類比與電源半導體 — 供應鏈地圖

“In 2025, 2024 and 2023, the Company’s largest customer, Apple, represented 17.7 %, 14.5 % and 12.3 % of consolidated net revenues”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

Apple 為 STMicroelectronics 之最大客戶，於 2025、2024 及 2023 年分別佔合併淨營收 17.7%、14.5% 及 12.3%。（以原文為準）

“We also have a strong position with our distribution partners, including our five largest in alphabetical order, Arrow, Avnet, Nexty, WT Micro and World Peace. … Avnet accounted for 23% of our revenue in 2025 and 22% in 2024.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Avnet 在 2025 年及 2024 年分別佔 NXP 營收之 23% 及 22%。（以原文為準）

“Furthermore, NXP has an agreed purchase commitment with VSMC that over the lifetime of the factory the minimal loading will be between 80% - 90%, resulting in a total purchase commitment of approximately $14,096 million that is expected to be purchased over 37 years once wafer production starts.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 與 VSMC 有約定採購承諾，在晶圓廠生命週期內最低產能利用率為 80%–90%，總採購承諾約 140.96 億美元，預計於晶圓生產開始後 37 年內完成。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 · 查看原始申報文件 ↗

Avnet 在 2025、2024 及 2023 年分別佔 Power Integrations 淨營收的 32%、30% 及 27%。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 · 查看原始申報文件 ↗

Salcomp Group 在 2023 年和 2025 年分別佔 Power Integrations 淨營收的 10% 和 11%。（以原文為準）

“The following customers represented 10% or more of our net revenue for the respective years: ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Customer ​ ​ ​ 2025 ​ 2024 ​ 2023 Avnet 32 % ​ 30 % ​ 27 % Salcomp Group 11 % ​ * ​ ​ 10 % Honestar Technologies Co., Ltd. ​ * ​ ​ 11 % ​ 18 %”

— POWI 10-K，申報於 2026-02-06 · 查看原始申報文件 ↗

Honestar Technologies 是 Power Integrations 的客戶，在 2023 及 2024 年度各佔其淨營收 18% 及 11%。（以原文為準）

“In July 2023, the Company entered into the CRD Agreement with a customer, pursuant to which the customer agreed to provide the Company up to $2.0 billion in unsecured deposits. … with the potential for an increased variable rate of either 10% or 15% in connection with any inability of the Company to satisfy supply targets under a ten-year wafer supply agreement with the same customer. … Unsecured Customer Refundable Deposit Agreement, dated as of July 5, 2023, between Wolfspeed, Inc. and Renesas Electronics America Inc.”

— WOLF 10-K，申報於 2025-08-26 · 查看原始申報文件 ↗

Renesas 同意向 Wolfspeed 提供最高 20 億美元的無擔保可退還存款，與一份十年晶圓供應協議相關。（以原文為準）

“Some of our products are manufactured at SMIC”

— MCHP 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Microchip Technology 的部分產品由 SMIC 製造。（以原文為準）

“With the exception of Arrow Electronics, our largest distributor, which made up 12% and 10% of our net sales, in fiscal 2026 and in fiscal 2025, respectively, no distributor or direct customer accounted for more than 10% of our net sales.”

— MCHP 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Arrow 是 Microchip Technology 最大的經銷商，分別佔其 2026 及 2025 會計年度淨銷售額的 12% 與 10%。（以原文為準）

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

— UMC 20-F，申報於 2026-04-30 · 查看原始申報文件 ↗

Texas Instruments 是 UMC 的主要客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 將 Bosch 列為主要客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Continental。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Denso 等公司。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 HP。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Mobileye。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Samsung。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 的主要客戶包括 Spacex。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 將 Tesla 列為其主要客戶之一。（以原文為準）

“Our major customers include (in alphabetical order) Apple, Bosch, Continental, Denso, HP, Mobileye, Samsung, SpaceX, Tesla and Vitesco.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 將 Vitesco 列為其主要客戶之一。（以原文為準）

“On February 6, 2026, the Company issued warrants to Amazon Web Services ("AWS") for the acquisition of up to 24.8 million ordinary shares of the Company. The warrants will vest in tranches over the term of the agreement, with vesting substantially tied to payments for the Company's products and services purchased by AWS and its affiliates.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 向 AWS 發行認股權證，可取得最多 2480 萬股普通股。（以原文為準）

“Sales to Arrow Electronics, Inc., which were reported in our Electronics, Transportation, and Industrial segments, were 9.5%, 9.4%, and 11.2% of consolidated net sales in 2025, 2024, and 2023, respectively.”

— LFUS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Littelfuse 對 Arrow 的銷售額在 2025、2024、2023 年分別佔合併淨銷售額的 9.5%、9.4%、11.2%。（以原文為準）

“Powersem GmbH: The Company owns 45 % of the outstanding equity of Powersem GmbH (“Powersem”), a module manufacturer based in Germany. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Littelfuse 持有 Powersem 45% 之已發行股權，且兩公司間有銷售及採購交易，金額如原文表格所示。（以原文為準）

“EB-Tech Co., Ltd.: The Company owns approximately 15 % of the outstanding equity of EB-Tech Co., Ltd. (“EB Tech”), a company with expertise in radiation technology based in South Korea. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Littelfuse 持有 Eb Tech 約 15% 的股權，且雙方有關聯方交易，金額如原文表格所示。（以原文為準）

“Automated Technology (Phil), Inc. : The Company owns approximately 24 % of the outstanding common shares of Automated Technology (Phil), Inc. (“ATEC”), a supplier located in the Philippines that provides assembly and test services. … Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Littelfuse 持有 Automated Technology Phil 約 24% 的普通股，且雙方有銷售及採購交易，如原文表格所示。（以原文為準）

“Fiscal Year Ended December 27, 2025 December 28, 2024 (in millions) Powersem EB Tech ATEC Powersem EB Tech ATEC Sales to related party $ 1.2 $ — $ — $ 1.5 $ — $ — Purchase of material/services from related party 2.2 0.9 9.0 3.8 0.7 5.7 Accounts payable balance $ 0.1 $ 0.1 $ 2.1 $ 0.7 $ 0.1 $ 0.7”

— LFUS 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

如原文表格所示，Littelfuse與Powersem之間有關係人交易，包括銷售、採購及應付帳款。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Apple 是 NXP 的十大終端客戶之一，部分透過經銷商供貨。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

Aptiv 是 NXP 的十大終端客戶之一（按字母順序排列），部分透過經銷商供貨。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的十大終端客戶（按字母順序）包括 Aumovio。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的前十大終端客戶包括 Bosch。（以原文為準）

“Our 10 largest end customers, some of whom are supplied by distributors, in alphabetical order, are Apple, Aptiv, Aumovio, Bosch, Denso, Harman Auto, Hyundai, LGE Automotive, Samsung and Visteon.”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 的十大終端客戶（部分經由經銷商供貨）包括 Denso。（以原文為準）

“the new 200mm SiC device manufacturing joint venture with Sanan Optoelectronics in Chongqing, China, as we announced on June 7 2023”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 與 Sanan Optoelectronics 在中國重慶合資成立新的 200mm SiC 元件製造合資企業。（以原文為準）

“SSMC, our consolidated joint venture company with TSMC”

— NXPI 10-K，申報於 2026-02-19 · 查看原始申報文件 ↗

NXP 與 TSMC 共同持有合資公司 SSMC。（以原文為準）

“Our assembly and test operations facility located in Leshan, China, which is owned by Leshan-Phoenix Semiconductor Company Limited, a joint venture company in which we own 80% of the outstanding equity interests ("Leshan"). The financial and operating results of Leshan have been consolidated in our financial statements. Our joint venture partner is Leshan Radio Company Ltd.”

— ON 10-K，申報於 2026-02-09 · 查看原始申報文件 ↗

onsemi 持有 Leshan-Phoenix Semiconductor 80% 股權，其合資夥伴為 Leshan Radio。（以原文為準）

“we entered into a broad patent cross-license with Infineon Technologies AG.”

— NVTS 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Navitas 與 Infineon 簽訂了廣泛的專利交叉授權協議。（以原文為準）

“We announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories, to enable new high performance compute infrastructure for cloud and AI data centers.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 宣布與 AWS 擴大策略合作，透過一項多年、數十億美元的商業合作涵蓋多個產品類別。（以原文為準）

“first product of ST’s collaboration with Qualcomm Technologies, Inc. announced in 2024, to simplify implementing wireless connectivity in systems containing STM32 MCUs.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

Qualcomm與STMicroelectronics於2024年宣布合作推出首款產品，旨在簡化搭載STM32 MCU的系統中無線連接的實現。（以原文為準）

“the joint 300mm semiconductor manufacturing facility with GlobalFoundries Inc in Crolles, France”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

GlobalFoundries 與 STMicroelectronics 在法國 Crolles 共同經營一座 300mm 半導體製造設施。（以原文為準）

“On March 31, we announced the signature of an agreement on GaN technology development and manufacturing with Innoscience, the world leader in 8” GaN-on-Si (gallium nitride on silicon) high-performance low-cost manufacturing.”

— STM 20-F，申報於 2026-02-26 · 查看原始申報文件 ↗

STMicroelectronics 與 Innoscience 簽署了 GaN 技術開發與製造協議。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 將 Analog Devices 列為其主要競爭對手之一。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic 的主要競爭對手包括 Renesas。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Cirrus Logic的主要競爭對手包括STMicroelectronics。（以原文為準）

“Our primary competitors include, but are not limited to, AKM Semiconductor Inc., Analog Devices Inc., QUALCOMM Incorporated, Realtek Semiconductor Corporation, Renesas Electronics Corporation, Shanghai Awinic Technology Co., Ltd., … Shenzhen Goodix Technology Co, Ltd., Skyworks Solutions Inc., ST Microelectronics N.V., Synaptics Incorporated and Texas Instruments, Inc.”

— CRUS 10-K，申報於 2026-05-21 · 查看原始申報文件 ↗

Texas Instruments 是 Cirrus Logic 的主要競爭者之一。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Analog Devices 等公司競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 HPA 部門主要與 Monolithic Power 等公司競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Renesas Electronics Corporation 競爭。（以原文為準）

“HPA competes primarily with Analog Devices, Inc.; Axiro Semiconductor Private Limited; MACOM Technology Solutions Holdings, Inc.; Monolithic Power Systems, Inc.; Renesas Electronics Corporation; Scientific Components Corporation (d/b/a Mini-Circuits); Silergy Corp; and Texas Instruments, Inc.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 的 HPA 業務主要與 Texas Instruments 等公司競爭。（以原文為準）

“CSG competes primarily with Broadcom Inc.; Murata Manufacturing Co., Ltd.; Nordic Semiconductor; NXP Semiconductors N.V.; Qualcomm Technologies, Inc.; RichWave Technology Corporation; Silicon Laboratories Inc.; Skyworks Solutions, Inc.; and Vanchip (Tianjin) Technology Co., Ltd.”

— QRVO 10-K，申報於 2026-05-08 · 查看原始申報文件 ↗

Qorvo 將 NXP 列為其主要競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Microchip Technology Inc.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Microchip Technology 列為其業務之直接競爭者。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … NXP Semiconductors N.V.”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

NXP是Marvell的直接競爭對手之一。（以原文為準）

“Companies that compete directly with our businesses include, but are not limited to, … Semtech Corporation”

— MRVL 10-K，申報於 2026-03-11 · 查看原始申報文件 ↗

Marvell 將 Semtech 列為其業務的直接競爭者之一。（以原文為準）

“We also compete with the foundry operation services of some IDMs, such as Texas Instruments, Inc. (“Texas Instruments”), Samsung Electronics Co., Ltd. (“Samsung”) and, more recently, Intel.”

— GFS 20-F，申報於 2026-02-27 · 查看原始申報文件 ↗

GlobalFoundries 也與 Texas Instruments 等 IDM 的晶圓代工服務競爭。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Analog Devices 與 Monolithic Power 在多個產品線上是直接且活躍的競爭對手。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Infineon是Monolithic Power的主要競爭對手之一。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 的主要競爭者包括 NXP。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 在部分產品線上與 onsemi 等公司直接競爭。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 與 Power Integrations 互為主要競爭者。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 將 Renesas 列為其主要競爭對手之一。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 將 ROHM 列為其主要競爭對手之一。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 將 Semtech 列為其主要競爭對手之一。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 將 STMicroelectronics 列為其主要競爭對手之一。（以原文為準）

“We are in direct and active competition, with respect to one or more of our product lines, with several manufacturers of such products. We consider our primary competitors to include Analog Devices, Infineon Technologies, NXP Semiconductors, ON Semiconductor, Power Integrations, Renesas Electronics, ROHM Semiconductor, Semtech, STMicroelectronics and Texas Instruments.”

— MPWR 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Monolithic Power 將 Texas Instruments 視為其主要競爭對手之一。（以原文為準）

“Our primary GaN competitors include Infineon Technologies AG, Power Integrations, Inc., Texas Instruments Incorporated, Innoscience (Suzhou) Semiconductor Co., Ltd., Renesas Electronics Corp., and Efficient Power Conversion Corporation (EPC).”

— NVTS 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Navitas 的主要 GaN 競爭對手包括 Infineon 等公司。（以原文為準）

“Our primary GaN competitors include Infineon Technologies AG, Power Integrations, Inc., Texas Instruments Incorporated, Innoscience (Suzhou) Semiconductor Co., Ltd., Renesas Electronics Corp., and Efficient Power Conversion Corporation (EPC).”

— NVTS 10-K，申報於 2026-02-27 · 查看原始申報文件 ↗

Navitas 將 Power Integrations 列為其主要的 GaN 競爭對手之一。（以原文為準）