into an agreement with SoftBank Group to issue and sell to SoftBank Group 87 million shares of our common stock at $23.00 per share”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel與SoftBank達成協議，Intel將向SoftBank發行並出售8,700萬股普通股，每股價格23.00美元。（以原文為準）