Samsung — 供應鏈與商業關係

“AMD and Samsung announced a collaboration on HBM4 supply for AMD Instinct MI455X GPUs and advanced DRAM solutions for 6th Gen AMD EPYC CPUs.”

— AMD 8-K，申報於 2026-05-05 EDGAR · 查看原始申報文件 ↗

AMD 宣布與 Samsung 合作，由 Samsung 供應 AMD Instinct MI455X GPU 的 HBM4，並提供第 6 代 AMD EPYC CPU 的先進 DRAM 解決方案。（以原文為準）

“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 利用 Samsung 等晶圓代工廠生產其半導體晶圓。（以原文為準）

“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”

— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗

Qualcomm 之主要晶圓代工供應商包括 Samsung。（以原文為準）

“Samsung Electronics Co., Ltd. ("Samsung") accounted for 10% of total revenue in both fiscal years 2026 and 2025.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Samsung 在 2026 及 2025 兩個會計年度各佔 Qorvo 總營收的 10%。（以原文為準）

“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”

— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗

在 2025 會計年度，來自 Samsung 的收入佔 Qualcomm 合併營收 10%以上。（以原文為準）

“For the fiscal years ended June 30, 2025, 2024 and 2023, the following customers each accounted for more than 10% of total revenues, primarily in the Semiconductor Process Control segment: Fiscal Year Ended June 30, 2025 2024 2023 Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co., Ltd.”

— KLAC 10-K，申報於 2025-08-08 EDGAR · 查看原始申報文件 ↗

未在申報方最新年報（2026-08-06 申報之 Form 10-K）中再次確認：該年報未再提及

KLA 將 Samsung 列為佔其總營收 10% 以上之客戶（如原文表格所示），且該營收主要來自半導體製程控制部門。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 已與 Samsung 等主要 OEM 建立直接關係，並透過經銷商及 ODM 為其服務。（以原文為準）

“Our most significant customers during the fiscal years ending June 28, 2026, June 29, 2025, and June 30, 2024 included Micron Technology, Inc., Samsung Electronics Company, Ltd., SK hynix Inc., and Taiwan Semiconductor Manufacturing Company.”

— LRCX 10-K，申報於 2026-08-07 EDGAR · 查看原始申報文件 ↗

Lam Research 將 Samsung 列為其 2024、2025 及 2026 會計年度的最重要客戶之一。（以原文為準）

“なお、主な相手先別の販売実績及び当該販売実績の総販売実績に対する割合は以下のとおりであります。 … Samsung Electronics Co., Ltd. 368,079 15.1”

— Tokyo Electron Limited Annual securities report，申報於 2026-03-31 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

Tokyo Electron 將 Samsung 列為主要客戶，對其銷售額如原文表格所示佔總銷售實績 15.1%。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Samsung。（以原文為準）

“The following customers represented 10% or more of our quarterly revenues for the quarters indicated: … Samsung Electronics Co., Ltd. * * * * * * * 12.4 % 19.2 % 24.5 % 47.8 % 35.3 % 22.0 % 35.2 % 36.2 % 43.6 %”

— FORM 10-K，申報於 2026-02-20 EDGAR · 查看原始申報文件 ↗

Samsung 在數個季度中佔 FormFactor 季度營收的 10% 以上，如原文表格所示。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

NXP 的十大終端客戶之一為 Samsung。（以原文為準）

“Our memory interface chips are sold to major DRAM manufacturers, Micron, Samsung and SK hynix”

— RMBS 10-K，申報於 2026-02-18 EDGAR · 查看原始申報文件 ↗

Rambus 將 Samsung 列為其記憶體介面晶片的主要銷售對象之一。（以原文為準）

“Skyworks Solutions, Inc. (Nasdaq: SWKS), a leading developer, manufacturer and provider of analog and mixed-signal semiconductors and solutions for numerous applications, today reported first fiscal quarter results for the period ended Jan. 2, 2026. … • Strengthened our 5G position in premium Android smartphones, including Samsung’s Galaxy S26 and others”

— SWKS 8-K，申報於 2026-02-03 EDGAR · 查看原始申報文件 ↗

Skyworks 將 Samsung 列為其在 premium Android 智慧型手機（包括 Samsung 的 Galaxy S26 等）中強化 5G 地位的客戶。（以原文為準）

“2025 waren unsere drei größten Kunden, in alphabetischer Reihenfolge, Intel Corporation, Samsung Electronics und Taiwan Semiconductor Manufacturing Company (TSMC).”

— Siltronic AG Annual report (Geschäftsbericht)，申報於 2025-12-31 (德國法定年度報告；引文為德文原文) · 查看原始申報文件 ↗

Siltronic 將 Samsung 列為 2025 年三大客戶之一。（以原文為準）

“当連結会計年度及び前連結会計年度における主な相手先別の販売実績及び当該販売実績の総販売実績に対する 割合は次のとおりであります。 … Samsung Electronics Co., Ltd.”

— Lasertec Corporation Annual securities report，申報於 2025-06-30 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

Lasertec 將 Samsung 列為主要客戶，揭露其銷售實績及佔總銷售實績之比例。（以原文為準）

“当連結会計年度において、外部顧客への売上高のうち連結損益計算書の売上高の10％以上を占める顧客 グループはTaiwan Semiconductor Manufacturing Co., Ltd.およびSamsungグループであり、関連するセ グメントは、それぞれ主に半導体・部品テストシステム事業、半導体・部品テストシステム事業およびメ カトロニクス関連事業であります。”

— Advantest Corporation Annual securities report，申報於 2025-03-31 EDINET (日本法定有價證券報告書；引文為日文原文) · 查看原始申報文件 ↗

未在申報方最新年報（FY2026-03）中再次確認：低於 10% 揭露門檻

Advantest 將 Samsung 集團列為佔其合併收入 10% 以上之主要客戶，相關業務包括半導體及零件測試系統事業與機電相關事業。（以原文為準）

“Through strategic alliances with UMC, Samsung, Intel, and our newly formalized partnership with GlobalFoundries”

— Faraday Technology Annual report，申報於 2026-05-25 TWSE (中文正本之英文譯本) · 查看原始申報文件 ↗

Faraday Technology 與 Samsung 存在策略聯盟關係。（以原文為準）

“These engagements build upon the previously announced partnership with Samsung Electronics.”

— AMAT 8-K，申報於 2026-05-14 EDGAR · 查看原始申報文件 ↗

Applied Materials 表示這些合作建立在先前宣布與 Samsung Electronics 的夥伴關係之上。（以原文為準）

“We have entered into patent cross-licenses with a number of other leading advanced semiconductor companies, including AMD, Samsung, TSMC and IBM.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 簽訂了專利交叉授權協議。（以原文為準）

“Announced that NVIDIA is working with the South Korea government and industrial leaders, including Hyundai Motor Group, Samsung Electronics, SK Group and NAVER Cloud, to expand the nation’s AI infrastructure with over a quarter-million NVIDIA GPUs.”

— NVDA 8-K，申報於 2025-11-19 EDGAR · 查看原始申報文件 ↗

NVIDIA 宣布與 Samsung 等南韓產業領袖合作，以超過 25 萬顆 NVIDIA GPU 擴充該國 AI 基礎設施。（以原文為準）

“Additionally, highly strategic partnerships include major advanced node foundries – TSMC and Samsung and major OSATs – ASE, Amkor, Kyocera, JCET and SPIL. … Strengthened relationship with Samsung Foundry, with an expanded agreement encompassing leading-edge IP for PCIe 7.0,112G and 224G Ethernet and the UCIe die-to-die interconnect standard for AI andHPC systems.”

— Alphawave IP Group plc Annual report (ESEF)，申報於 2024-12-31 UKSEF · 查看原始申報文件 ↗

Alphawave 將 Samsung 列為高度策略合作夥伴，並加強與 Samsung Foundry 的關係，擴大涵蓋 PCIe 7.0、112G 與 224G 乙太網路及 UCIe 等領先 IP 的協議。（以原文為準）

“Our major competitors in the DRAM market include Samsung Electronics Co., Ltd. (“Samsung Electronics”), Micron Technology, Inc. (“Micron Technology”) and ChangXin Memory Technologies (“CXMT”).”

— SKHY F-1/A，申報於 2026-07-06 EDGAR · 查看原始申報文件 ↗

SK Hynix 將 Samsung 列為 DRAM 市場之主要競爭對手。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 與 Samsung 等 IDM 的晶圓代工服務競爭。（以原文為準）

“Our current competitors include: … • suppliers of hardware and software for SoC products that are used in servers or embedded into automobiles, autonomous machines, and gaming devices, such as Ambarella, Inc., AMD, Broadcom, Intel, Qualcomm Incorporated, Renesas Electronics Corporation, and Samsung, or companies with internal teams designing SoC products for their own products and services, such as Tesla, Inc.; and”

— NVDA 10-K，申報於 2026-02-25 EDGAR · 查看原始申報文件 ↗

NVIDIA 將 Samsung 列為其 SoC 產品領域的現有競爭者之一。（以原文為準）

“Competitors for certain of ISG's products and solutions include: Sony Semiconductor Manufacturing Corporation, Samsung Electronics Co., Ltd., and Omnivision Technologies Inc.”

— ON 10-K，申報於 2026-02-09 EDGAR · 查看原始申報文件 ↗

Samsung 是 onsemi 部分產品與解決方案的競爭對手之一。（以原文為準）

“As we pursue our strategy to establish Intel Foundry as a major provider of foundry capacity to manufacture semiconductors for others, we face intense competition from well-established competitors such as TSMC, Samsung, Global Foundries, UMC and SMIC.”

— INTC 10-K，申報於 2026-01-23 EDGAR · 查看原始申報文件 ↗

Intel 將 Samsung 列為晶圓代工領域的競爭對手。（以原文為準）

“Companies that provide on-device AI, high-performance and low-power computing and wireless connectivity-based integrated circuit products and/or software are generally competitors or potential competitors. … Examples (some of which are strategic partners of ours in other areas) include Broadcom, HiSilicon, MediaTek, Mobileye, Nvidia, NXP Semiconductors, Qorvo, Samsung, Skyworks, Texas Instruments and UNISOC.”

— QCOM 10-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗

Qualcomm 將 Samsung 列為其競爭對手或潛在競爭對手之一。（以原文為準）

“We face intense competition in the semiconductor memory and storage markets from a number of companies, including Samsung Electronics Co., Ltd.; SK hynix Inc.; Kioxia Holdings Corporation; Sandisk Corporation; ChangXin Memory Technologies, Inc. (“CXMT”); and Yangtze Memory Technologies Co., Ltd. (“YMTC”).”

— MU 10-K，申報於 2025-10-03 EDGAR · 查看原始申報文件 ↗

Micron 在半導體記憶體與儲存市場面臨來自 Samsung 等公司的激烈競爭。（以原文為準）