類比與電源半導體 — 供應鏈地圖

“In 2025, 2024 and 2023, the Company’s largest customer, Apple, represented 17.7 %, 14.5 % and 12.3 % of consolidated net revenues”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

Apple 為 STMicroelectronics 之最大客戶，於 2025、2024 及 2023 年分別佔合併淨營收 17.7%、14.5% 及 12.3%。（以原文為準）

“We also have a strong position with our distribution partners, including our five largest in alphabetical order, Arrow, Avnet, Nexty, WT Micro and World Peace. … Avnet accounted for 23% of our revenue in 2025 and 22% in 2024.”

— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

Avnet 在 2025 年及 2024 年分別佔 NXP 營收之 23% 及 22%。（以原文為準）

“Furthermore, NXP has an agreed purchase commitment with VSMC that over the lifetime of the factory the minimal loading will be between 80% - 90%, resulting in a total purchase commitment of approximately $14,096 million that is expected to be purchased over 37 years once wafer production starts.”

— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

NXP 與 VSMC 有約定採購承諾，在晶圓廠生命週期內最低產能利用率為 80%–90%，總採購承諾約 140.96 億美元，預計於晶圓生產開始後 37 年內完成。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 EDGAR · 查看原始申報文件 ↗

Avnet 在 2025、2024 及 2023 年分別佔 Power Integrations 淨營收的 32%、30% 及 27%。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 EDGAR · 查看原始申報文件 ↗

Salcomp Group 在 2023 年和 2025 年分別佔 Power Integrations 淨營收的 10% 和 11%。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 EDGAR · 查看原始申報文件 ↗

Honestar Technologies 是 Power Integrations 的客戶，在 2023 及 2024 年度各佔其淨營收 18% 及 11%。（以原文為準）

“In July 2023, the Company entered into the CRD Agreement with a customer, pursuant to which the customer agreed to provide the Company up to $ 2.0 billion in unsecured deposits. … with the potential for an increased variable rate of either 10 % or 15 % in connection with any inability of the Company to satisfy supply targets under a ten-year wafer supply agreement with the same customer. … Unsecured Customer Refundable Deposit Agreement, dated as of July 5, 2023, between Wolfspeed, Inc. and Renesas Electronics America Inc.”

— WOLF 10-K，申報於 2025-08-26 EDGAR · 查看原始申報文件 ↗

Renesas 同意向 Wolfspeed 提供最高 20 億美元的無擔保可退還存款，與一份十年晶圓供應協議相關。（以原文為準）

“Sales to WPG and Promate accounted for 53.0% and 19.3% of our revenue, respectively, for the fiscal year ended June 30, 2026”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

“Sales to WPG and Promate accounted for 53.0% and 19.3% of our revenue, respectively, for the fiscal year ended June 30, 2026”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 透過經銷商和 ODM 服務 Dell 等主要 OEM。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 已與 Hewlett Packard 等主要 OEM 建立直接關係，但多數透過經銷商和 ODM 服務 Hewlett Packard。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 已與 Samsung 等主要 OEM 建立直接關係，並透過經銷商及 ODM 為其服務。（以原文為準）

“We have established direct relationships with key OEMs, including Dell Inc., Hewlett-Packard Company, Samsung Group, and Stanley Black & Decker, Inc., most of whom we serve through our distributors and ODMs.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 與 Stanley Black Decker 有直接合作關係，但主要透過經銷商和 ODM 服務。（以原文為準）

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的 ODM 客戶包括 Compal Electronics 等公司。（以原文為準）

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的 ODM 客戶包括 Foxconn。（以原文為準）

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的 ODM 客戶包括 Quanta Computer 等公司。（以原文為準）

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的 ODM 客戶包括 Wistron 等公司。（以原文為準）

“Our ODM customers include Compal Electronics, Inc., Foxconn, Quanta Computer Incorporated, Wistron Corporation and Delta Electronics.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的 ODM 客戶包括 Delta Electronics。（以原文為準）

“Foundry Agreement dated as of January 10, 2002 between the Registrant and Shanghai Hua Hong NEC Electronics Company, Limited … Foundry Service Agreement dated as of November 2, 2009 between Alpha & Omega Semiconductor (Macau), Ltd. and Shanghai Hua Hong NEC Electronics Company, Limited”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

“The Company is amortizing intangible assets of patents and technology rights related to a license agreement with STMicroelectronics International N.V.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 正在攤銷一項與 STMicroelectronics 簽訂之授權合約相關的專利及技術權利無形資產。（以原文為準）

“Secured strategic AI data center platform wins with Great Wall, a leading China cloud infrastructure power supplier, expanding EliteSiC and silicon MOSFETs and controller content”

— ON 8-K，申報於 2026-08-03 EDGAR · 查看原始申報文件 ↗

onsemi 獲得 Great Wall 的策略性 AI 資料中心平台採用，擴大 EliteSiC 及矽 MOSFET 與控制器的搭載內容。（以原文為準）

“Extended leadership in automotive zonal architecture and on-board charging with Rivian’s R2 platform with power solutions that enable efficient power distribution and conversion”

— ON 8-K，申報於 2026-08-03 EDGAR · 查看原始申報文件 ↗

onsemi 透過為 Rivian 的 R2 平台提供電源解決方案，延伸在汽車區域架構與車載充電之領導地位。（以原文為準）

“Some of our products are manufactured at SMIC”

— MCHP 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Microchip Technology 的部分產品由 SMIC 製造。（以原文為準）

“With the exception of Arrow Electronics, our largest distributor, which made up 12% and 10% of our net sales, in fiscal 2026 and in fiscal 2025, respectively, no distributor or direct customer accounted for more than 10% of our net sales.”

— MCHP 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Arrow 是 Microchip Technology 最大的經銷商，分別佔其 2026 及 2025 會計年度淨銷售額的 12% 與 10%。（以原文為準）

“Announced new design win with Sineng Electric to power its 430kW liquid-cooled energy storage systems and 320 kW solar inverter”

— ON 8-K，申報於 2026-05-04 EDGAR · 查看原始申報文件 ↗

onsemi 宣布取得 Sineng Electric 新設計案，為其 430 kW 液冷儲能系統及 320 kW 太陽能逆變器供電。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 EDGAR · 查看原始申報文件 ↗

Texas Instruments 是 UMC 的主要客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 將 Bosch 列為主要客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Continental。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Denso 等公司。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 將 HP 列為主要客戶之一。（以原文為準）

“the new 200mm SiC device manufacturing joint venture with Sanan Optoelectronics in Chongqing, China, as we announced on June 7 2023”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 與 Sanan Optoelectronics 在中國重慶合資成立新的 200mm SiC 元件製造合資企業。（以原文為準）

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K，申報於 2026-02-19 EDGAR · 查看原始申報文件 ↗

NXP 與 TSMC 共同持有合資公司 SSMC。（以原文為準）

“our assembly and test operations facility located in Leshan, China, which is owned by Leshan-Phoenix Semiconductor Company Limited, a joint venture company in which we own 80% of the outstanding equity interests ("Leshan"). The financial and operating results of Leshan have been consolidated in our financial statements. Our joint venture partner is Leshan Radio Company Ltd.”

— ON 10-K，申報於 2026-02-09 EDGAR · 查看原始申報文件 ↗

onsemi 持有 Leshan-Phoenix Semiconductor 80% 股權，其合資夥伴為 Leshan Radio。（以原文為準）

“On June 12, 2025, NXP and Rimac Technology announced the co-development of a software defined vehicle (SDV) architecture for advanced automotive domain and zonal control.”

— NXPI 8-K，申報於 2025-07-22 EDGAR · 查看原始申報文件 ↗

NXP 與 Rimac Technology 宣布共同開發軟體定義車輛架構，用於先進汽車領域和區域控制。（以原文為準）

“Continued strength in companion chip momentum with announced partnerships with ASPEED BMC at Computex, and Texas Instruments Radar Sensor demonstrated at NVIDIA GTC.”

— LSCC 8-K，申報於 2026-08-04 EDGAR · 查看原始申報文件 ↗

Lattice 在 NVIDIA GTC 展示與 Texas Instruments 合作的雷達感測器解決方案。（以原文為準）

“expanded collaborations with Geely and NIO”

— ON 8-K，申報於 2026-05-04 EDGAR · 查看原始申報文件 ↗

onsemi 擴大了與 Geely 的合作。（以原文為準）

“expanded collaborations with Geely and NIO”

— ON 8-K，申報於 2026-05-04 EDGAR · 查看原始申報文件 ↗

onsemi 擴大了與 NIO 的合作。（以原文為準）

“On January 6, 2026, NXP and GE HealthCare announced a collaboration to pioneer new advancements in edge AI innovation leveraging NXP’s long history in secure, high-performance edge processing;”

— NXPI 8-K，申報於 2026-04-28 EDGAR · 查看原始申報文件 ↗

NXP 宣布與 GE HealthCare 合作，開創邊緣 AI 創新。（以原文為準）

“On March 16, 2026, NXP announced innovative robotics solutions developed in collaboration with NVIDIA for reliable, secure, real-time data processing and transport and advanced networking, enabling sensor fusion.”

— NXPI 8-K，申報於 2026-04-28 EDGAR · 查看原始申報文件 ↗

NXP 宣布與 NVIDIA 合作開發的創新機器人解決方案，實現可靠、安全、即時的資料處理與傳輸。（以原文為準）

“we entered into a broad patent cross-license with Infineon Technologies AG.”

— NVTS 10-K，申報於 2026-02-27 EDGAR · 查看原始申報文件 ↗

Navitas 與 Infineon 簽訂了廣泛的專利交叉授權協議。（以原文為準）

“we announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories, to enable new high performance compute infrastructure for cloud and AI data centers.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 宣布與 AWS 擴大策略合作，透過一項多年、數十億美元的商業合作涵蓋多個產品類別。（以原文為準）

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

Qualcomm 與 STMicroelectronics 於 2024 年宣布合作推出首款產品，旨在簡化搭載 STM32 MCU 的系統中無線連接的實現。（以原文為準）

“The joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

GlobalFoundries 與 STMicroelectronics 在法國 Crolles 共同經營一座 300mm 半導體製造設施。（以原文為準）

“On March 31, we announced the signature of an agreement on GaN technology development and manufacturing with Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing.”

— STM 20-F，申報於 2026-02-26 EDGAR · 查看原始申報文件 ↗

STMicroelectronics 與 Innoscience 簽署了 GaN 技術開發與製造協議。（以原文為準）

“Signed a memorandum of understanding (MoU) with Innoscience to explore expanding production of gallium nitride (GaN) power devices using Innoscience’s proven 200mm GaN-on-silicon process.”

— ON 8-K，申報於 2026-02-09 EDGAR · 查看原始申報文件 ↗

onsemi 與 Innoscience 簽署備忘錄，探討利用 Innoscience 的 200mm GaN-on-silicon 製程擴大氮化鎵功率元件生產。（以原文為準）

“Established a new collaboration agreement with GlobalFoundries (GF) to develop and manufacture next-generation gallium nitride (GaN) power devices, beginning with 650V.”

— ON 8-K，申報於 2026-02-09 EDGAR · 查看原始申報文件 ↗

onsemi 與 GlobalFoundries 簽訂新合作協議，共同開發及製造 650V 氮化鎵功率元件。（以原文為準）

“Last month we detailed the capabilities of our 1250- and 1700-volt PowiGaN TM technologies for next-gen AI data centers, including our collaboration with NVIDIA on 800 VDC power architecture.”

— POWI 8-K，申報於 2025-11-05 EDGAR · 查看原始申報文件 ↗

Power Integrations 說明其與 NVIDIA 在 800 VDC 電源架構上之合作。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Infineon 是 Alpha & Omega 在功率離散元件領域的主要競爭者之一。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

onsemi 是 Alpha & Omega 在功率離散元件領域的主要競爭對手之一。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 在功率離散元件領域的主要競爭對手包括 STMicroelectronics 等公司。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 在功率離散元件領域的主要競爭對手包括 Toshiba 等公司。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Diodes 是 Alpha & Omega 在功率離散元件市場的主要競爭者之一。（以原文為準）

“Our major competitors in power discretes include Infineon Technologies AG, ON Semiconductor Corp., STMicroelectronics N.V., Toshiba Corporation, Diodes Incorporated and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

在功率離散元件領域，Alpha & Omega 的主要競爭對手包括 Vishay。（以原文為準）

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Monolithic Power Systems, Inc. 是 Alpha & Omega 在電源 IC 領域的主要競爭對手之一。（以原文為準）

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 在電源 IC 領域的主要競爭者包括 Richtek Technology。（以原文為準）

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 的電源 IC 主要競爭對手包括 Semtech 等公司。（以原文為準）

“Our major competitors for our power ICs include Monolithic Power Systems, Inc., ON Semiconductor Corp., Richtek Technology Corp., Semtech Corporation, Texas Instruments Inc. and Vishay Intertechnology, Inc.”

— AOSL 10-K，申報於 2026-08-27 EDGAR · 查看原始申報文件 ↗

Alpha & Omega 將 Texas Instruments 列為其電源 IC 主要競爭對手之一。（以原文為準）

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K，申報於 2026-08-20 EDGAR · 查看原始申報文件 ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K，申報於 2026-08-20 EDGAR · 查看原始申報文件 ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K，申報於 2026-08-20 EDGAR · 查看原始申報文件 ↗

“Our silicon carbide power devices compete with silicon carbide power semiconductor solutions offered by companies like Infineon Technologies AG, ON Semiconductor Corporation, Rohm Co. Ltd., ST Microelectronics N.V., Robert Bosch GmbH, and Silan Microelectronics Co. Ltd.”

— WOLF 10-K，申報於 2026-08-20 EDGAR · 查看原始申報文件 ↗

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Cirrus Logic 將 Analog Devices 列為其主要競爭對手之一。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Cirrus Logic 的主要競爭對手包括 Renesas。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Cirrus Logic 的主要競爭對手包括 STMicroelectronics。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 EDGAR · 查看原始申報文件 ↗

Texas Instruments 是 Cirrus Logic 的主要競爭者之一。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Analog Devices 等公司競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 的 HPA 部門主要與 Monolithic Power 等公司競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Renesas Electronics Corporation 競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Texas Instruments 等公司競爭。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 EDGAR · 查看原始申報文件 ↗

Qorvo 將 NXP 列為其主要競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

Marvell 將 Microchip Technology 列為其業務之直接競爭者。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K，申報於 2026-03-11 EDGAR · 查看原始申報文件 ↗

NXP 是 Marvell 的直接競爭對手之一。（以原文為準）