Samsung — 供應鏈與商業關係

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 利用 Samsung 等晶圓代工廠生產其半導體晶圓。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 之主要晶圓代工供應商包括 Samsung。（以原文為準）

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Samsung在2026及2025兩個會計年度各佔Qorvo總營收的10%。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

在2025會計年度，來自Samsung的收入佔Qualcomm合併營收10%以上。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 · 查看原始申報文件 ↗

在截至 2025、2024 及 2023 年 6 月 30 日的會計年度中，Samsung 是 KLA 佔其營收超過 10% 的客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Samsung。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Samsung Electronics Co., Ltd. * * * * * * * 12.4 % 19.2 % 24.5 % 47.8 % 35.3 % 22.0 % 35.2 % 36.2 % 43.6 %”

— FORM 10-K，申報於 2026-02-20 · 查看原始申報文件 ↗

Samsung 在數個季度中佔 FormFactor 季度營收的 10% 以上，如原文表格所示。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的十大終端客戶之一為 Samsung。（以原文為準）

“such as AMD, Amlogic, Broadcom, CXMT, IBM, Infineon, Kioxia, Marvell, MediaTek, Micron, Nanya, Nuvoton, NVIDIA, Phison, Qualcomm, Samsung, Silicon Motion, SK hynix, Socionext, STMicroelectronics, Toshiba, Western Digital and Winbond have licensed our patents.”

— RMBS 10-K，申報於 2026-02-18 · 查看原始申報文件 ↗

Rambus 的專利已授權給 Samsung 等公司。（以原文為準）

“Our key customers include … Samsung,”

— SWKS 10-K，申報於 2025-11-07 · 查看原始申報文件 ↗

Samsung 是 Skyworks 的主要客戶之一。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2025-08-28 · 查看原始申報文件 ↗

Alpha & Omega 已與 Samsung 等主要 OEM 建立直接關係，並透過經銷商及 ODM 為其服務。（以原文為準）

“Our most significant customers during the fiscal years ending June 29, 2025, June 30, 2024, and June 25, 2023 included Samsung Electronics Company, Ltd. and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2025-08-11 · 查看原始申報文件 ↗

Lam Research 在截至 2025 年 6 月 29 日、2024 年 6 月 30 日及 2023 年 6 月 25 日的會計年度中，最重要的客戶包括 Samsung。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 簽訂了專利交叉授權協議。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 等 IDM 的晶圓代工服務競爭。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 · 查看原始申報文件 ↗

NVIDIA 將 Samsung 列為其 SoC 產品領域的現有競爭者之一。（以原文為準）

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K，申報於 2026-02-09 · 查看原始申報文件 ↗

Samsung是onsemi部分產品與解決方案的競爭對手之一。（以原文為準）

“one of three companies (the others being TSMC and Samsung) investing in 2nm lithography”

— INTC 10-K，申報於 2026-01-23 · 查看原始申報文件 ↗

Intel 和 Samsung 是投資 2 奈米製程的三家公司中的兩家。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 · 查看原始申報文件 ↗

Qualcomm 將 Samsung 列為其競爭對手或潛在競爭對手之一。（以原文為準）

“We face intense competition in the semiconductor memory and storage markets from a number of companies, including Samsung Electronics Co., Ltd.; SK hynix Inc.; Kioxia Holdings Corporation; Sandisk Corporation; ChangXin Memory Technologies, Inc. (“CXMT”); and Yangtze Memory Technologies Co., Ltd. (“YMTC”).”

— MU 10-K，申報於 2025-10-03 · 查看原始申報文件 ↗

Micron在半導體記憶體與儲存市場面臨來自Samsung等公司的激烈競爭。（以原文為準）